DPS2MX16MKH3-25B datasheet, PDF

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DPS2MX16MKH3-25B: DescriptionSRAM Module, 2MX16, 25ns, CMOS, GULLWING, STACK, SLCC-52; Categorystorage storage; File Size739KB，8 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS2MX16MKH3-25B Overview

SRAM Module, 2MX16, 25ns, CMOS, GULLWING, STACK, SLCC-52

DPS2MX16MKH3-25B Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
Parts packaging code	QMA
package instruction	,
Contacts	52
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
JESD-30 code	R-XQMA-G52
memory density	33554432 bit
Memory IC Type	SRAM MODULE
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	52
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2MX16
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal location	QUAD
Base Number Matches	1

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2Mx16, 20 - 45ns, STACK

30A129-08

32 Megabit High Speed CMOS SRAM

DPS2MX16MKn3

DESCRIPTION:

The DPS2MX16MKn3 High Speed SRAM ‘’STACK’’ modules are

a revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).

Available in straight leaded, ‘’J’’ leaded or gullwing leaded

packages. The module packs 32-Megabits of low-power CMOS

static RAM in an area as small as 0.549 in

, while maintaining a

total height as low as 0.545 inches.

The DPS2MX16MKn3 STACK modules contain eight individual

512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,

making the modules suitable for commercial, industrial and

military applications.

By using SLCCs, the ‘’Stack’’ family of modules offer a higher

board density of memory than available with conventional

through-hole, surface mount or hybrid techniques.

SLCC Stack

Straight

Leaded

Stack

FEATURES:

•

Organizations Available:

2 Meg x 16

•

Access Times:

20*, 25, 30, 35, 45ns

•

Fully Static Operation - No clock or refresh required

•

Single +5V Power Supply,

10% Tolerance

TTL Compatible

Common Data Inputs and Outputs

Low Data Retention Voltage:

2.0V min.

Packages Available:

SLCC Stack

Straight Leaded Stack

‘’J’’ Leaded Stack

Gullwing Leaded Stack

‘’J’’ Leaded

Stack

Commercial and Industrial Grade only.

FUNCTIONAL BLOCK DIAGRAM

Gullwing

Leaded

Stack

PIN NAMES

A0 - A18

I/O0 - I/O15

CE0 - CE3

WE0, WE1

OE0, OE1

N.C.

30A129-08

REV. A

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

Address Inputs

Data Input/Output

Low Chip Enables

Write Enables

Output Enables

Power (+5V)

Ground

No Connect

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