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SN54LS311J

Description
IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC
Categorystorage    storage   
File Size67KB,2 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN54LS311J Overview

IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC

SN54LS311J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
Reach Compliance Codenot_compliant
JESD-30 codeR-XDIP-T20
Memory IC TypeSTANDARD SRAM
memory width9
Number of terminals20
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16X9
Output characteristicsOPEN-COLLECTOR
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

SN54LS311J Related Products

SN54LS311J 106RN120P-2E1-18.0 SN54LS312J SN54LS211J
Description IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC D Type Connector, 120 Contact(s), Male, Crimp Terminal, Plug IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC
Reach Compliance Code not_compliant unknown not_compliant not_compliant
Is it Rohs certified? incompatible - incompatible incompatible
Maker Texas Instruments - Texas Instruments Texas Instruments
JESD-30 code R-XDIP-T20 - R-XDIP-T20 R-XDIP-T20
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM
memory width 9 - 9 9
Number of terminals 20 - 20 20
word count 16 words - 16 words 16 words
character code 16 - 16 16
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C - 125 °C 125 °C
Minimum operating temperature -55 °C - -55 °C -55 °C
organize 16X9 - 16X9 16X9
Output characteristics OPEN-COLLECTOR - OPEN-COLLECTOR 3-STATE
Package body material CERAMIC - CERAMIC CERAMIC
encapsulated code DIP - DIP DIP
Encapsulate equivalent code DIP20,.3 - DIP20,.3 DIP20,.3
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE - IN-LINE IN-LINE
Parallel/Serial PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified
surface mount NO - NO NO
technology TTL - TTL TTL
Temperature level MILITARY - MILITARY MILITARY
Terminal form THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm - 2.54 mm 2.54 mm
Terminal location DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
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