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Datasheet> All Categories > Passive components> capacitor> 2221B334M251PHW-HB
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2221B334M251PHW-HB

Description
Ceramic Capacitor, Ceramic, 250V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.33uF, 2221,
CategoryPassive components    capacitor   
File Size1MB，10 Pages
ManufacturerKnowles
Websitehttp://www.knowles.com
Download Datasheet Parametric View All

2221B334M251PHW-HB Overview

Ceramic Capacitor, Ceramic, 250V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.33uF, 2221,

2221B334M251PHW-HB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid242711979
package instruction, 2221
Reach Compliance Codecompliant
Country Of OriginMainland China, USA
ECCN codeEAR99
YTEOL6.58
capacitance0.33 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2.03 mm
length5.59 mm
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingWaffle Pack
positive tolerance20%
Rated (DC) voltage (URdc)250 V
GuidelineMIL-PRF-55681
seriesSIZE(X7R)HIGH-REL
size code2221
Temperature characteristic codeX7R
Temperature Coefficient-/+15ppm/Cel ppm/°C
width5.33 mm

2221B334M251PHW-HB Preview

High Reliability Chip - X7R
16Vdc to 10kVdc
A range of MLC chip capacitors in Stable EIA Class II dielectric
with special testing for long term reliability. They are designed
for optimum reliability; burned in at elevated voltage and
temperature, and 100% physically and electrically inspected to
ascertain conformance to strict performance criteria. Units may
be tested in accordance with MIL-PRF-55681, MIL-PRF-123, MIL-
PRF-49467, or customer SCD.
Designed for surface mount application with nickel barrier
terminations making them suitable for solder wave and reflow
solder board attachment as well as vapor phase attachment for
part sizes 2225 or smaller. Silver-palladium terminations are also
available for hybrid use with conductive epoxy.
Class II X7R chips are used as decoupling, by-pass, filtering and
transient voltage suppression elements and exhibit +/-15%
temperature coefficient and predictable variation of electrical
properties with time, temperature and voltage.
They find application for High Reliability use such as medical
implanted devices, aerospace, airborne and military use as well
as consumer uses requiring safety margins not attainable with
commercial products.
Standard EIA case sizes and available C/V values are listed below
- special sizes, thicknesses and other voltage ratings are available;
please contact the sales office for information.
Capacitance and voltage selection for popular chip sizes
Size
Min cap.
Tmax
inches:
mm:
0402
121
0.024
0.61
0504
121
0.044
1.12
0603
121
0.035
0.89
0805
121
0.054
1.37
1005
121
0.054
1.37
1206
121
0.064
1.63
1210
121
0.065
1.63
1515
151
0.130
3.02
1808
151
0.065
1.63
1812
151
0.065
1.63
1825
471
0.080
2.03
151
0.080*
2.03
151
0.100*
2.54
471
0.140*
3.56
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
†
472
472
472
392
182
102
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
333
333
333
273
123
822
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
223
223
223
183
822
562
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
104
104
823
563
223
183
103
682
472
332
222
122
•
•
•
•
•
•
•
•
•
•
124
124
104
683
333
273
123
682
472
272
182
821
•
•
•
•
•
•
•
•
•
•
274
274
224
154
823
393
273
183
123
682
472
222
102
471
•
•
•
•
•
•
•
•
474
474
394
274
124
823
563
333
273
153
103
562
222
102
•
•
•
•
•
•
•
•
105
824
824
684
394
224
184
104
823
563
333
183
822
392
152
•
•
•
•
•
•
•
394
394
334
224
124
683
563
333
273
183
103
562
272
122
391
181
•
•
•
•
•
•
684
564
474
334
154
104
683
393
333
223
123
822
332
152
471
271
•
•
•
•
•
•
824
824
684
474
224
124
104
563
473
273
183
103
392
182
821
391
•
•
•
•
•
•
824
824
684
474
394
124
154
124
683
473
273
183
822
332
152
681
•
•
•
•
•
•
155
155
125
105
564
394
274
184
124
823
563
333
123
682
222
821
561
•
•
•
•
•
225
225
185
185
105
684
474
334
274
184
104
563
273
123
392
182
102
•
•
•
•
Units rated above 800V may require conformal coating to preclude arcing over chip surface.
Maximum voltage for MIL-PRF-123 tested parts is 1kV.
30
Phone: +1.661.295.5920 | www.novacap.com
High Reliability Chip - X7R
16Vdc to 10kVdc
l
l
l
l
l
For dielectric characteristics see page 6.
For dimensions see page 12.
For termination options see pages 3 & 15.
