EEWORLDEEWORLDEEWORLD

Part Number

Search

5.0SMLJ170A-TP

Description
Trans Voltage Suppressor Diode, 5000W, 170V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMCJ, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size345KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

5.0SMLJ170A-TP Overview

Trans Voltage Suppressor Diode, 5000W, 170V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMCJ, 2 PIN

5.0SMLJ170A-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AB
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other featuresEXCELLENT CLAMPING CAPABILITY, PRSM-MIN
Maximum breakdown voltage209 V
Minimum breakdown voltage189 V
Breakdown voltage nominal value199 V
Maximum clamping voltage275 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation5000 W
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation6.5 W
Certification statusNot Qualified
Maximum reverse current5 µA
Reverse test voltage170 V
surface mountYES
technologyAVALANCHE
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Base Number Matches1
MCC
Features
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
5.0SMLJ11A
THRU
5.0SMLJ400A
Transient
Voltage Suppressor
11 to
400
Volts
5000 Watt
DO-214AB
(SMC) (LEAD
FRAME)
G
Halogen
free available upon request by adding suffix "-HF"
For surface mount application in order to optimize board space
Low profile package
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Glass passivated junction
Excellent clamping capability
Repetition Rate( duty cycle): 0.01%
Fast response time: typical less than 1ps from 0V to BV min
Typical I
D
less than 1uA above 10V
High temperature soldering: 260 C/10 seconds at terminals
o
Low Inductance
Built in strain relief
UL Recognized File #
E480232
D
H
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
Standard packaging: 16mm tape per ( EIA 481).
Weight: 0.007 ounce, 0.21 gram
DIM
A
B
C
D
E
F
G
H
A
C
E
B
F
DIMENSIONS
INCHES
MIN
.079
.115
.002
.006
.030
..305
.260
.220
MM
MIN
2.00
2.92
0.051
0.152
0.76
7.75
6.60
5.59
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PPM
See
page 2,3
Amps
10/1000us
waveform(Note2)
Peak Pulse Power
P
PPM
Disspation on 10/1000us
waveform(Note2,3)
Power
Dissipation on infinite
P
D
heat sink at T
L
=75
o
C
Operation And Storage
T
J
,
Temperature Range
T
STG
Minimum
5000
Watts
Watts
MAX
.103
.121
.008
.012
.060
.320
.280
.245
MAX
2.62
3.07
0.203
0.305
1.52
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190"
6.5
-55 C to
+175
o
C
o
0.125”
0.070”
Note:
1.
2.
3.
4.
High Temperature Solder Exemptions Applied,see EU Directive Annex 7.
o
Non-repetitive current pulse and derated above TA=25 C
2
Mounted on 8.0mm copper pads to each terminal.
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
Revision:
J
www.mccsemi.com
1 of
5
2015/12/30
avr studio4 register problem
How can I see the data in the defined variable a in avr studio4? I am very anxious and hope that kind people can help me. Thank you in advance!...
jiayidan6 Microchip MCU
Why is there no memory map for command register, data register, and address register in the NAND01G-B datasheet?
DSP is connected to NAND flash through EMIFA. The model of NAND flash is NAND01GW3A. But why is there no memory mapping address of command register, data register and address register in the datasheet...
georon DSP and ARM Processors
Help: Please recommend a company that can open computer motherboards (x86), thank you 2!
Ask: Our company wants to find a company to make a computer motherboard! Please recommend some companies with this ability! QQ:19335776 EMAIL:LSH9982008@163.COM Thank you!...
leadsky Embedded System
The process of writing bin files to nandflash using openjtag on s3c6410, the problem of nand erase command in openocd
[i=s] This post was last edited by 人丑鬼见愁 on 2015-7-9 18:45 [/i] When s3c6410 uses openjtag to write bin file to nandflash, nand erase command cannot be executed. The problem is shown in the figure...
人丑鬼见愁 ARM Technology
What is the difference between plug and play and hot swap?
I have searched Google and Baidu for this question, but I still don't understand it. I just touched on the topic of driver development. I hope to get a simple explanation from everyone. Don't give me ...
hzwwqq Embedded System
What is the commonly used version of iarforSTM32
What is the commonly used version of iar for STM32...
wq1127 stm32/stm8

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1952  2786  795  1840  281  40  57  17  38  6 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号