M
ULTI
-L
AYER
H
IGH
-Q C
APACITORS
These lines of multilayer capacitors have been developed for
High-Q and microwave applications.
•
The
S-Series
(R03S, R07S, R14S, R15S) capacitors give an
ultra-high Q performance, and exhibit NP0 temperature char-
acteristics.
•
The
L-Series
(R05L) capacitors give mid-high Q performance,
and exhibit NP0 temperature characteristics.
•
The
E-Series
(S42E, S48E, S58E) capacitors give excellent
high-Q performance from HF to Microwave frequencies.
Typical uses are high voltage, high current applications. They
are offered in chip (Ni barrier or Non-Magnetic Pt.-Ag) or in
Non-Magnetic leaded form.
•
The
W-Series
(R05W) capacitors offer a large capacitance
value in an ultra-small 0201 package size. These exhibit a X7R
temperature characteristic.
•
RoHS compliance is standard for all unleaded parts (see
termination options box).
H
OW TO
O
RDER
252
VOLTAGE (DC)
6R3 = 6.3 V
101 = 100 V
160 = 16 V
250 = 25 V
500 = 50 V
201 = 200 V
251 = 250 V
301 = 300 V
501 = 500 V
102 = 1000 V
152 = 1500 V
202 = 2000 V
252 = 2500 V
362 = 3600 V
502 = 5000 V
722 = 7200 V
S48
CASE SIZE
R03 (01005)
R05 (0201)
R07 (0402)
R14 (0603)
R15 (0805)
S42 (1111)
S48 (2525)
S58 (3838)
E
470
CAPACITANCE (pF)
1st two digits are
significant; third digit
denotes number of
zeros, R = decimal.
100 = 10 pF
101 = 100 pF
K
TOLERANCE
A = ± 0.05 pF
B = ± 0.10 pF
C = ± 0.25 pF
D = ± 0.50 pF
F = ±1 %
G = ±2%
J = ±5%
K = ± 10%
For tolerance
availability, see chart.
V
TERMINATION
Nickel Barrier
V = Ni/Sn (Green)
T = Ni/SnPb
G = Ni/Au (Green)
Non-Mag*
U = Cu/Sn (Green)
C = Cu/SnPb
Leaded (All Non-Mag)*
1 = Microstrip
2 = Axial Ribbon
3 = Axial Wire
4 = Radial Ribbon
5 = Radial Wire
4
E
PACKAGING
S = Bulk
W = Waffle Pack
01005 - 0603
Y = Paper 5” Reel
T = Paper 7” Reel
*R = Paper 13” Reel
*J = Paper 5” Reel -
Horizontally Oriented Electrodes
*N = Paper 5” Reel -
Vertically Oriented Electrodes
DIELECTRIC
S = Ultra High Q NPO
L = High Q NPO
E = Ultra High Q NPO,
High Voltage, High Power,
*T = High Temp (175C)
Ultra High Q NPO
W= X7R
*L = Paper 7” Reel -
Horizontally Oriented Electrodes
*V = Paper 7” Reel -
Vertically Oriented Electrodes
Part Number written:
252S48E470KV4E
MARKING
3 = Cap Code
& Tolerance
4 = No Marking
6 = EIA Code
(Marking option is
only available on
0805 and larger
case sizes)
0805 - 3838
Z = Embossed 5” Reel
E = Embossed 7” Reel
*U = Embossed 13” Reel
*M = Embossed 5” Reel -
Horizontally Oriented Electrodes
*Q = Embossed 5” Reel -
Vertically Oriented Electrodes
*G = Embossed 7” Reel -
Horizontally Oriented Electrodes
*P = Embossed 7” Reel -
Vertically Oriented Electrodes
Tape specifications
conform to EIA RS481
“*” - Not available for all MLCC - Call factory for info.