For capacitance tolerances available see page 15.
For ordering information see page 15.
Note:
Maximum capacitance values are shown below as 3 digit
code: 2 significant figures followed by the no. of zeros
e.g. 183 = 18,000pF.
Capacitance and voltage selection for popular chip sizes
2020
102
0.180
4.57
2221
471
0.080
2.03
2225
471
0.080
2.03
2520
471
102
0.180
4.57
3333
102
0.250
6.35
3530
102
0.250
6.35
4040
102
0.300
7.62
4540
102
0.300
7.62
5440
102
0.300
7.62
5550
102
0.300
7.62
6560
222
0.300
7.62
7565
222
0.300
7.62
Size
Min cap.
:inches
:mm
0.150*
3.81
Tmax
185
155
155
125
105
684
564
334
224
154
104
563
123
123
472
182
102
•
•
•
•
•
125
125
125
824
474
394
224
154
154
823
563
273
123
562
182
821
561
•
•
•
•
•
185
185
155
125
564
394
334
184
154
104
683
393
153
822
222
102
561
•
•
•
•
•
275
225
225
185
125
684
684
394
334
224
124
823
333
153
562
222
122
•
•
•
•
•
225
225
155
125
125
804
684
394
274
184
124
683
333
153
562
272
182
•
•
•
•
•
475
475
395
335
275
225
185
105
684
474
334
184
823
473
223
123
682
472
•
•
•
•
475
475
395
335
275
225
185
105
684
474
334
184
823
473
223
123
822
562
392
272
222
152
825
685
685
565
475
475
335
185
125
824
564
394
184
104
393
183
103
682
472
392
272
222
825
825
685
685
475
475
335
225
155
824
684
474
184
104
473
223
153
103
682
562
392
332
106
106
825
685
565
565
395
225
155
105
824
474
224
124
473
273
183
123
822
682
472
392
126
126
106
825
685
685
475
275
185
155
125
684
274
184
683
393
273
183
123
103
682
562
186
186
156
106
825
825
685
335
275
225
185
105
474
224
104
563
393
273
183
153
123
822
226
206
186
156
106
106
825
565
395
275
225
125
564
334
154
823
473
333
273
183
153
123
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
* Denotes non standard chip thickness.
Order code needs to have an ’X’ inserted together with the dimension in inches e.g. X080 where dimension is 0.080”
Phone: +1.661.295.5920 | www.novacap.com
31
Chip Ordering Information
High Reliability
Testing
High Reliability
Test Criteria
-
HB
Positive
Class
X5R VTC
II
E/G W
P
Termination
Capacitance
Capacitance
Tolerance
Packaging
T
None
M
Special
Thickness
Case Size
Dielectric
XX
1206
N
472
J
101
N
X050
H
Capacitance Code
1st two digits are
significant, third
digit denotes
number of zeros,
R = decimal
Examples:
1R0 = 1.0pF
120 = 12pF
471 = 470pF
102 = 1,000pF
273 = 0.027µF
474 = 0.47µF
105 = 1.0µF
X
Special Thickness
None
Standard thickness
as per Novacap
catalog specifications
Denotes a special
thickness other than
standard. Specify in
inches if required.
(As shown above
X
= 0.050”)
Packaging
None
T
W
Bulk
Tape and Reel
Waffle Pack
Marking
Unmarked
Marked
*
Marking not
available on
sizes < 0603
High Reliability
Testing
None
Standard product
H
H
High Reliability Testing
High Temp Screening
Dielectric Codes
N
M
F
D
K
R
Y
Z
B
C
X
S
E
G
W
P
RN
RB
C0G/NP0
C0G/NP0
C0G/NP0
C0G/NP0
R3L
R2D
Y5V
Z5U
X7R
X7R
BX
X8R
Class II
Class II
X5R
Positive VTC
NP0
X7R
Ultra Stable
Ultra Stable Magnetic Free
High Temp. (up to 160ºC)
High Temp. (up to 200ºC)
Ultra Stable
Pulse Energy
General Purpose
General Purpose
Stable
Stable Magnetic Free
MIL
High Temp. (up to 150ºC)
High Temp. (up to 200ºC)
High Temp. (up to 160ºC)
Stable
Pulse Power
RoHS 2013 < 200V
RoHS 2013 < 200V
B
{
Hi-Reliability
Testing Criteria
HB
MIL-PRF-55681 Group A
HK
MIL-PRF-38534 Class K
HS
MIL-PRF-123 Group A
Termination Codes
Voltage Code
1st two digits are significant,
third digit denotes number of
zeros. For example:
160 =
101 =
501 =
102 =
502 =
103 =
16 Volts
100 Volts
500 Volts
1,000 Volts
5,000 Volts
10,000 Volts
P
PR
K
N
Y
NG
C
D
B
E
S
Palladium Silver
Palladium Silver*
Solderable Palladium Silver*
