MASK ROM, 512KX8, 100ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 40 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| Spare memory width | 16 |
| JESD-30 code | R-PDIP-T40 |
| length | 52 mm |
| memory density | 4194304 bi |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 40 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.05 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| MSM534022B-RS | MSM534022B-GS-K | |
|---|---|---|
| Description | MASK ROM, 512KX8, 100ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 100ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44 |
| Parts packaging code | DIP | SOIC |
| package instruction | DIP, | SOP, |
| Contacts | 40 | 44 |
| Reach Compliance Code | unknow | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 100 ns | 100 ns |
| Spare memory width | 16 | 16 |
| JESD-30 code | R-PDIP-T40 | R-PDSO-G44 |
| length | 52 mm | 28.15 mm |
| memory density | 4194304 bi | 4194304 bit |
| Memory IC Type | MASK ROM | MASK ROM |
| memory width | 8 | 8 |
| Number of functions | 1 | 1 |
| Number of terminals | 40 | 44 |
| word count | 524288 words | 524288 words |
| character code | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.05 mm | 3 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| width | 15.24 mm | 13 mm |
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