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CHP1/2-100-1000-G

Description
melf resistors 2010 100 2% 100ppm
CategoryPassive components   
File Size123KB,3 Pages
ManufacturerAll Sensors
Environmental Compliance
Download Datasheet Parametric View All

CHP1/2-100-1000-G Overview

melf resistors 2010 100 2% 100ppm

CHP1/2-100-1000-G Parametric

Parameter NameAttribute value
ManufactureTT electronics
Product CategoryMELF Resistors
RoHSYes
Resistance100 Ohms
Power Rating500 mW (1/2 W)
Tolerance2 %
Temperature Coefficie100 PPM / C
Voltage Rating300 V
Case Diamete5.08 mm
Case Length2.01 mm
Operating Temperature Range- 55 C to + 125 C
PackagingReel
ProducMELF Resistors
Factory Pack Quantity1500
CHP
Cylindrical High Power
Surface Mount Metal Glaze
TM
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
60/40 Solder over
nickel barrier
Electrical Data
IRC
Type
Indus-
try
Foot-
print
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
1206
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
0.2 to 0.99
500
1000
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See page 8 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
CHP Series Issue June 2010 Sheet 1 of 3
Test Method
MIL-R-55342H Par 3.16 (-55°C + 125°C)
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
for 5 seconds
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 1mm so as to
exert pull on chip contacts for 5 seconds
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
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