The properly and electrostatically measured taping materials are used for the components, but attention should be paid to the fact that there is some danger the parts absorb on the top
tapes to cause a failure in the mounting and the parts are destructed by static electricity (more than 1kV : 1J, 2A, 2B, 2E 0.5kV : 1E, Human Body Model 100pF 1.5kΩ) to change the
resistance in the conditions of an excessive dryness or after the parts are given vibration for a long time as they are packaged on the tapes. Similarly, care should be given not to apply the
excessive static electricity when mounting on the boards.
●
Ionic impurities such as flux etc. that are attached to these products or those mounted onto a PCB, negatively affect their moisture resistance, corrosion resistance, etc. The flux may
contain ionic substances like chlorine, acid, etc. while perspiration and saliva include ionic impurities like sodium (Na
＋
), chrorine (Cl
−
) etc. Therefore these kinds of ionic substances may
induce electrical corrosion when they invade into the products. Either thorough washing or using RMA solder and flux are necessary since lead free solder contains ionic substances.
Washing process is needed, before putting on moisture proof material in order to prevent electrical corrosion.
●
Please pay attention that the top of an iron does not direct touch to the components. There is a risk that may cause a change in resistance. Take care that another risk may happen that
the protecting coat is carbonized in an instant when touched directly by the top of the iron, also climatic-proof for electric corrosion or insulation of protecting coat may be dropped down.
Be sure not to give high temperature on the top of the iron as it will degrade the protecting coat.
●
Avoid storing components under direct sun rays, high temperature/humidity. Direct sun rays will cause quality change of taping and difficulty of keeping appropriate peeling strength. 5∼
35℃/35∼75%RH, there is no deterioration of solderability for 12 months, but take special care for storing, because condensation, dust, and toxic gas like hydrogen sulfide, sulfurous acid
gas, hydrogen chloride, etc. may drop solderability.
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introduction
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1 Introduction
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Engineers who are new to wireless design and wireless product development need to master the basics of
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. In many cases, this process is to enable engineers who have been engag...[Details]
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introduction
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MOSFETs are widely used as power switching elements in regulators and motor controllers. They are available as discrete devices or integrated into ICs in various H-bridge configurations.
A hig...[Details]
Semiconductor devices used in high-end computing (advanced microprocessors) and consumer electronics (graphics and gaming chipsets) devices generally provide data rates up to 6.4Gbps through hig...[Details]
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1 Introduction
Reliability research originated from weapon systems. After nearly half a century of development, it has become an engineering discipline that covers all disciplines and industri...[Details]
Application of TWLA500 in ADC and related fields
FAE: On-site technical support.
Provide technical support for the application of the products you sell, and handle quality issues ra...[Details]
Embedded System
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