TMS320C6202GJLA233 datasheet, PDF

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TMS320C6202GJLA233: DescriptionFixed-Point Digital Signal Processor 352-FCBGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，109 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320C6202GJLA233 Overview

Fixed-Point Digital Signal Processor 352-FCBGA

TMS320C6202GJLA233 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	HBGA, BGA352,26X26,40
Contacts	352
Reach Compliance Code	_compli
ECCN code	3A001.A.3
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	22
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	233 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B352
JESD-609 code	e0
length	27 mm
low power mode	YES
Humidity sensitivity level	4
Number of DMA channels	4
Number of external interrupt devices	4
Number of terminals	352
Number of timers	2
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HBGA
Encapsulate equivalent code	BGA352,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	220
power supply	1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	32768
ROM programmability	MROM
Maximum seat height	3.8 mm
Maximum supply voltage	1.89 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6202GJLA233 Related Products

	TMS320C6202GJLA233	TMS320C6202BGNY250	TMS320C6202BGNY300	TMS320C6202GJL200	TMS320C6202GJL250	TMS320C6202GJL250X	TMS320C6202GJLA200	TMS320C6202GLS250	TMS320C6202GLS250X
Description	Fixed-Point Digital Signal Processor 352-FCBGA	Fixed-Point Digital Signal Processor 384-FC/CSP	Fixed-Point Digital Signal Processor 384-FC/CSP	Fixed-Point Digital Signal Processor 352-FCBGA	Fixed-Point Digital Signal Processor 352-FCBGA	Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc	Fixed-Point Digital Signal Processor 352-FCBGA 0 to 0	Fixed-Point Digital Signal Processor	Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	HBGA, BGA352,26X26,40	FBGA, BGA384,22X22,32	FBGA, BGA384,22X22,32	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HBGA, BGA352,26X26,40	HFBGA, BGA384,22X22,32	HFBGA, BGA384,22X22,32
Contacts	352	384	384	352	352	352	352	384	384
Reach Compliance Code	_compli	_compli	_compli	_compli	_compli	not_compliant	_compli	_compli	not_compliant
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	22	22	22	22	22	22	22	22	22
barrel shifter	NO	NO	NO	NO	NO	NO	NO	NO	NO
bit size	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	233 MHz	250 MHz	300 MHz	200 MHz	250 MHz	250 MHz	200 MHz	250 MHz	250 MHz
External data bus width	32	32	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B352	S-PBGA-B384	S-PBGA-B384	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B384	S-PBGA-B384
length	27 mm	18 mm	18 mm	27 mm	27 mm	27 mm	27 mm	18 mm	18 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	352	384	384	352	352	352	352	384	384
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HBGA	FBGA	FBGA	HBGA	HBGA	HBGA	HBGA	HFBGA	HFBGA
Encapsulate equivalent code	BGA352,26X26,40	BGA384,22X22,32	BGA384,22X22,32	BGA352,26X26,40	BGA352,26X26,40	BGA352,26X26,40	BGA352,26X26,40	BGA384,22X22,32	BGA384,22X22,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius)	220	220	220	220	220	220	220	220	NOT SPECIFIED
power supply	1.8,3.3 V	1.5,3.3 V	1.5,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	32768	32768	32768	32768	32768	32768	32768	32768	32768
Maximum seat height	3.8 mm	2.35 mm	2.35 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	2.8 mm	2.8 mm
Maximum supply voltage	1.89 V	1.57 V	1.57 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V
Minimum supply voltage	1.71 V	1.43 V	1.43 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage	1.8 V	1.5 V	1.5 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	0.8 mm	0.8 mm	1 mm	1 mm	1 mm	1 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	18 mm	18 mm	27 mm	27 mm	27 mm	27 mm	18 mm	18 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	incompatible	-	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	-	-	Texas Instruments	-	Texas Instruments	Texas Instruments
Factory Lead Time	1 week	1 week	12 weeks	1 week	-	1 week	-	1 week	-
Integrated cache	YES	YES	YES	YES	-	-	YES	YES	-
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	-
Humidity sensitivity level	4	4	4	4	4	4	4	4	-
Number of DMA channels	4	4	4	4	-	-	4	4	-
Number of external interrupt devices	4	4	4	4	-	-	4	4	-
Number of timers	2	2	2	2	-	-	2	2	-
On-chip data RAM width	8	8	8	8	-	-	8	8	-
On-chip program ROM width	8	8	8	8	-	-	8	8	-
Maximum operating temperature	105 °C	90 °C	90 °C	90 °C	-	-	105 °C	90 °C	-
ROM programmability	MROM	MROM	MROM	MROM	-	-	MROM	MROM	-
Temperature level	INDUSTRIAL	OTHER	OTHER	OTHER	-	-	INDUSTRIAL	OTHER	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Base Number Matches	-	-	-	1	1	1	1	-	1

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