VME64, VME64x Terminator
Technical
Data Sheet
RoHS Compliant Parts Available
Description
This Thevenin termination network provides high performance
resistor termination for VME64 and VME64x back planes.
Designed with a ceramic substrate, this device minimizes
parasitic capacitance and inductance, a primary cause of
reduced system performance. In addition, the BGA package
eases touting design, saving the designer many hours of
printed circuit layout.
The BGA packaging has been proven to reduce rework and
improve reliability
Features
•
•
•
•
•
•
8-Bit Termination Network
VME64, VME64x Compliant
Low Channel Capacitance
Laser Trimmed Resistance to ± 1%
Slim BGA Package
RoHS Compliant Designs Available
•
Compatible with both lead and lead
free processes
Style G
3
R1
2
R2
1
A
B
C
D
E
F
G
H
Electrical Specifications
Resistor Tolerance:
TCR
Operating Temperature Range
Maximum Resistor Power:
Maximum Package Power:
Process Requirements:
Maximum Re-flow Temperature
±
1.0%
±
200ppm/°C
-55°C to +125°C
0.05 Watts at 70°C
1.0 Watts at 70°C
Per IPC/JEDEC J-STD-020C
Typical Applications
VME64x Backplane
3.3V
RT2211
Card
Card
Card
Card
3.3V
RT2211
Standard
Termination
VME64
+5V
Low Voltage
Termination
VME64x
+3.3V
330
220
470
1.8K
RT2210
RT2211
Ordering Information
Standard
Part No.
RT1210B7
RT1211B7
R1
Ω
330
220
R2
Ω
470
1800
Array Size
3x8
3x8
Pitch (mm)
1.00
1.00
RoHS
Part No.
RT2210B7
RT2211B7
Packaging Information
Suffix
Tape Width
Carrier Pitch
Reel Diameter
Parts/Reel
TR7
24 mm
8 mm
7 inch
1,000
TR13
24mm
8 mm
13 inch
4,000
Part Number Coding
7 inch reel, Add TR7 to part
number, example RT2210B7TR7
13 inch reel, Add TR13 to part
number, example RT2210B7TR13
(Bulk packaging is not available)
Direction of Feed
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change
Page 1
VME64 & VME64x Terminators
April 08
Recommended Land Pattern
BGA Routing Schemes
Outline of Substrate
Blind vias to ground
reference pla ne layer
recomme nded o n
every oth er row as
shown.
Blind vias to V
CC
reference pla ne layer
recomme nded o n
every oth er row as
shown.
Blind vias to ground
reference plane layer
recommended on
every other row as
shown.
Termination Island
Vias to Vcc
Solder mask is
used to define
the ball pads.
PCB Pad Diameter
1.00 mm Pitch (B7) = 0.51mm/.020 inch
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
For .006" Thick Solder Paste Stencil, Aperture Opening
Should be Equal to the PCB Pad Diameter.
Refer to
www.ctscorp.com/components/clearone.asp
for
additional PCB design information
Option A
Option B
Mechanical Diagram
L
H
W
RT_2__B7
CTS YRWK
A1 Identifier
P (Pitch)
P (Pitch)
K
D
1.0mm Pitch
RT1210B7
RT1211B7
RT2210B7
RT2211B7
mm
inch
L
8.00±0.15
.315±.006
W
3.00±0.15
.118±.006
H
1.19±0.15
.047±.006
P
1.00±0.25
.039±.010
D
0.64±0.05
.025±.002
K
0.50±0.25
.020±.010
Complete ClearONE Product, Processing, and Application Information can be found at the following link:
http://www.ctscorp.com/components/clearone.asp
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change
Page 2
VME64 & VME64x Terminators
April 08
Analogue and Mixed Signal
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