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TXBE032031B

Description
heat sinks TO-5 solder glue adhesive mt.
CategoryThermal management products   
File Size137KB,2 Pages
ManufacturerCTS [CTS Corporation]
Environmental Compliance
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TXBE032031B Overview

heat sinks TO-5 solder glue adhesive mt.

TXBE032031B Parametric

Parameter NameAttribute value
ManufactureCTS
Product CategoryHeat Sinks
RoHSYes
ProducHeat Sinks
Mounting StyleScrew
Heatsink MaterialBeryllium Coppe
Fin StyleVertical
Thermal Resistance82 C/W
Width9.65 mm
Designed fTO-5
ColBlack
PackagingBulk
Factory Pack Quantity525
CTS
®
iZIF
HEAT FRAME
GENERAL DESCRIPTION
The iZIF
is a custom aluminum heat frame that integrates
the PCB retainer for improved structural integrity and thermal
efficiency (.8°C-in./W). The iZIF
is a highly reliable patent-
pending design for rugged military and aerospace circuit card
applications. It features a quarter-turn lock, uniform clamping
pressure, and can be sized to fit small daughter cards up to
9U VME. A bottom plate may also be added for additional
cooling and structural integrity. The iZIF
features a 1/8”
stainless steel socket head cap rod with beryllium copper
spring. A variety of finishes are available such as chemical
film, black anodize, and electroless nickel.
THERMAL LINKS
GENERAL DESCRIPTION
CTS’s thermal links provide superior retention because
of the 6 to 8-segment fingers versus the 2 or 3-segment
fingers available from other manufacturers. These thermal
links are offered for TO-5s, TO-8s and TO-18s with or
without BeO washer and other appropriate hardware.
They provide an effective retainer and efficient thermal
path between semiconductor and heat sinks or chassis.
There is excellent transistor retention under high
vibration and shock loads. The thermal links can be
inserted and removed multiple times without loss of
retention or damage to the finish over the entire JEDEC
case diameter range. They can be installed with a rivet or
eyelet, soldered to a PC pad or heat sink, mounted with a
single screw or with a threaded stud and hex nut.
FAN TOP SERIES
A
B
Fan Tops
“A”
Dim.
.25
.25
.25
.25
.36
.33
.12
.12
“B” Semiconductor
Dim.
Case Type
*Ø °C/W
.50
.50
.75
.75
1.25
1.25
1.25
1.25
TO-18
TO-18
TO-5
TO-5
TO-5
TO-8
TO-5
TO-8
150.0
150.0
81.1
81.1
57.7
41.0
56.6
56.6
Unplated
Part Number
Black Cadmium
Black Chem.
Material
BeCu
Brass
BeCu
Brass
Brass Fan
BeCu Retainer
Brass Fan
BeCu Retainer
Brass
Brass
TXBF-019-025U TXBF-019-025B
N.A.
TXCF-019-025U
N.A.
TXCF-019-025CB
TXBF-032-025U TXBF-032-025B
N.A.
TXCF-032-025U
N.A.
TXCF-032-025CB
TXBF2-032-036U TXBF2-032-036B
N.A.
TXBF2-050-033U TXBF2-050-033B
TXCF-125-1U
TXCF-125-2U
TXCF-125-1CB
TXCF-125-2B
N.A.
N.A.
N.A.
*Natural convection, case-ambient mounted on G10 board
18

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Description heat sinks TO-5 solder glue adhesive mt. heat sinks TO-18 2-56 screw mt. heat sinks TO-18 fan top heat sinks TO-5 4-40 screw mt.
Manufacture CTS CTS CTS -
Product Category Heat Sinks Heat Sinks Heat Sinks -
RoHS Yes Yes Yes -
Produc Heat Sinks Heat Sinks Heat Sinks -
Mounting Style Screw Screw Press Fi -
Heatsink Material Beryllium Coppe Beryllium Coppe Beryllium Coppe -
Fin Style Vertical Vertical Horizontal -
Width 9.65 mm 9.65 mm 6.25 mm -
Designed f TO-5 TO-18 TO-18 -
Col Black Black Black -
Packaging Bulk Bulk Bulk -
Factory Pack Quantity 525 110 500 -
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