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2225B1K00273MXBLW001

Description
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 2225, CHIP
CategoryPassive components    capacitor   
File Size160KB,7 Pages
ManufacturerSyfer
Download Datasheet Parametric View All

2225B1K00273MXBLW001 Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 2225, CHIP

2225B1K00273MXBLW001 Parametric

Parameter NameAttribute value
Objectid1714303331
package instruction, 2225
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN codeEAR99
YTEOL7
capacitance0.027 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee4
Manufacturer's serial number2225
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance20%
Rated (DC) voltage (URdc)1000 V
size code2225
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceSILVER
Terminal shapeGULL WING
Surface Mount
Capacitors
Chip Capacitors
Stacked Chip
C0G/X7R
Introduction
These ranges of both High Capacitance and High Voltage Multilayer
ceramic capacitor assemblies are designed for use in high frequency
switched mode power supplies, DC-DC converters and similar
applications.
Low ESR and low ESL are inherent in the design giving the
assemblies a high current capability up to 1MHz and offer far
superior performance than either aluminium or tantalum electrolytic
capacitors.Various lead options are available, making them suitable
for mounting on ceramic substrate or epoxy printed circuit boards.
Summary of Standard Range
Chip sizes covered
Working Voltages
Capacitance Range
1812; 2220; 2225; 3640; 5550; 8060.
50V to 2kV as standard.
39pF to 1.8µF in Ultra Stable COG Dielectric
820pF to 68µF in Stable X7R Dielectric.
Special chip sizes, working voltages, capacitance values and specific
custom requirements will be considered. Please refer all enquiries to
the Sales Office.
Available Lead Options
‘N’ Lead
‘J’ Lead
‘L’ Lead
‘S’ Lead
(DIL Package)
Note: Not all lead options are available with all chip sizes.
Check specific assembly drawings for available options.
Leaded assembly dimensions
Dimensions (mm)
3640
W
max
C
nom
L
max
No. of leads per side
11.5
9.2
11.7
4
5550
14.0
14.0
16.5
5
8060
16.5
20.3
22.8
6
Max Stack Height (H)
No. of Chips
Range
(size)
< 2225
> 3640
< 2225
> 3640
< 2225
> 3640
< 2225
> 3640
< 2225
> 3640
‘N’ Unleaded
Assemblies
N/A
N/A
5.25
N/A
7.75
N/A
10.25
N/A
12.75
N/A
‘J’ & ‘L’ leaded
Assemblies
4.5
5.5
7.0
8.75
9.5
12.0
12.0
15.25
14.5
18.5
‘S’ leaded
Assemblies
N/A
3.25
N/A
6.75
N/A
10.0
N/A
13.25
N/A
16.5
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