IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-XDIP-T20 |
| Memory IC Type | STANDARD SRAM |
| memory width | 9 |
| Number of terminals | 20 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16X9 |
| Output characteristics | OPEN-COLLECTOR |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| SN54LS311J | 106RN120P-2E1-18.0 | SN54LS312J | SN54LS211J | |
|---|---|---|---|---|
| Description | IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC | D Type Connector, 120 Contact(s), Male, Crimp Terminal, Plug | IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC | IC,SRAM,16X9,LS-TTL,DIP,20PIN,CERAMIC |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |
| JESD-30 code | R-XDIP-T20 | - | R-XDIP-T20 | R-XDIP-T20 |
| Memory IC Type | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM |
| memory width | 9 | - | 9 | 9 |
| Number of terminals | 20 | - | 20 | 20 |
| word count | 16 words | - | 16 words | 16 words |
| character code | 16 | - | 16 | 16 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | - | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C |
| organize | 16X9 | - | 16X9 | 16X9 |
| Output characteristics | OPEN-COLLECTOR | - | OPEN-COLLECTOR | 3-STATE |
| Package body material | CERAMIC | - | CERAMIC | CERAMIC |
| encapsulated code | DIP | - | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | - | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| surface mount | NO | - | NO | NO |
| technology | TTL | - | TTL | TTL |
| Temperature level | MILITARY | - | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |