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MCI1206H561KB

Description
General Purpose Inductor, 0.56uH, 10%, Ferrite-Core, 1206,
CategoryPassive components    inductor   
File Size298KB,5 Pages
ManufacturerAEM [ American Electronic Materials]
Download Datasheet Parametric View All

MCI1206H561KB Overview

General Purpose Inductor, 0.56uH, 10%, Ferrite-Core, 1206,

MCI1206H561KB Parametric

Parameter NameAttribute value
Objectid941775262
package instruction1206
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes1206
structureMultilayer Chip
core materialFerrite
DC Resistance0.7 Ω
Nominal inductance(L)0.56 µH
Inductor typeGENERAL PURPOSE INDUCTOR
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package height1.1 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingBulk
Minimum quality factor (at nominal inductance)25
Maximum rated current0.15 A
self resonant frequency115 MHz
seriesMCI(1206)
Tolerance10%
AEM, Inc.
Multilayer Ferrite Inductors
Features
Monolithic structure for closed magnetic path eliminating crosstalk
and providing high reliability in wide temperature and humidity
range
Standard EIA/EIAJ chip sizes such as 0603/1608, 0805/2012, and
1206/3216
Superior termination bonding strength
Nickel barrier with solder overplated termination offering excellent
solderability and solder leach resistance, suitable for both wave and
reflow soldering processes
Operating Temperature
-25ºC — +85ºC
Product Identification
MCI 0603 J 152 K T - T
(1) (2) (3) (4) (5) (6) (7)
(1) Series code:
MCI: Multilayer Ferrite Inductor
(2) Dimensions: L x W inches
The first two digits: L (length)
The last two digits: W (width)
(3) Characteristic code: H, J
(4) Value code: Inductance (nH)
The first two digits are significant. The last
digit specifies the number of zeros to follow.
(5) Tolerance code:
K = ±10%
M = ±20%
(6) Package code:
T = Tape & Reel
B = Bulk
(7) Termination type code:
T = 100% Sn Plated (Lack of this code
defaults to Sn/Pb plated termination)
Applications
Prevention of electromagnetic interference to signal for high density
circuits in disk drives, personal computers, measuring equipment,
and telephone equipment
Recommended PC Board Land Patterns
CHIP SIZE
EIA/EIAJ
0603(1608)
0805(2012)
1206(3216)
L
INCH (mm)
0.102 (2.60)
0.118 (3.00)
0.173 (4.40)
G
INCH (mm)
0.022 (0.55)
0.026 (0.66)
0.059 (1.50)
H
NCH (mm)
0.037 (0.94)
0.057 (1.45)
0.071 (1.80)
Shape and Dimensions
G
H
SILVER
METALLIZATION
T
SOLDER
W
NICKEL
L
L
ELECTRODE
BW
CHIP SIZE
EIA/EIAJ
0603/1608
LENGTH (L)
INCH (mm)
0.063 ± 0.006
(1.60 ± 0.15)
WIDTH (W)
INCH (mm)
0.031 ± 0.006
(0.80 ± 0.15)
THICKNESS (T)
INCH (mm)
0.031 ± 0.006
(0.80 ± 0.15)
<2.7µH
0.035 ± 0.008
(0.90 ± 0.20)
≥2.7µH
0.049 ± 0.008
(1.25 ± 0.20)
0.043 ± 0.08
(1.10 ± 0.20)
TERMINATION (BW)
INCH (mm)
0.014 ± 0.006
(0.36 ± 0.15)
0805/2012
0.079 ± 0.008
(2.00 ± 0.20)
0.049 ± 0.008
(1.25± 0.20)
0.020 ± 0.010
(0.51 ± 0.25)
1206/3216
0.126 ± 0.008
(3.20 ± 0.20)
0.063 ± 0.008
(1.60 ± 0.20)
0.020 ± 0.010
(0.51 ± 0.25)
23
11525 Sorrento Valley Road, San Diego, CA 92121, U.S.A.
www.aem-usa.com
Phone: (858)481-0210, Fax: (858)481-1123

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