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7
D
ieleCTRiC
C
HaRaCTeRiSTiCS
TEMPERATURE COEFFICIENT:
QUALITY FACTOR / DF:
INSULATION RESISTANCE:
npo
x7R
± 15%, -55 to 125°C
16VDC DF
≤
3.5% @ 1 KHz, 25°C
10VDC DF
≤
5.0% @ 1 KHz, 25°C
0 ± 30ppm /°C, -55 to 125°C
Q
>1,000 @ 1 MHz, Typical 10,000
>100 GΩ @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
500 V
≤
2.5 X WVDC Min., 25°C, 50 mA max
1000 V
≤ 1.5
X WVDC Min., 25°C, 50 mA max
> 1500 = 1 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
DIELECTRIC STRENGTH:
>500
ΩF*
or 10 GΩ* @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
* whichever is less
2.5 X WVDC Min., 25°C, 50 mA max
1KHz ±50Hz, 1.0±0.2 VRMS, 25°C
100 - 10,000 pF
TEST PARAMETERS::
AVAILABLE CAPACITANCE:
Size 0201:
Size 0402:
Size 0603:
Size 0805:
0.2 - 100 pF
0.2 - 33 pF
0.2 - 100 pF
0.3 - 220 pF
Size 1111:
Size 2525:
Size 3838:
0.2 - 1000 pF
1.0 - 2700 pF
1.0 - 5100 pF
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO
SOLDERING HEAT:
Solder coverage
≥
90% of metalized areas
No termination degradation
No mechanical damage
Capacitance change: ±2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
Capacitance change: 2% or 0.5pF Max
MIL-STD-202, Method 108l
No mechanical damage
Capacitance change: ±3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R.
≥
1 G-Ohm
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>1000 I.R.
≥
10 G-Ohm
Breakdown voltage: 2.5 x WVDC
TEST PARAMETERS
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux
then dip in Sn62 solder @ 240°±5°C for 5±1 sec
Preheat device to 80°-100°C for 60 sec.
followed by 150°-180°C for 60 sec.
Dip in 260°±5°C solder for 10±1 sec.
Measure after 24±2 hour cooling period
Linear pull force* exerted on axial leads soldered to each terminal.
*0402
≥
2.0lbs, 0603
≥
2.0lbs (min.)
Glass epoxy PCB: 0.5 mm deflection
Applied voltage: 200% of WDVC for capacitors rated at 500 volts DC or less.
100% of WDVC for capacitors rated at 1250 volts DC or less.
Temperature: 125°±3°C
Test time: 1000+48-0 hours
5 cycles of: 30±3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Measure after 24±2 hour cooling period
Relative humidity: 90-95%
Temperature: 40°±2°C
Test time: 500 +12/-0 Hours
Measure after 24±2 hour cooling period
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85±2% Temperature: 40°±2°C
Test time: 240 +12/-0 Hours
Measure after 24±2 hour cooling period
Cycle performed for 2 hours in each of three perpendicular directions
Frequency range 10Hz to 55 Hz to 10 Hz traversed
in 1 minute. Harmonic motion amplitude: 1.5mm
TERMINAL
ADHESION:
PCB DEFLECTION:
LIFE TEST:
THERMAL CYCLE:
HUMIDITY,
STEADY STATE:
HUMIDITY,
LOW VOLTAGE:
VIBRATION:
10
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M
ECHANICAL
C
HARACTERISTICS
Size
Units
In
mm
In
mm
In
mm
In
mm
Length
Width
Thickness
End Band
EIA 0201
Metric (0603)
EIA 0402
Metric (1005)
EIA 0603
Metric (1608)
EIA 0805
Metric (2012)
.024 ±.001
.040 ±.004
(1.02 ±0.1)
.062 ±.006
.080 ±.008
.012 ±.001
.020 ±.004
(0.51 ±0.1)
.012 ±.001
(0.30 ±0.03)
.020 ±.004
(0.51 ±0.1)
(0.76 +.13-.08)
.040 ±.006
(1.02 ±.15)
.008 Max.
(0.20 Max.)
.010 ±.006
(0.25 ±.15)
.014 ±.006
(0.35 ±.15)
.020 ±.010
(0.50 ±.25)
(0.60 ±0.03) (0.30 ±0.03)
.032 ±.006 .030 +.005/-.003
.050 ±.008
(1.57 ±0.15) (0.81 ±0.15)
(2.03 ±0.20) (1.27 ±0.20)
H
oRizonTal anD
V
eRTiCle
o
RienTeD
C
apaCiToRS
Horizontal Electrode Orientation
Vertical Electrode Orientation
a
ppliCaTionS
& F
eaTuReS
Size:
Performance:
Termination:
Applications:
RoHS Compliant
EIA 0201, 0402
SRF’s up to 20 GHz, Ultra High Q, Tight tolerance, Ultralow ESR
Ni/Au, Ni/Sn, Ni/SnPb
High Frequency Wireless Communications, Portable Wireless Products, Battery Powered
Products
B
eniFiTS oF uSing
o
RienTeD
C
apaCiToRS
•
•
•
•
•
Consistent Orientation - Improved repeatability of production circuits.
Consistent Orientation - More consistent filter performance.
Vertical Orientation - The elimination of parallel frequencies.
Vertical Orinetation - Lower inductance for a given capacitor.
Horizontal Orientation - Lower coupling between adjacent capacitors.
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11
Microcontroller MCU
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