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70P5258L55BZGI

Description
Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, GREEN, FBGA-144
Categorystorage    storage   
File Size107KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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70P5258L55BZGI Overview

Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, GREEN, FBGA-144

70P5258L55BZGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts144
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time55 ns
JESD-30 codeS-PBGA-B144
JESD-609 codee3
memory density131072 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals144
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX16
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Base Number Matches1
HIGH-SPEED
8K x 16 TriPort
STATIC RAM
Features
High-speed access
– Industrial: 55ns (max.)
Low-power operation
– IDT70P5258ML and IDT70P525ML
Active: 54mW (typ.)
Standby: 7.2
µ
W (typ.)
– IDT70V525ML
Active: 450mW (typ.)
Standby: 250
µ
W (typ.)
IDT70P5258ML
IDT70P525ML
IDT70V525ML
TriPort architecture allows simultaneous access to the
memory from all three ports
Fully asynchronous operation from each of the three
ports: P1, P2, and P3
IDT70P5258 supports 3.0V and 1.8V I/O's
Available in 144-ball 0.5mm-pitch
fpBGA
Industrial temperature range (–40°C to +85°C)
Greeen parts available, see ordering information
Functional Block Diagram
PORT 2
Address
Decode
BE
0P1,
BE
1P1
R/
W
P1
OE
P1
A
0P2
- A
11P2
CE
P2
R/
W
P2
OE
P2
I/O
0P1
-I/O
15P1
PORT 1
I/O
Control
PORT 2
I/O
Control
I/O
0P2
-I/O
15P2
Memory
Array
A
0P1
- A
11P1
BE
0P1,
BE
1P1
PORT 3
I/O
Control
CE
P3
R/
W
P3
OE
P3
PORT 1
Address
Decode
PORT 3
Address
Decode
BE
0P1,
BE
1P1
I/O
0P3
-I/O
15P3
A
0P3
- A
11P3
R/
W
P1
OE
P1
INT
P1 - P2
INT
P1 - P3
Interrupt
Control
CE
P2,
CE
P3
R/W
P2,
R/W
P3
INT
P3 - P1
INT
P2 - P1
OE
P2,
OE
P3
,
5681 drw 01
JANUARY 2009
1
©2009 Integrated Device Technology, Inc.
DSC 5681/5

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70P5258L55BZGI 70P5258ML55BZI8 70P5258ML55BZI 70V525L55BZGI 70P525L55BZGI
Description Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, GREEN, FBGA-144 Multi-Port SRAM, 8KX16, 55ns, CMOS, PBGA144 Multi-Port SRAM, 8KX16, 55ns, CMOS, PBGA144 Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, GREEN, FBGA-144 Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, GREEN, FBGA-144
Is it Rohs certified? conform to incompatible incompatible conform to conform to
Reach Compliance Code compliant unknown unknown compliant compliant
Maximum access time 55 ns 55 ns 55 ns 55 ns 55 ns
JESD-30 code S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144
JESD-609 code e3 e0 e0 e3 e3
memory density 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit
Memory IC Type STANDARD SRAM MULTI-PORT SRAM MULTI-PORT SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16
Number of terminals 144 144 144 144 144
word count 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
organize 8KX16 8KX16 8KX16 8KX16 8KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA FBGA FBGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) MATTE TIN MATTE TIN
Terminal form BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Is it lead-free? Lead free - - Lead free Lead free
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
Parts packaging code BGA - - BGA BGA
package instruction BGA, - - BGA, BGA,
Contacts 144 - - 144 144
ECCN code EAR99 - - EAR99 EAR99
Number of functions 1 - - 1 1
Peak Reflow Temperature (Celsius) 260 - - 260 260
Maximum supply voltage (Vsup) 1.9 V - - 3.3 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V - - 2.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V - - 3 V 1.8 V
Maximum time at peak reflow temperature 30 - - 30 30
Base Number Matches 1 1 1 1 -
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