CP2512K63R4F datasheet, PDF - EEWORLD Datasheet

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CP2512K63R4F: DescriptionFixed Resistor, Thin Film, 2W, 63.4ohm, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP; CategoryPassive components The resistor; File Size169KB，2 Pages; ManufacturerThin Film Technology Corp (TFT); Environmental Compliance

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CP2512K63R4F Overview

Fixed Resistor, Thin Film, 2W, 63.4ohm, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP

CP2512K63R4F Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1732684541
package instruction	, 2512
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-609 code	e3
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Rated power dissipation(P)	2 W
Rated temperature	70 °C
resistance	63.4 Ω
Resistor type	FIXED RESISTOR
size code	2512
surface mount	YES
technology	THIN FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	1%

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Product Family:

High Power Chip Resistor

Construction:

•

99.5% BeO or 99.6% Alumina Ceramic

•

Nickel alloy thin film resistive element

•

Epoxy-resin overcoat

•

Pre-tinned (Sn100, matte) terminations

over Ni barrier

Features:

•

TCR’s to ± 25ppm

•

Tolerances less than ± 1%

•

Custom and standard sizes available

•

High volume production, suitable for

commercial and special applications

Description:

These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A

lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,

much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.

The BP series effectively integrates the power resistor with the board, providing a thermal resistance comparable with aluminum

heat-sinks.

Dimensions:

Size

Inch

2512

2525

Metric

6332

6363

6.3 ± 0.2

Dimensions (mm)

3.2 ± 0.2

1.1 ± 0.1 (BP)

0.7± 0.1 (CP)

6.3 ± 0.2

1.1 ± 0.1 (BP)

0.7± 0.1 (CP)

T-top

0.9 ± 0.2

T-btm

2.0 ± 0.2

Call for other sizes

Electrical Specifications:

Size: Inch (Metric)

Rated Power at 70ºC

(BeO)

Rated Power at 70ºC

(Alumina)

Rated Voltage

Resistance Tolerance

Resistance Values

TCR (ppm/ºC)

Operating Temperature Range

Insulation Resistance (100V, 1min)

Derating Curve:

2512 (6332) 2525 (6363)

Up to 5W

Up to 8W

Up to 2W

Up to 3W

√(PxR)

± 1 to 5%

5 to 200

Ω,

call for other

values

± 25 to 200

-55 to 150ºC

> 1G

Ω

Notes:

1. Dependent on effective thermal conductivity of board construction/land design and size of board - greater power capability for

board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of

reflowing solder bonds before device damage occurs.

2. Per MIL-PRF-55342 (-55/25/125ºC).

3. Per MIL-PRF-55342, see derating curve.

4. Per IEC 60115-1.

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