EEWORLDEEWORLDEEWORLD

Part Number

Search

UP050UJ180J-KE-C

Description
Ceramic Capacitor, Ceramic, 50V, 5% +Tol, 5% -Tol, UJ, -750+/-120ppm/Cel TC, 0.000018uF, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size1MB,18 Pages
ManufacturerTaiyo Yuden
Environmental Compliance
Download Datasheet Parametric View All

UP050UJ180J-KE-C Overview

Ceramic Capacitor, Ceramic, 50V, 5% +Tol, 5% -Tol, UJ, -750+/-120ppm/Cel TC, 0.000018uF, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT

UP050UJ180J-KE-C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1593573388
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
capacitance0.000018 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
Manufacturer's serial numberUP
Installation featuresTHROUGH HOLE MOUNT
multi-layerNo
negative tolerance5%
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package shapeTUBULAR PACKAGE
method of packingBULK
positive tolerance5%
Rated (DC) voltage (URdc)50 V
surface mountNO
Temperature characteristic codeUJ
Temperature Coefficient-750+/-120ppm/Cel ppm/°C
Terminal shapeWIRE
アキシャルリード½セラミックコンデンサ
AXIAL LEADED CERAMIC CAPACITORS
OPERATING TEMP.
−25∼+85℃
特長 FEATURES
汎用型セラミックコンデンサで、単層½と積層½合わせて1pF∼10μFと
広い容量範囲で部品の標準化が可½
ラジアルに比べ自挿コストが安く、部品高さ½減、実装密度アップ、在
庫スペースも減少
・実装ピッチ5mmから26mmまでジャンパー線機½と兼用可½
・This
widely used ceramic capacitor includes both monolithic and multi-
layer types to provide a wide capacitance range of
1pF
through
10μF
in one standard size and shape.
・Automatic
insertion related costs are lower than with radial type capaci-
tors.
・Mounting
pitch can be between
5mm
to
26mm
which could be used as
a jumper.
用途 APPLICATIONS
Class1品は回路の温度特性補正及び周波数特性の安定化。B、F特はバイ
パスコンデンサに最適
・The
class
1
temperature compensating (NPO) products can be used in
circuits to stabilize frequency and temperature characteristics.
・The
B, and F dielectrics are optimum for bypass capacitors.
½名表記法 ORDERING
CODE
1
定格電圧
〔VDC〕
L
E
T
G
U
10
16
25
35
50
3
½状寸法
(L×φd)
〔mm〕
075
050
025
015
4.2×3.2
積層½)
3.5×1.9
単層½)
3.2×2.2
積層½)
2.3×2.0
積層½)
3.0×2.5
積層½)
5
公称静電容量
〔pF〕
010
1R2
103
※R=小数点
6
容量許容差
D−
J−
K−
M−
Z−
±0.5pF
±15%
±10%
±20%
80
± %
20
1
1.2
10000
8
梱包
B
C
つづら折り
袋づめ
2
½式
P
アキシャルリードコンデンサ
4
温度特性
CK
CH
RH
UJ
SL
△B
△F
−750±1250
(ppm
/℃)
−750±160
(ppm
/℃)
−220±160
(ppm
/℃)
−750±120
(ppm
/℃)
+350∼−1000
(ppm
/℃)
±10%
30
  %
85
△=スペース
7
リード½状
〔mm〕
A−
B−
KF
KE
NA
26mmテープ幅テーピング
52mmテープ幅テーピング
5.0ピッチフォーミング
7.5ピッチフォーミング
単品ストレートリード
9
½社管理記号
△△
△Z
△J
単層標準品
積層標準品
積層品
(½電圧タイプ)
△=スペース
U P 0 5 0 C H 1 0 0 J _ A _ B
○○
1
1
Rated voltage VDC〕
L
E
T
G
U
10
16
25
35
50
2
3
3
4
5
5
6
6
7
8
8
Packaging
B
C
9
Outside Dimensions L×φd)
〔mm〕
4.2×3.2
multilayer type
3.5×1.9
monolithic type)
050
3.2×2.2
multilayer type
025 2.3×2.0
multilayer type
015 3.0×2.5
multilayer type
075
Nominal Capacitance pF〕
example
010
1R2
103
1
1.2
10000
※R=decimal
point
Capacitance Tolerances
D−
J−
K−
M−
Z−
±0.5pF
±15%
±10%
±20%
80
± %
20
Ammo
Bulk
2
Type  
P
Axial leaded capacitors
4
Temperature haracteristics
CK
CH
RH
UJ
SL
△B
△F
−750±1250
(ppm
/℃)
−750±160
(ppm
/℃)
−220±160
(ppm
/℃)
−750±120
(ppm
/℃)
+350∼−1000
(ppm
/℃)
±10%
30
  %
85
△=Blank
space
7
Lead Configuration
A−
B−
KF
KE
NA
26mm
lead space, ammo pack
52mm
lead space, ammo pack
5.0mm
pitch formed lead
bulk
7.5mm
pitch formed lead
bulk
Axial lead, bulk
9
Internal code
△△
△Z
△J
Monolithic type
Standard products
Multilayer type
Standard products
Multilayer type
(Low voltage products)
△=Blank
space
120
8
Could you please provide a stable 1.25V voltage reference source?
Could you please provide a 1.25V voltage reference source? I don't know if the LM317 reference is stable. Thank you....
ctwolf_ren Microcontroller MCU
[TI's First Low Power Design Competition] Dual Serial Port Interrupt
[i=s]This post was last edited by ljj3166 on 2014-9-29 00:58[/i] [b][size=3]I'm going out tomorrow and I handed in my homework today, roooo{:1_133:} Originally I planned to use the w5100 module to com...
ljj3166 Microcontroller MCU
Is there a QQ group for launchpad?
I have searched through all the pinned posts but I can't find any communication groups. I don't know if there is such a Q group, after all, communication in Q groups is more immediate....
lanchaohuan Microcontroller MCU
Is this true? Friends in Beijing, please check it out!
A few young people in Beijing spent 120,000 yuan and 3 months to build a "smart 9-square-meter villa" controlled by a mobile phone near the Third Ring Road. The bedroom, kitchen and bathroom are all a...
yaoniming3k Talking
∑ -μ03 HELP2416 Use Buildroot to build a GCC cross-compilation environment!
[i=s]This post was last edited by DavidZH on 2014-7-12 19:00[/i] 1. Use Buildroot to build the GCC cross-compilation tool 1. Download the required software: Buildroot URL:[code]http://buildroot.uclibc...
DavidZH Embedded System
How to design and implement dual network card hot backup (dual network card redundant backup) (2)?
Hello? Under WIN2000, Ethernet network, dual network card hot backup, that is, if one network card is broken, the other redundant network card will hot switch, and the two network cards have the same ...
yangrui7202 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 749  947  1341  152  512  16  20  27  4  11 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号