combined to bring OptoMOS technology, reliability,
and compact size to a new family of high power solid
state relays. As part of that family, the CPC1981
is a 1-Form-A solid state relay. The CPC1981
employs optically coupled MOSFET technology
to provide 2500V
rms
of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED. The combination of
low on-resistance and high load current handling
capabilities makes the relay suitable for a variety of
high performance switching applications.
Features
Handle Load Currents Up to 0.25A
2500V
rms
Input/Output Isolation
Power SIP Package
High Reliability
No Moving Parts
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Machine Insertable, Wave Solderable
•
•
•
•
•
•
Approvals
•
UL 508 Recognized Component: File E69938
•
CSA Certified Component: Certificate 1172007
Applications
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
IC Equipment
•
Home Appliances
•
•
•
•
•
Ordering Information
Part #
CPC1981Y
Description
Power SIP Package (25 per tube)
Pin Configuration
1
-
2
+
3
4
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-CPC1981-R05
e
3
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1
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NTEGRATED
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation
1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
CPC1981
Ratings
1000
5
50
1
150
2500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Operating Voltage
Load Current, Continuous
Peak Load Current
On-Resistance
1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input to Output
1
Conditions
-
free air
t=10ms
I
L
=10mA
V
L
=1000V
I
F
=10mA, V
L
=10V
V
L
=30V, f=10MHz
I
L
=1.0A
-
I
F
=5mA
V
R
=5V
f=1MHz
Symbol
V
L
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
Min
5
-
-
-
-
-
-
-
-
0.6
0.9
-
-
Typ
-
-
-
12.3
-
-
-
31
-
-
1.2
-
2
Max
600
0.18
1.1
18
1
10
5
-
10
-
1.4
10
-
Units
V
rms
or V
DC
A
rms
A
rms
µA
ms
pF
mA
mA
V
µA
pF
Measurement taken within 1 second of on-time.
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Conditions
-
Symbol
R
JC
Min
-
Typ
1.5
Max
-
Units
°C/W
2
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PERFORMANCE DATA*
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage (V)
CPC1981
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA, T
A
=25ºC)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=120mA
DC
, T
A
=25ºC)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=120mA
DC
, T
A
=25ºC)
1.4
1.7
2.0
2.3
Turn-On (ms)
2.6
2.9
Device Count (N)
0.009 0.010
0.011 0.012
Turn-Off (ms)
0.013
0.014
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=120mA
DC
, T
A
=25ºC)
35
30
Device Count (N)
Device Count (N)
12.1
12.2
12.3
12.4
12.5
12.6
25
20
15
10
5
0
On-Resistance ( )
35
30
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, T
A
=25ºC)
1044
1052
1060
1068
1076
1084
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
Turn-On (ms)
1.4
I
F
=50mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=20mA
I
F
=10mA
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Typical Turn-On vs.LED Forward Current
(I
L
=100mA
DC
)
0.09
0.08
0.07
Turn-Off (ms)
0.06
0.05
0.04
0.03
0.02
0.01
0
Typical Turn-Off vs. LED Forward Current
(I
L
=100mA
DC
)
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA
DC
)
1400
1200
Turn-On ( s)
1000
800
600
400
200
0
Typical Turn-On vs. Temperature
(I
L
=100mA
DC
)
I
F
= 10mA
Turn-Off (ms)
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
Typical Turn-Off vs. Temperature
(I
L
=100mA
DC
)
LED Current (mA)
I
F
=20mA
I
F
= 20mA
I
F
=10mA
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
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PERFORMANCE DATA*
Typical On-Resistance vs. Temperature
(I
L
=0.18A
rms
)
I
F
=5mA
I
F
=10mA
Typical Load Current vs. Load Voltage
(I
F
=5mA, T
A
=25ºC)
0.25
0.20
0.15
0.10
0.05
0
-0.05
-0.10
-0.15
-0.20
-0.25
0.35
0.30
Load Current (A)
0.25
0.20
0.15
0.10
0.05
-3
-2
-1
0
1
2
3
0.00
-40
-20
0
20
40
60
CPC1981
Typical Maximum DC
Load Current vs. Temperature
27
24
On-Resistance ( )
21
18
15
12
9
6
3
Load Current (A)
I
F
=20mA
I
F
=10mA
-40
-20
0
20
40
60
80
100
80
100
120
Temperature (ºC)
Load Voltage (V)
Temperature (ºC)
Blocking Voltage vs. Temperature
1160
Blocking Voltage (V
P
)
1140
Leakage ( A)
1120
1100
1080
1060
1040
1020
1000
-40
-20
0
20
40
60
80
100
0.21
0.18
0.15
0.12
0.09
0.06
0.03
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(V
L
=1000V
P
)
Energy Rating Curve
(Free Air, No Heat Sink)
2.00
1.75
Load Current (A)
1.50
1.25
1.00
0.75
0.50
0.25
-20
0
20
40
60
80
100
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
Temperature (ºC)
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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IVISION
Manufacturing Information
Moisture Sensitivity
CPC1981
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1981Y
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC1981Y
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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