256-301750-18
16x16 Array (256) Ball BGA Adapter
Converts from 0.8mm Pitch to 1.00mm Pitch
FEATURES:
• Correct-A-Chip™ technology solves problems associat-
ed with the use of alternate ICs (due to availability,
obsolescence, need for better performance, etc.) by
eliminating the need for new PCBs.
• Alows .8mm Pitch devices to be mounted to PCBs laid
out for 1.00mm Pitch devices.
GENERAL SPECIFICATIONS:
• PCB is FR-4, .040.
• Solder Ball is .020” dia Sn/Pb 63/37.
• PCB plating is ENIG (Immersion Gold over Electroless
Nickel) 3-8μ Gold per IPC-4552 over 100μ min. Nickel
per ASTM-B-733.
• Solder mask is black LPI (liquid photo imagable).
• Operation Temperature is 221°F [105°C] continuous.
MOUNTING CONSIDERATIONS:
• Suggested PCB Pad size = .025 ± .002 [.635] dia.
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
Note: Aries specializes in custom design and production. In addition to the standard
products shown on this page, special materials, platings, sizes, and configurations
can be furnished, depending on quantities. Aries reserves the right to change prod-
uct specifications without notice.
All tolerances ± .010 [.25]
unless otherwise specified
http://www.arieselec.com • info@arieselec.com
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX: (908) 996-3891
abc
18105
Rev A
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