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5962-8984106LA

Description
Flash PLD, 10ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24
CategoryProgrammable logic devices    Programmable logic   
File Size383KB,13 Pages
ManufacturerCypress Semiconductor
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5962-8984106LA Overview

Flash PLD, 10ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24

5962-8984106LA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionCERAMIC, DIP-24
Contacts24
Reach Compliance Code_compli
ECCN code3A001.A.2.C
Other features10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
ArchitecturePAL-TYPE
maximum clock frequency76.9 MHz
JESD-30 codeR-GDIP-T24
JESD-609 codee0
length31.877 mm
Dedicated input times11
Number of I/O lines10
Number of entries22
Output times10
Number of product terms132
Number of terminals24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize11 DEDICATED INPUTS, 10 I/O
Output functionMACROCELL
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programmable logic typeFLASH PLD
propagation delay10 ns
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.08 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1
22V10
PALCE22V10
Flash Erasable,
Reprogrammable CMOS PAL® Device
Features
Low power
— 90 mA max. commercial (10 ns)
— 130 mA max. commercial (5 ns)
CMOS Flash EPROM technology for electrical erasabil-
ity and reprogrammability
Variable product terms
— 2 x(8 through 16) product terms
User-programmable macrocell
— Output polarity control
— Individually selectable for registered or combinato-
rial operation
Up to 22 input terms and 10 outputs
DIP, LCC, and PLCC available
— 5 ns commercial version
4 ns t
CO
3 ns t
S
5 ns t
PD
181-MHz state machine
— 10 ns military and industrial versions
7 ns t
CO
6 ns t
S
10 ns t
PD
110-MHz state machine
— 15-ns commercial, industrial, and military versions
— 25-ns commercial, industrial, and military versions
High reliability
— Proven Flash EPROM technology
— 100% programming and functional testing
Functional Description
The Cypress PALCE22V10 is a CMOS Flash Erasable sec-
ond-generation programmable array logic device. It is imple-
mented with the familiar sum-of-products (AND-OR) logic
structure and the programmable macrocell.
Logic Block Diagram (PDIP/CDIP)
V
SS
12
I
11
I
10
I
9
I
8
I
7
I
6
I
5
I
4
I
3
I
2
CP/I
1
PROGRAMMABLE
AND ARRAY
(132 X 44)
8
10
12
14
16
16
14
12
10
8
Reset
Macrocell
Macrocell
Macrocell
Macrocell
Macrocell
Macrocell
Macrocell
Macrocell
Macrocell
Macrocell
Preset
13
I
14
I/O9
15
I/O8
16
I/O 7
17
I/O6
18
I/O5
19
I/O4
20
I/O3
21
I/O2
22
I/O1
23
I/O0
24
V
CC
CE22V10–1
Pin Configuration
I
I
CP/I
NC
V
CC
I/O0
I/O1
4 3 2 1 282726
I
I
I
NC
I
I
I
5
6
7
8
9
10
11
12131415161718
V
SS
NC
I/O9
I/O8
CE22V10–2
25
24
23
22
21
20
19
I/O 2
I/O 3
I/O 4
N/C
I/O 5
I/O 6
I/O 7
I
I
I
NC
I
I
I
5
6
7
8
9
10
11
I
I
CP/I
NC
V
CC
I/O0
I/O1
4 3 2 1 2827 26
25
24
23
22
21
20
19
I/O 2
I/O 3
I/O 4
N/C
I/O 5
I/O 6
I/O 7
CE22V10–3
121314 1516 1718
V
SS
NC
LCC
Top View
PLCC
Top View
PAL is a registered trademark of Advanced Micro Devices.
Cypress Semiconductor Corporation
Document #: 38-03027 Rev. **
3901 North First Street
San Jose
I/O9
I/O8
I
I
I
I
I
I
CA 95134 • 408-943-2600
Revised September 1996

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Description Flash PLD, 10ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 EE PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 Flash PLD, 25ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 Flash PLD, 10ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 Flash PLD, 15ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 Flash PLD, 25ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28
Parts packaging code DIP QLCC DIP QLCC DIP QLCC
package instruction CERAMIC, DIP-24 CERAMIC, LCC-28 DIP, DIP24,.3 CERAMIC, LCC-28 CERAMIC, DIP-24 QCCN, LCC28,.45SQ
Contacts 24 28 24 28 24 28
Reach Compliance Code _compli not_compliant unknown not_compliant not_compliant unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Architecture PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE
maximum clock frequency 76.9 MHz 50 MHz 30.3 MHz 76.9 MHz 50 MHz 30.3 MHz
JESD-30 code R-GDIP-T24 S-CQCC-N28 R-GDIP-T24 S-CQCC-N28 R-GDIP-T24 S-CQCC-N28
JESD-609 code e0 e0 e0 e0 e0 e0
Dedicated input times 11 11 11 11 11 11
Number of I/O lines 10 10 10 10 10 10
Number of entries 22 22 22 22 22 22
Output times 10 10 10 10 10 10
Number of product terms 132 132 132 132 132 132
Number of terminals 24 28 24 28 24 28
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output function MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP QCCN DIP QCCN DIP QCCN
Encapsulate equivalent code DIP24,.3 LCC28,.45SQ DIP24,.3 LCC28,.45SQ DIP24,.3 LCC28,.45SQ
Package shape RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programmable logic type FLASH PLD EE PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD
propagation delay 10 ns 15 ns 25 ns 10 ns 15 ns 25 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 38535Q/M;38534H;883B MIL-STD-883 MIL-STD-883
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - hot dipped TIN LEAD
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL QUAD DUAL QUAD DUAL QUAD
Base Number Matches 1 1 1 1 1 1
Is it Rohs certified? incompatible incompatible - incompatible incompatible -
Peak Reflow Temperature (Celsius) NOT SPECIFIED 240 - 240 NOT SPECIFIED -
Maximum time at peak reflow temperature NOT SPECIFIED 30 - 30 NOT SPECIFIED -
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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