4306K-102-75R0FBAL datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> 4306K-102-75R0FBAL

4306K-102-75R0FBAL: DescriptionArray/Network Resistor, Isolated, Thin Film, 0.25W, 75ohm, 50V, 1% +/-Tol, -50,50ppm/Cel, 5808,; CategoryPassive components The resistor; File Size198KB，2 Pages; ManufacturerBourns; Websitehttp://www.bourns.com; Environmental Compliance

Download Datasheet Parametric View All

4306K-102-75R0FBAL Overview

Array/Network Resistor, Isolated, Thin Film, 0.25W, 75ohm, 50V, 1% +/-Tol, -50,50ppm/Cel, 5808,

4306K-102-75R0FBAL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	770361825
Reach Compliance Code	not_compliant
Country Of Origin	Costa Rica
ECCN code	EAR99
YTEOL	6.9
structure	Molded
JESD-609 code	e3
Lead length	3.43 mm
lead spacing	2.54 mm
Network Type	Isolated
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package height	4.95 mm
Package length	14.83 mm
Package form	SIP
Package width	2.16 mm
Rated power dissipation(P)	0.25 W
resistance	75 Ω
Resistor type	ARRAY/NETWORK RESISTOR
series	4300K
size code	5808
technology	THIN FILM
Temperature Coefficient	50 ppm/°C
Terminal surface	Matte Tin (Sn)
Tolerance	1%
Operating Voltage	50 V

Preview

Download Datasheet

View All

VE S CO

AV R M

AI SIO PL

LA N IA

BL S NT

Features

■

RoHS compliant* (see How to Order

“Termination” option)

Low profile provides compatibility with

DIPs

Also available in medium profile (4300S -

.250 ”) and high profile (4300K - .350 ”)

Marking on contrasting background

■

Custom circuits available per factory

4300T, S, K Series - Thin Film Molded SIP

Product Characteristics

Resistance Range

Bussed ...................49.9 to 100K ohms

Isolated ......................20 to 200K ohms

Series.........................20 to 100K ohms

Resistance Tolerance

.........................±0.1 %, ±0.5 %, ±1 %

Temperature Coefficient

..................±100 ppm/°C, ±50 ppm/°C,

±25 ppm/°C

Temperature Range ....-55 °C to +125 °C

Insulation Resistance

..................10,000 megohms minimum

TCR Tracking .........................±5 ppm/°C

Maximum Operating Voltage............50 V

Environmental Characteristics

Thermal Shock and

Power Conditioning ...................... 0.1 %

Short Time Overload ..................... 0.1 %

Terminal Strength ........................ 0.25 %

Resistance to Soldering Heat ....... 0.1 %

Moisture Resistance ..................... 0.1 %

Life .............................................. 0.50 %

Physical Characteristics

Body Material Flammability

...........................Conforms to UL94V-0

Lead Frame Material

..........................Copper, solder coated

Body Material ..................Novolac epoxy

How To Order

Package Power Temp. Derating Curve

(Low Profile, 4300T)

(

)

1.75

1.50

4311T

WATTS

1.25

1.00

.75

.50

.25

4310T

4309T

4308T

4306T

Product Dimensions

27.53

MAX.

(1.084)

22.45

MAX.

(.884)

14.83 MAX.

(.584)

24.99

MAX.

(.984)

19.92

MAX.

(.784)

PIN #1 REF.

4.95

(.195)

MAX.

.381 + .127/ - .000

(.015 + .005/ - 000)

2.54

.07

(.100

.003*)

TYP.

NON-ACCUM.

3.43 + .38/ - .25

(.135 + .015/ - .010)

1.02

.12

(.040

.005)

.483

.050

TYP.

(.020

.002)

2.16

.10

(.085

.004)

150

125

AMBIENT TEMPERATURE (

C )

Package Power Ratings at 70°C

4304 .......... ............ 0.60...... 0.80 watts

4306 ...... 0.75.......... 0.90...... 1.20 watts

4308 ...... 1.00.......... 1.20...... 1.60 watts

4309 ...... 1.13 ................................watts

4310 ...... 1.25.......... 1.50...... 2.00 watts

4311 ...... 1.38 ................................watts

1.02

.05

(.0425

.002)

.254

.050

(.010

.002)

Governing dimensions are in metric. Dimensions in parentheses

are inches and are approximate.

*Terminal centerline to centerline measurements made at point of

emergence of the lead from the body.

43 11 T - 101 - 2222 F A B __

Model

(43 = Molded SIP)

Number of Pins

Physical Config.

•T = Low Profile Thin Film

•S = Med. Profile Thin Film

•K = High Profile Thin Film

Electrical Configuration

•101 = Bussed

•102 = Isolated

•106 = Series

Resistance Code

•First 3 digits are significant

•Fourth digit represents the

number of zeros to follow.

Absolute Tolerance Code

•B = ±0.1%

•F = ±1%

•D = ±0.5%

Temperature Coefficient Code

•A = ±100ppm/°C •C = ±25ppm/°C

•B = ±50ppm/°C

Ratio Tolerance (Optional)

•A = ±0.05% to R1 •D = ±0.5% to R1

•B = ±0.1% to R1

Terminations

• L = Tin-plated (RoHS compliant version)

• Blank = Tin/Lead-plated

Consult factory for other available options.

Typical Part Marking

Represents total content. Layout may vary.

PART

NUMBER

4311T-101-

1003BB

YYWW

CIRCUIT

RESISTANCE

CODE

DATE CODE

PIN ONE

INDICATOR

MANUFACTURER'S

TRADEMARK

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Recommended Resources

Production of high-quality active two-way constant current power amplifier 02

Battery charge regulator circuit diagram

40W emergency fluorescent light circuit

Same-line telephone switching circuit (2)

Switching integrated regulated power supply with output current of 4A

Infrared transmitter and receiver power supply circuit diagram

TI Wireless Products RF Hardware FAQ: 1. How to find the right chip reference design and application guide?Search the chip model on the TI official website and you will reach the product homepage of this chip in the search results. The da...; 灞波儿奔 Wireless Connectivity

In my RPG game, I need to draw a large bitmap in real time, but it flickers a lot.: How to use the so-called double buffering technology to walk...; fgfgfg Embedded System

【TI's First Low Power Design Competition】Intelligent Environmental Monitoring System (II) Software: [align=left]After the node is powered on, it starts running the program. First, it searches for the network and joins it. After joining the network, it will automatically determine whether it has rece...; shallowmy Microcontroller MCU

Modelsim SE simulation problem: To use Modelsim SE to do post- simulation of PCI interface , the steps are as follows: first, create a new folder test in the root directory of Modelsim, put the interface module (top-level module pci...; eeleader FPGA/CPLD

Embedded software design based on ARM: A general overview of embedded software design...; yimingboy ARM Technology

Redmi phone schematic.PDF: Share some information for this DIY mobile phone...; kent19900125 DIY/Open Source Hardware

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components