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2MBS256-636GG

Description
IC Socket, BGA256, 256 Contact(s),
CategoryThe connector    socket   
File Size47KB,1 Pages
ManufacturerAdvanced Interconnections Corp.
Environmental Compliance
Download Datasheet Parametric Compare View All

2MBS256-636GG Overview

IC Socket, BGA256, 256 Contact(s),

2MBS256-636GG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codecompli
ECCN codeEAR99
Contact to complete cooperationAU
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrie
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedBGA256
Shell materialPOLYPHENYLENE SULFIDE
JESD-609 codee4
Plug contact pitch0.059 inch
Number of contacts256
PCB contact patternRECTANGULAR
Base Number Matches1
Ball Grid Array
(BGA) Sockets
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
Standard Socket (S)
• Mates with Standard Adapter (A)
Now Available In
0.75mm Pitch
Socket size:
same size as BGA device body
• Use with SMT Adapter for LGA and
reworked BGA device socketing (see pg. 7)
(Bottom view shown)
Extraction Socket (SB)
• Mates with Extraction Slot Adapter (AX)
Socket size:
BGA device body + .079/(2.0)
• Protects valuable PCB during device/Adapter
extraction – tool never touches PCB
• Available in 1.0, 1.27 and 1.5mm pitch only
(Bottom view shown)
Socket Features
• Advanced
®
exclusive eutectic solder
ball terminals offer superior SMT
processing.
• Uses same footprint as BGA device.
• Proven long-term performance in
vigorous temperature cycling applica-
tions – solder ball terminal absorbs
TCE mismatch.
• Closed bottom socket terminal for
100% anti-wicking of solder.
• Gold contacts allow gold/gold intercon-
nections to male Adapter pins.
• Low insertion force socket with multi-
fingered high reliability Beryllium
Copper contacts.
• Coplanarity consistently under .006 in.
(0.152mm) industry standard.
• In-house Tape and Reel packaging
available.
Guide Post Socket (SG)
• Integral molded corners allow accurate positioning
of device/Adapter assembly in blind-mating
applications
• Mates with Extraction Slot Adapter (AX)
Socket size:
BGA device body + .276/(7.00)
1.27 & 1.5mm Pitch Terminals
Type -636
Solder Ball
1.0mm Pitch Terminals
Type -716
Solder Ball
Type -673
Thru-Hole
.117
(2.97)
Type -717
Thru-Hole
STANDARD
.117
(2.97)
.105
(2.67)
.090
(2.29)
.105
(2.67)
.090
(2.29)
.095
(2.41)
.128
(3.25)
.024/(0.61) Dia.
.125
(3.18)
.015 Dia.
(0.38)
.030/(0.76) Dia.
PATENTED
.018 Dia.
(0.46)
PATENTED
0.80mm Pitch Terminals
Type -702
Solder Ball
0.75mm Pitch Terminal
Type -758
Solder Ball
Specifications
Terminals:
Brass; Copper Alloy (C36000),
ASTM-B-16
Contacts:
Beryllium Copper; Copper Alloy
(C17200), ASTM-B-194
Plating:
G – Gold over Nickel
Body Material:
M – Molded PPS (High Temp.
Glass Filled Thermoplastic), U.L.
Rated 94V-O, -60°Cto 260°C (-76°F
to 500°F)
F – FR-4 Glass Epoxy, U.L. Rated
94V-0
Solder Ball:
Eutectic, 63Sn/37Pb, 183°C (361°F)
Type -731
Thru-Hole
.125
(3.18)
.125
(3.18)
.125
(3.18)
.020/(0.51) Dia.
.080
(2.03)
.011 Dia.
(0.28)
.018/(0.46) Dia.
PATENTED
PATENTED
How To Order – BGA Sockets
1
Footprint Dash#
If Applicable*
Body Type
M - Molded PPS (1.27 & 1.5mm pitch)
F - FR-4 (0.75, 0.80 & 1.0mm pitch)
M
G
S
XXXX - 636 G
G
Contact Plating
G - Gold
Pitch
Number of Positions
B = .059/(1.5mm)
G = .050/(1.27mm)
*See BGA Footprint Booklet
Model Type
H = .039/(1.0mm)
or web site
J = .0315/(0.80mm)
S
= Standard Socket
K = .0295/(0.75mm)
SB
= Extraction Socket [1.5, 1.27, and 1.0mm Pitch only]
SG
= Guide Post Socket [1.5 and 1.27mm Pitch only]
Terminal Plating
G - Gold
Terminal Type
See options
REV. 4/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
3

2MBS256-636GG Related Products

2MBS256-636GG 2MBSB256-673GG 2MBSG256-673GG MBS324-636GG MBSB324-673GG MBSG324-673GG
Description IC Socket, BGA256, 256 Contact(s), IC Socket, BGA256, 256 Contact(s), IC Socket, BGA256, 256 Contact(s), IC Socket, BGA324, 324 Contact(s), IC Socket, BGA324, 324 Contact(s), IC Socket, BGA324, 324 Contact(s),
Reach Compliance Code compli compli compli compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Device slot type IC SOCKET IC SOCKET IC SOCKET IC SOCKET IC SOCKET IC SOCKET
Type of equipment used BGA256 BGA256 BGA256 BGA324 BGA324 BGA324
Shell material POLYPHENYLENE SULFIDE POLYPHENYLENE SULFIDE POLYPHENYLENE SULFIDE POLYPHENYLENE SULFIDE POLYPHENYLENE SULFIDE POLYPHENYLENE SULFIDE
Number of contacts 256 256 256 324 324 324
Base Number Matches 1 1 1 1 - -
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