Nickel Barrier*
Nickel Barrier
Nickel Barrier Gold Flash*
FlexiCap™/Nickel Barrier*
FlexiCap™/Nickel Barrier
Copper Barrier*
Copper Barrier
Silver*
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
*
Indicates RoHS terminations
Capacitance Tolerance Codes
Code Tolerance
*
Not RF series
Cap. Value
< 10pF
C0G/NP0
N
•
•
•
•
•
•
•
•
•
•
M
•
•
•
•
•
•
•
•
•
•
•
•
F/D
Y5V
R3L
R2D Z5U
X7R
B
C
BX
X
K
•
•
R
Y/Z
±0.10pF
±0.25pF
±0.50pF
±1%
±2%
±5%
±10%
±20%
+80% -20%
+100% -0%
Prefix Definitions
None
RF
LS
ES
ST
SM
CR
RC
Standard chip
Improved ESR Capacitor
Y
3
Certified Safety Capacitor
Y Certified Safety Capacitor
2
C
D
p. 23
p. 42 - 43
p. 42 - 43
p. 48 - 53
p. 48 - 53
p. 54
p. 58 - 61
F
G
J
K
M
Z
P
•
•
•
•
•
•
•
•
•
•
•
•
•*
•
•
•*
•*
•
•
•
•*
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Stacked Capacitor Assembly
Stacked Hi-Rel Capacitor Assembly
Cap-Rack Capacitor Array
Bleed Resistor
Marking
M
X8R
S
Voltage
Prefix
Phone: +1.661.295.5920 | www.novacap.com
15
Technical Summary
W
Technical Information
Novacap provides application notes throughout this catalog as
a guide to chip selection and attachment methods. Refer to the
Novacap Technical Brochure found at www.novacap.com for
more details. This technical information includes the nature of
capacitance, dielectric properties, electrical properties, classes
of dielectrics, ferroelectric behavior, test standards, and high
reliability test plans. Please do not hesitate to contact the sales
office for any product or technical assistance.
Capacitor Size
Size availability is based primarily on capacitance values and
voltage rating. Smaller units are generally less expensive.
Because mass affects the thermal shock susceptibility of chip
capacitors, size selection should consider the soldering method
used to attach the chip to the board. Sizes 1812 and smaller
can be wave, vapor phase, or reflow soldered. Larger units
require reflow soldering.
Chip Selection
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature. The Temperature Coefficient
of Capacitance describes the variance of capacitance value with
temperature. The choice of components is therefore largely
determined by the temperature stability required of the device
and the size necessary for the desired capacitance value and
voltage rating.
Packaging
Units are available reeled, in waffle pack, or bulk packaged. Bar
coded labels are standard for reeled and bulk packaging.
Primary Dielectric Types
T
MB
C0G/NP0:
Ultra stable Class I dielectric, with negligible dependence of
capacitance on temperature, voltage, frequency, and time. Used
in circuitry requiring very stable performance.
X7R:
Stable Class II dielectric, with predictable change in properties
across a temperature range of -55°C to +125°C. Used as
blocking, decoupling, bypassing, and frequency discriminating
elements. This dielectric is ferroelectric and provides higher
capacitance than Class I materials.
BX:
The military specification for ceramic chip capacitors (MIL-
PRF-55681) defines a mid-K stable dielectric designated as BX.
The BX specification has voltage temperature limits in addition
to temperature limits of capacitance. The BX dielectric is limited
to ±15% maximum change in capacitance between 25°C and
-55°C or +125°C and also has a voltage restriction of +15%
/ -25% maximum change in capacitance between 25°C and
-55°C or +125°C at rated voltage.
Z5U/Y5V:
General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties over temperature
and voltage. Very high capacitance per volume is attainable
for general purpose applications where stability over a wide
temperature range is not critical.
