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L17EF2510100

Description
D Type Connector, 25 Contact(s), Male, 0.108 inch Pitch, Press Fit Terminal, Locking, Plug
CategoryThe connector    The connector   
File Size1MB,3 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Download Datasheet Parametric View All

L17EF2510100 Overview

D Type Connector, 25 Contact(s), Male, 0.108 inch Pitch, Press Fit Terminal, Locking, Plug

L17EF2510100 Parametric

Parameter NameAttribute value
Objectid316212841
Reach Compliance Codeunknown
ECCN codeEAR99
EF
D-Sub connectors - Stamped and Formed Contacts
PRESS FIT
RIGHT ANGLE PCB TERMINATION
The Amphenol “EF“ series
features eye of needle formed
contacts, and insulator with
closed entry contacts cavities.
This series gives you
Amphenol's high standards of
quality and reliability to meet
all your technical requirements.
CHARACTERISTICS
Shells
Insulator
Pin contact
Socket contact
Rear insert
Boardlock
Screwlock
Steel, tin plated
Glass-filled thermoplastic, UL 94V-0
Brass, selected gold in mating area;
2.54µm (100µ") min. tin
on termination area over
1.27µm (50µ") min.nickel
Phosphor bronze, selected gold in
mating area; 2.54µm (100µ") min.
tin on termination area over;
1.27µm(50µ") min. nickel
Brass, 2.54µm (100µ") min. nickel plated
Brass, 2.54µm (100µ") min. tin over 1.27µm (50µ”)
min.nickel plated
Brass, 2.54µm (100µ") min. nickel plated
DESCRIPTION
APPLICATIONS
Materials and Platings
Electrical Data
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
3A
300V AC
1000V AC/rms 60Hz for one minute
1000MΩ
25mΩ
max
Climatic Data
Operating temperature
-55°C to +125°C
Salt spray
24 hours
Solderless
right angle PCB
mount
connectors
Industrial
Mechanical Data
Single contact insertion force
Single contact withdrawal force
Single contact insertion on board
Single contact withdrawal from board
Standard plating thickness
≤ 3.60 N
≥ 0.2 N
≤ 100 N
≥ 20 N
Gold flash
0.4µm (15µ") gold
0.76µm (30µ") gold
Telecom
Any backplane
application
Terminal
Specification
Finished Hole
Cu
Sn
1 (+0.09 -0.06)
> 25 µm
< 15 µm
Boardlock
Specification
3.1 +/- 0.05 mm
Min 25 µm
5-15 µm
EF / E9
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