Express-HR
Type 6
COM Express
®
Type 6 Module with 2nd Generation
Intel
®
Core™ i7/i5/i3 Processor and QM67 Chipset
Features
Intel
®
Quad or Dual Core™ i7/i5/i3 Processor
Intel
®
QM67 Chipset
Up to 16GB Dual Channel DDR3 SDRAM at
1333MHz
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1, one PCIe x16 (Gen2) for
graphics (or general purpose x8/4/1)
Two SATA 3 Gb/s, two SATA 6 Gb/s,
Gigabit Etherent, eight USB 2.0
Specifications
Core System
CPU
2nd Generation Intel Core™ i7/i5/i3, 32 nm process, BGA type
Intel
®
Core™ i7-2715QE 2.1 GHz (3.0 GHz Turbo),
6MB L3 cache, 45W (4C)
Intel
®
Core i7-2655LE 2.2 GHz (2.9 GHz Turbo),
4MB L3 cache, 25W (2C)
Intel
®
Core™ i7-2610UE 1.5 GHz (2.4 GHz Turbo),
4MB L3 cache, 17W (2C)
Intel
®
Core™ i5-2515E 2.5 GHz (3.2 GHz Turbo),
3MB L3 cache, 35W (2C)
Intel
®
Core™ i3-2310E 2.1 GHz, 3MB L3 Cache, 35W (2C)
Intel
®
Core™ i3-2340UE 1.3 GHz, 3MB L3 Cache, 17W (2C)
Intel
®
Celeron
®
B810E 1.6 GHz, 2MB L3 Cache, 35W (2C)
Intel
®
Celeron
®
847E 1.1 GHz, 2MB L3 Cache, 17W (2C)
Dual channel non-ECC 1066/1333 MHz DDR3 memory up to
16 GB in dual SODIMM socket
Intel
®
Mobile QM67 Express Chipset
6MB (i7-2715QE), 4MB(i7-2655LE and i7-2610UE),
3MB (i5-2515E)
AMI EFI with CMOS backup in 16 Mbit SPI flash with iAMT
Supply voltages and CPU temperature
XDP SFF-26 extension for ICE debug
Programmable timer range to generate RESET
PCI Express x16 (Gen2) bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
8 PCI Express x1: Lanes 0/1/2/3/4/5/6 are free, lane 7 is
occupied by GbE
LPC bus, SMBus (system) , I
2
C (user)
®
Ethernet
Chipset
Interface
Intel
®
Gigabit Ethernet PHY WG82579LM
10/100/1000 Mbps Ethernet
Multi I/O and Storage
Chipset
USB
SATA
Integrated on QM67
Supports up to eight ports USB 2.0
Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s
with support for RAID 0,1,5,10
Super I/O
Connected to LPC bus on carrier if needed
Memory
Chipset
L3 Cache
BIOS
Hardware Monitor
Debug Interface
Watchdog Timer
Expansion Busses
TPM (optional)
Chipset
Type
Infineon SLB9635TT1.2
TPM 1.2
Power
Standard Voltage Input
Wide Voltage Input
Power States
Power Consumption
Smart Battery Support
ATX = 12V±5% / 5Vsb or AT = 12V±5%
ATX = 8.5~18V / 5Vsb or AT = 8.5 ~18V
Supports S0, S1, S3, S4, S5
22 W with Core™ i7-2610UE at 1.5 GHz and 2 GB memory
typical
Yes
Mechanical and Environmental
Operating Temperature
Storage Temperature
Humidity
Shock
Vibration
Compatibility
Certification
Standard: 0°C to 60°C
-20°C to 80°C
90% at 60°C
15G peak-to-peak, 11ms duration, non-operating
Non-operating: 1.88Grms, 5-500Hz, each axis
Operating: 0.5Grms, 5-500Hz, each axis
COM Express Type 6, Basic form factor 125mm x 95mm
CE, FCC, HALT
Video
Integrated in Processor
Integrated Video
Feature Support
HD Graphics 3000 at 650–1300 MHz
DirectX 10.1 and OpenGL 3.0