FlexiCap™/Nickel Barrier
100% tin
FlexiCap™/Nickel Barrier
90/10% tin/lead
Dielectric
Termination
Combinations
Nickel Barrier
90/10% tin/lead
Palladium Silver
Palladium Silver
Solderable
Palladium Silver
Nickel Barrier
100% tin
Nickel Barrier
Gold flash
Termination Material
Copper Barrier
90/10% tin/lead
Solderable Silver
We recommend the following
termination types:
Solder Attachment:
N
Nickel Barrier, 100% matte tin
plated - RoHS
C
FlexiCap™ with Nickel Barrier,
100% tin plated - RoHS
Y
Nickel Barrier, tin-lead plated
D
FlexiCap™ Nickel Barrier, tin-lead
plated
B
Copper Barrier 100% matte tin
plated - RoHS
E
Copper Barrier, tin-lead plated
K
Solderable Palladium Silver -
RoHS
S
Solderable Silver - RoHS
Palladium Silver
Dielectric
Code
N/RN
C0G/NP0
K
R3L
B/RB
X7R
W
X5R
X
BX
Y
Y5V
Z
Z5U
M
C0G/NP0 (
Mag free
)
C
X7R (
Mag free
)
S
X8R
F
C0G/NP0 (160ºC)
D
C0G/NP0 (200ºC)
G
Class II (160ºC)
E
Class II (200ºC)
P
Pulse Power
R
R2D
P
•
•
•
•
•
•
•
•
•
•
•
RoHS RoHS RoHS
PR
K
N
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Y
•
•
•
•
•
•
•
RoHS RoHS
NG
C
•
•
•
•
•
•
•
•
•
•
•
D
•
•
•
•
•
•
RoHS
B
Copper Barrier
100% tin
E
RoHS
S
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Conductive Epoxy attachment:
P
PR
Palladium Silver - RoHS
NG
Nickel Barrier Gold Flash,
also suitable for soldering
attachment - RoHS
Phone: +1.661.295.5920 | www.novacap.com
3
Dielectric Characteristics
X7R (B) Stable and RoHS 2013 (RB) type
Operating temperature range:
Temperature coefficient :
Dissipation factor
Insulation resistance:
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
±15%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
%CAPACITANCE CHANGE
%DC
TEMPERATURE COEFFICIENT
UPPER LIMIT
20
15
10
5
0
-5
-10
-15
-20
-55
-35
-15
5
25
TYPICAL
LOWER LIMIT
45
65
85
105
125
TEMPERATURE °C
X7R (C) Stable Non Magnetic
Operating temperature range:
Temperature coefficient:
Dissipation factor
Insulation resistance:
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
±15%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
%CAPACITANCE CHANGE
%DC
TEMPERATURE COEFFICIENT
UPPER LIMIT
20
15
10
5
0
-5
-10
-15
-20
-55
-35
-15
5
25
TYPICAL
LOWER LIMIT
45
65
85
105
125
TEMPERATURE °C
BX (X) Stable
Operating temperature range:
Temperature coefficient:
Temp-voltage coefficient:
Dissipation factor
Insulation resistance:
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
±15%
DC
Max.
+15% -25%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
%DC
TEMPERATURE COEFFICIENT
UPPER LIMIT
20
%CAPACITANCE CHANGE
15
10
5
0
-5
-10
-15
-20
-55
-35
-15
5
25
TYPICAL
LOWER LIMIT
45
65
85
105
125
TEMPERATURE °C
X8R (S) Stable
Operating temperature range:
Temp. coefficient <150ºC:
Dissipation factor
Insulation
resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@150ºC:
<200V:
201-500V:
>500V:
-55°C to 150°C
% CAPACITANCE CHANGE
%DC
TEMPERATURE COEFFICIENT
±15%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
40
20
0
-20
-40
-55
-25
0
25
50
75
100
125
150
TEMPERATURE °C
6
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When debugging the program, it shows: connection error (usb:// usb): swim error[3006]: comm init error: chip does not answer.I am using the STLINK on a 3-in-1 (STM32, STM8, STLINK) board , and the MCU...
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MSP430FR6043 Ultrasonic Sensing Evaluation Module
The EVM430-FR6043 Evaluation Kit is a development platform that can be used to evaluate the performance of the MSP430FR6043 in ultrasonic sensing applications such as smart gas meters. The MSP430FR604...
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Several design details of the schematic
The following is a simplified schematic diagram. The DC voltage regulator input Vin=24V is converted into two outputs Vout1,2 through integrated switch chips for step-up and step-down. The following q...
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Gaofen asks about the communication problem between PDA and PC
Hello everyone, I have a problem at work, which I have not been able to solve for several months. Please help me with some ideas. What I want to do now is to communicate between PDA and PC. Under norm...
zt13 Embedded System
CE Driver Quick Start
[b][font=Tahoma][size=10.5pt]CE[/size][/font][/b][b][size=10.5pt]Driver Quick Start[/size][/b][b][font=Tahoma][size=10.5pt][/size][/font][/b]...
xtss Embedded System
Shortcut:   00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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