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A
SPECIFICATIONS
Voltage rating:
Current rating:
Contact material:
Contact plating:
B
C
250VAC/VDC
1.0 amp max., 30°C max. in temperature rise
Phosphor bronze or brass
Gold on contact area, 100µ” min. tin only (shine or
matte) on solder tail over 30µ” min. nickel
Housing material: Thermoplastic, UL94V-0
Ejector material: Thermoplastic, UL94V-0, ivory, black or natural color
Board lock:
Steel (K7)
Board lock plating: 100µ” min. tin only (shine or matte) over 30µ” min. nickel
Withstanding:
500VAC at sea level
Insulation resist.: 1,000 megohms min. initial
Low level cont. res.: 30 milliohms max. initial
Contact ret. force: 0.75lbs (0.34kgf) min. per contact
Durability:
25 cycles
Dram bd. ins. force: 3oz max. per contact
Operating temp.: -55°C to +105°C
A
B
C
D
Recommended PC Board Layout
D
Recommended Module Layout
E
F
RoHS compliant
Rev.
Description
Series
Style
Contacts Voltage Contact Material Tail Length Board Lock Lng.
Color
Plating
DIMM
111
240
2
X
AX
BX
XX
SGXXY
DDR II
111 style 240 contacts 2=1.8V P=Phosphor bronze A1=2.65mm B1=3.38mm
BK=Black YL=Yellow Selective gold (SG)
connector
B=Brass
A2=3.15mm B2=3.78mm
RD=Red
BL=Blue XX=Flash if blank,
(B2 only)
OR=Orange WT=White 10, 15, 20, 30µ” gold
Tin Finish (Y)
M=Matte tin
B=Bright tin
Date
Approved
Drawing
Name
Approved Howard
Checked Lizzy
Drawn Tina
0.0 ± 0.35
Date
Central Components Manufacturing
08/10/99
440 Lincoln Blvd., Middlesex, New Jersey 08846
Phone 732 469-5720 888 288-5152 Fax 732 469-1919
08/10/99
08/10/99 Part No.:
DIMM-111-240-2-X-AX-BX-XX-SGXXY
Description: DDR II connector, 240 pins
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9
E
F
G
0.00 ± 0.20 Angles ± 3’
UNIT: mm
5
G
1
2
3
4
DSP and ARM Processors
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