Analog Waveform Generation Function, CMOS, PDSO16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP16,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DS1608S | DS1608 | |
|---|---|---|
| Description | Analog Waveform Generation Function, CMOS, PDSO16 | Analog Waveform Generation Function, CMOS, PDIP16 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Maxim | Maxim |
| Reach Compliance Code | not_compliant | not_compliant |
| JESD-30 code | R-PDSO-G16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP |
| Encapsulate equivalent code | SOP16,.4 | DIP16(UNSPEC) |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE |
| power supply | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified |
| surface mount | YES | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE |
| Terminal location | DUAL | DUAL |