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CPA2512K2000JS

Description
Fixed Resistor, Thin Film, 2W, 200ohm, 5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP
CategoryPassive components    The resistor   
File Size171KB,2 Pages
ManufacturerThin Film Technology Corp (TFT)
Environmental Compliance  
Download Datasheet Parametric View All

CPA2512K2000JS Overview

Fixed Resistor, Thin Film, 2W, 200ohm, 5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP

CPA2512K2000JS Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1731252831
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)2 W
Rated temperature70 °C
resistance200 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Product Family:
High Power Chip Resistor
Construction:
99.5% BeO or 99.6% Alumina Ceramic
Nickel alloy thin film resistive element
Epoxy-resin overcoat
Pre-tinned (Sn100, matte) terminations
over Ni barrier
Features:
TCR’s to ± 25ppm
Tolerances less than ± 1%
Custom and standard sizes available
High volume production, suitable for
commercial and special applications
Description:
These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A
lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,
much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.
The CPB series effectively integrates the power resistor with the board, providing a thermal resistance comparable with aluminum
heat-sinks.
Dimensions:
Size
Inch
Metric
2512
6332
2525
6363
L
6.3 ± 0.2
6.3 ± 0.2
Dimensions (mm)
W
H
3.2 ± 0.2
1.1 ± 0.1 (CPB)
0.7± 0.1 (CPA)
6.3 ± 0.2
1.1 ± 0.1 (CPB)
0.7± 0.1 (CPA)
T-top
0.9 ± 0.2
0.9 ± 0.2
T-btm
2.0 ± 0.2
2.0 ± 0.2
Call for other sizes
Electrical Specifications:
Size: Inch (Metric)
Rated Power at 70ºC
1
(BeO)
Rated Power at 70ºC
1
(Alumina)
Rated Voltage
Resistance Tolerance
Resistance Values
TCR (ppm/ºC)
Operating Temperature Range
3
Insulation Resistance (100V, 1min)
4
2
Derating Curve:
2512 (6332) 2525 (6363)
Up to 5W
1
Up to 8W
1
Up to 2W
1
Up to 3W
1
√(PxR)
± 1 to 5%
5 to 200
Ω,
call for other
values
± 25 to 200
-55 to 150ºC
> 1G
Notes:
1. Dependent on effective thermal conductivity of board construction/land design and size of board - greater power capability for
board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of
reflowing solder bonds before device damage occurs.
2. Per MIL-PRF-55342 (-55/25/125ºC).
3. Per MIL-PRF-55342, see derating curve.
4. Per IEC 60115-1.
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