Intel Clear Video HD Technology
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX Video Acceleration (DXVA) support for full AVC/VC1/
MPEG2 hardware decode
VGA Interface
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA
hot plug
LVDS Interface
Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI / DVT / DisplayPort or
SDVO
Operating Systems
Windows XP(e) / Windows 7
Linux
Extended Support (BSP) Embedded XP support package
Linux 2.6.x BSP
VxWorks 6.x
AIDI Library for Windows and Linux
Standard Support
Audio
Chipset
Audio Codec
Integrated on Intel
®
PCH QM67
On Express-BASE6 carrier (ALC886)
http://www.adlinktech.com/Computer-on-Module
Functional Diagram
SODIMM 2
Processor
SFF26
1066/1333 MHz
1~8 GB DDR3
XDP
SODIMM 2
i7 / i5 / i3
Quad & Dual Core
1066/1333 MHz
1~8 GB DDR3
PCI Express x16 (Gen2)
2 x8 or 1x8 + 2x4
VGA
Dual channel 24-bit LVDS
6x PCIe x1
(port 0~5)
GbE
82579
HD Audio
2x SATA 6 Gb/s (channel 0/1)
2x SATA 3 Gb/s (channel 2/3)
8x USB 2.0 (channel 0/7)
TPM
SLB9635
DMI
FDI
DDI 1
DP / HDMI / DVI / SDVO
DDI 2
DP / HDMI / DVI
PCIe x1
(port 7)
PCH
QM67
DDI 3
DP / HDMI / DVI / eDP
PCIe x1
(port 6)
Debug
Header
LPC bus
4x GPI
4x GP0
SMBus
IC
SPI
2
GPIO
PCA9535
Monitor
ADT7490
SPI 1
BIOS
SPI 2
BIOS
BC
Ordering Information
Modules
Model Number
Description/Configuration
®
®
Accessories
Model Number
Passive Heatsinks
THSH-HR-BL
Heat Spreaders
HTS-HR-B
THSF-HR-BL
THSF-HR-BL-QC
Heatspreader for Express-HR with threaded standoffs
High Performance Heatsink with Fan for Express-HR with
threaded standoffs
High Performance Heatsink with Fan for Express-HR
Quad-Core CPU with threaded standoffs
Heatsink with Active Cooling
High Profile Heatsink for Express-HR with threaded
standoffs
Description/Configuration
Express-HR-i7-2715QE
COM Express Type 6 module with 4C Intel Core
i7-2715QE SV processor at 2.1GHz with QM67 chipset
Express-HR-i7-2655LE
COM Express
®
Type 6 module with 2C Intel
®
Core
i7-2655LE LV processor at 2.2GHz with QM67 chipset
Express-HR-i7-2610UE
COM Express
®
Type 6 module with 2C Intel
®
Core
i7-2610UE ULV processor at 1.5 GHz with QM67 Chipset
Express-HR-i5-2515E
Express-HR-i3-2310E
COM Express
®
Type 6 module with 2C Intel
®
Core
i5-2515E SV processor at 2.5 GHz with QM67 Chipset
COM Express
®
Type 6 module with 2C Intel
®
Core
i3-2310E SV processor at 2.1 GHz with QM67 Chipset
Express-HR-i3-2340UE
COM Express
®
Type 6 module with 2C Intel
®
Core
i3-2340UE ULV processor at 1.3 GHz with QM67 Chipset
Express-HR-B810E
Express-HR-B-847E
COM Express
®
Type 6 module with 2C Intel
®
Celeron
®
B810E SV processor at 1.6 GHz with QM67 Chipset
COM Express
®
Type 6 module with 2C Intel
®
Celeron
®
B847E ULV processor at 1.1 GHz with QM67 Chipset
Note: All specifications are subject to change without further notice.