1333-2-18-21 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> The connector> 1333-2-18-21

1333-2-18-21: DescriptionBoard Connector, 18 Contact(s), 1 Row(s), Male, Right Angle, 0.05 inch Pitch, Surface Mount Terminal, Locking, Receptacle; CategoryThe connector The connector; File Size123KB，1 Pages; ManufacturerConexcon Group; Environmental Compliance

Download Datasheet Parametric View All

1333-2-18-21 Overview

Board Connector, 18 Contact(s), 1 Row(s), Male, Right Angle, 0.05 inch Pitch, Surface Mount Terminal, Locking, Receptacle

1333-2-18-21 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	307200179
Reach Compliance Code	unknown
ECCN code	EAR99
body width	0.197 inch
subject depth	0.293 inch
body length	1.048 inch
Body/casing type	RECEPTACLE
Connector type	BOARD CONNECTOR
Contact to complete cooperation	SN ON NI
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact resistance	15 mΩ
Contact style	BLADE PIN-SKT
Dielectric withstand voltage	750VAC V
Durability	25 Cycles
maximum insertion force	4.8928 N
Insulation resistance	1000000000 Ω
Manufacturer's serial number	1333
Plug contact pitch	0.05 inch
Installation option 1	LOCKING
Installation method	RIGHT ANGLE
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	1
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	STAGGERED
PCB contact row spacing	5.9944 mm
polarization key	POLARIZED HOUSING
Rated current (signal)	1.2 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	2.54 mm
Termination type	SURFACE MOUNT
Total number of contacts	18
Evacuation force-minimum value	.973 N

Preview

Download Datasheet

View All

TOP ENTRY SMT MALE CONNECTOR

1333 SERIES.

1.27 mm. (0.050”) pitch.

General Features

Electrical Features



Available in 4 through 26 circuits

Mates with 1.27 mm. IDC connectors 1330 series

Allows connections cable to PCB



Voltage rating: < 250V

Current rating: < 1.20 A

Contact resistance: < 15 mΩ

Dielectric withstanding Voltage: 750 V AC/minute

Insulation resistance: >1000 MΩ

Capacitance: < 2 pF at 1 KHz

Materials

Mechanical Features

Pin retention force to insulator: > 0,15 Kgf

Mating force: < 0.50 Kgf per contact

Un-mating force: > 0.10 Kgf per contact

Durability: 25 cycles



Insulator: High temperature plastic UL 94V-0

Terminal: Phosphor bronze

Operating temperature. -40ºC to +105ºC

RoHS compliant

Dimension Information

Circuit 1

.161

4.1

1.27

.050

.094

2.4

.197

5.0

Ordering Information:

Pad

1333 -

2.15

.085

T-

XX-

1.05

.041

1.05

.041

1. Connector Series

1.8

.071

2. (T) Contact Plating



1.2±0.1

.047±.004

T =

Tin over nickel plated

3. (XX) Number of circuits

A±0.05

1.27±0.05

.050±0.02

2.54±0.05

.100±0.02

Available in 4 through 26 circuits

4. (C) Connector Options

.041



C=1. With positioning pegs;

6.40mm.

C=2. Without positioning pegs;

6.40mm.

C=3. With positioning pegs;

2.60mm

C=4. Without positioning pegs;

2.60mm

.083±0.02

.079±0.04

.315±0.04

2.1±0.05

2.0±0.1

8.0±0.1

C±0.10

2.00

5. (E) Packing Options

E =

Tube + Pad

E =

Reel + Pad

RECOMMENDED PCB LAYOUT

Dimensions:

(In mm.)

= 1.27 x (XX-1)

= 1.27 x (XX)+3.75

= 1.27 x (XX)+2.58

* XX

(Nº of circuits)

A-XX

FULL LINE CATALOGUE

Recommended Resources

Frequency conversion switching regulator circuit

Ride controls operated with eight-position pushbutton

Set battery low voltage threshold circuit diagram b

555 infrared remote control switch circuit (3)

Computer motherboard circuit diagram 810 3_22

Urgent help!! RAID product problem, if you have used RAID, please come and have a look!!: I am now using a high-capacity TB-class disk array product. After the disk array was installed, everything was normal. I used two of the 16 hard disks to configure RAID1, and then mapped the array and...; lszcp Embedded System

Internationally leading LED lighting cooling technology: [hide]The technology is to bond a copper coating of a certain thickness on the surface of the aluminum heat sink substrate by metallurgical bonding, creatively realize the low-temperature direct weldi...; 探路者 LED Zone

STC89C52RC cannot be programmed: There is a single-chip STC89C52RC that cannot be burned. The software is STC ISP V488. After connecting it to the computer, the options are corresponding, but it still cannot connect and does not hand...; feida Microchip MCU

16 trillion! Another giant is mired in debt, leaving Jack Ma with a problem: Ren Zhengfei once said: Huawei may be only one step away from death! [size=13px] [/size] [size=13px]In this era of rapid change, this sentence is not only applicable to developing companies that are j...; 兰博 Talking

ARM7+LPC+213x+214x+Volume 1: ARM7+LPC+213x+214x+Volume 1...; Martin_Pan ARM Technology

Functions of common PIC series 8-bit microcontroller chip pin symbols: Functions of common PIC series 8- bit microcontroller chip pin symbols...; rain Microchip MCU

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components