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5962-01-364-8001

Description
IC,DRAM,FAST PAGE,256KX4,CMOS,DIP,20PIN,CERAMIC
Categorystorage    storage   
File Size1MB,19 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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5962-01-364-8001 Overview

IC,DRAM,FAST PAGE,256KX4,CMOS,DIP,20PIN,CERAMIC

5962-01-364-8001 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
Reach Compliance Codenot_compliant
Maximum access time150 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T20
memory density1048576 bit
Memory IC TypeFAST PAGE DRAM
memory width4
Number of terminals20
word count262144 words
character code256000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX4
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle512
Filter level38535Q/M;38534H;883B
Maximum standby current0.003 A
Maximum slew rate0.055 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

5962-01-364-8001 Related Products

5962-01-364-8001 TMS44C256-10DJR TMS44C256-60SD
Description IC,DRAM,FAST PAGE,256KX4,CMOS,DIP,20PIN,CERAMIC IC,DRAM,FAST PAGE,256KX4,CMOS,SOJ,20PIN,PLASTIC IC,DRAM,FAST PAGE,256KX4,CMOS,ZIP,20PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant
Maximum access time 150 ns 100 ns 60 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-XDIP-T20 R-PDSO-J20 R-PZIP-T20
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 4 4 4
Number of terminals 20 20 20
word count 262144 words 262144 words 262144 words
character code 256000 256000 256000
Maximum operating temperature 125 °C 70 °C 70 °C
organize 256KX4 256KX4 256KX4
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOJ ZIP
Encapsulate equivalent code DIP20,.3 SOJ20/26,.34 ZIP20,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512
Maximum standby current 0.003 A 0.002 A 0.002 A
Maximum slew rate 0.055 mA 0.065 mA 0.095 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO YES NO
technology CMOS CMOS CMOS
Temperature level MILITARY COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL ZIG-ZAG
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Objectid - 1164774493 1164774496
package instruction - SOJ, SOJ20/26,.34 ZIP, ZIP20,.1
ECCN code - EAR99 EAR99
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