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ZL50409GDG2

Description
DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-192, LBGA-208
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,141 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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ZL50409GDG2 Overview

DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-192, LBGA-208

ZL50409GDG2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeBGA
package instructionLBGA,
Contacts208
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B208
JESD-609 codee1
length17 mm
Number of functions1
Number of terminals208
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.4 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
Base Number Matches1
ZL50409
Managed 9FE Layer-2 Ethernet Switch
Data Sheet
Zarlink Features
Integrated Single-Chip 10/100 Mbps Ethernet
Switch
• Eight 10/100 Mbps auto-negotiating Fast
Ethernet (FE) ports with RMII, MII, GPSI,
Reverse MII & Reverse GPSI interface options
• One 10/100 Mbps auto-negotiating port with
MII interface option, that can be used as a
WAN uplink or as a 9th port
• a 10/100 Mbps Fast Ethernet (FE) CPU port
with Reverse MII interface option
Embedded 2.0 Mbits (256 KBytes) internal
memory for control databases and frame data
buffer
• Supports jumbo frames up to 4 KBytes
CPU access supports the following interface
options:
• 8/16-bit ISA interface
• Serial interface with MII port; recommended
for light management
• Serial interface in lightly managed mode, or in
unmanaged mode with optional I
2
C EEPROM
interface
Ethernet IEEE 802.3x flow control for full duplex
ports, back pressure flow control for half duplex
ports
Ordering Information
ZL50409GDC
ZL50409GDG2
208-Ball LBGA
208-Ball LBGA**
August 2006
**Pb Free Tin/Silver/Copper
-40°C to +85°C
Built-in reset logic triggered by system
malfunction
Built-In Self Test for internal SRAM
IEEE-1149.1 (JTAG) test port
L2 Switching
L2 switching
• MAC address self learning, up to 4 K MAC
addresses
• MAC address table supports unicast and
multicast MAC address and IP multicast
address learning
Supports IP Multicast with IGMP snooping, up to
4 K IP Multicast groups
C
P
U
8/16-bit
or
Serial
ZL50409
MII
MII
9-Port 10/100M
Ethernet Switch
EEPROM
I
2
C
10/100
PHY
RMII / MII / GPSI
Quad
10/100
PHY
Quad
10/100
PHY
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50409GDG2 Related Products

ZL50409GDG2 ZL50409GDC
Description DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-192, LBGA-208 DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208
Is it lead-free? Lead free Contains lead
Is it Rohs certified? conform to incompatible
Maker Microsemi Microsemi
Parts packaging code BGA BGA
package instruction LBGA, LBGA, BGA208,16X16,40
Contacts 208 208
Reach Compliance Code compliant compliant
JESD-30 code S-PBGA-B208 S-PBGA-B208
JESD-609 code e1 e0
length 17 mm 17 mm
Number of functions 1 1
Number of terminals 208 208
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED 225
Certification status Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm
Nominal supply voltage 1.8 V 1.8 V
surface mount YES YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30
width 17 mm 17 mm
Base Number Matches 1 1

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