2. Metric equivalents are given for general information only.
3. Unless otherwise specified, tolerances are ±0.010 inch (0.25 mm).
4. Lead frame configuration is shown as typical above the seating plane. The seating plane shall be configured to create a standoff height of 0.055 inch
±0.010 inch when the part is mounted to a printed circuit board (PCB). The standoff height shall be the distance between the PCB and the bottom of
the chip stack. A seating plane is only required for lead style N.
5. See Table 1 for specific maximum A dimension. For maximum B dimension, add .065 inch (1.65 mm) to the appropriate A dimension. For all lead
styles, the number of chips is determined by the capacitance and voltage rating.
6. For case code 5, dimensions shall be .100 inch (2.54 mm) maximum and 0.012 inch (0.30 mm) minimum.
7. Lead alignment within pin rows shall be within ±0.005 inch (0.13 mm). Lead alignment between pin rows shall be within one half of the lead width
(0.010 inch (0.25 mm)).
Lead Configurations – Inches (Millimeters)
Lead Style
Symbol
N
L
J
Lead Style
(N) Straight
(L) Formed
(J) Formed
L
Lead Length
0.250 Minimum (6.35)
0.070 ±0.010 (1.78 ±0.25)
0.070 ±0.010 (1.78 ±0.25)
Additional lead configurations may be available. Contact KEMET for details.
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Embedded System
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