SNJ54HC107J datasheet, PDF - EEWORLD Datasheet

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SNJ54HC107J: DescriptionIC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,CERAMIC; Categorylogic logic; File Size358KB，7 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SNJ54HC107J Overview

IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,CERAMIC

SNJ54HC107J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T14
Logic integrated circuit type	J-K FLIP-FLOP
Number of functions	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Trigger type	NEGATIVE EDGE
Base Number Matches	1

SNJ54HC107J Related Products

	SNJ54HC107J	SNJ54HC107FK	SNC54HC107FK	SNC54HC107J	SN74HC107D-TR
Description	IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,SOP,14PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-XDIP-T14	S-XQCC-N20	S-XQCC-N20	R-XDIP-T14	R-PDSO-G14
Logic integrated circuit type	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP
Number of functions	2	2	2	2	2
Number of terminals	14	20	20	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	QCCN	QCCN	DIP	SOP
Encapsulate equivalent code	DIP14,.3	LCC20,.35SQ	LCC20,.35SQ	DIP14,.3	SOP14,.25
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	SMALL OUTLINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL
Trigger type	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE
Base Number Matches	1	1	1	1	1
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	-

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