MASK ROM, 8KX8, 55ns, CMOS, CDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknow |
| Maximum access time | 55 ns |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 65536 bi |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8KX8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535V;38534K;883S |
| Maximum standby current | 0.002 A |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MAS3764TCS | MAS3764TCB | MAT3764TCB | |
|---|---|---|---|
| Description | MASK ROM, 8KX8, 55ns, CMOS, CDIP28 | MASK ROM, 8KX8, 55ns, CMOS, CDIP28 | MASK ROM, 8KX8, 55ns, CMOS, CDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknow | unknown | unknown |
| Maximum access time | 55 ns | 55 ns | 55 ns |
| JESD-30 code | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 65536 bi | 65536 bit | 65536 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 |
| Number of terminals | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 8KX8 | 8KX8 | 8KX8 |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 |