Gap Pad 2500S20
®
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Features and Benefits
• Thermal conductivity: 2.4 W/m-K
• Low “S-Class” thermal resistance at
ultra-low pressures
• Ultra conformable,“gel-like” modulus
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear
and tear resistance
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Inherent Surface Tack (1 side)
Density (Bulk Rubber) (g/cc)
Heat Capacity (J/g-K)
Hardness (Bulk Rubber) (Shore 00) (1)
Young's Modulus (psi) / (kPa) (2)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs. STRAIN
TYPICAL PROPERTIES OF GAP PAD 2500S20
IMPERIAL VALUE
Light Yellow
Fiberglass
0.010 to 0.250
2
3.1
1.0
20
5
-76 to 392
>3000
6.6
10
11
METRIC VALUE
Light Yellow
Fiberglass
0.254 to 6.350
2
3.1
1.0
20
35
-60 to 200
>3000
6.6
10
11
TEST METHOD
Visual
—
ASTM D374
—
ASTM D792
ASTM E1269
ASTM D2240
ASTM D575
—
ASTM D149
ASTM D150
ASTM D257
U.L. 94
ASTM D5470
V-O
2.4
V-O
2.4
10
0.75
Gap Pad 2500S20 is a thermally conductive,
reinforced material rated at a thermal
conductivity of 2.4 W/m-K.The material is a
filled-polymer material yielding extremely soft,
elastic characteristics.The material is reinforced
to provide easy handling, converting, added
electrical isolation and tear resistance. Gap
Pad 2500S20 is well suited for low-pressure
applications that typically use fixed standoff or
clip mounting.The material maintains a
conformable, yet elastic nature that allows for
excellent interfacing and wet-out
characteristics, even to surfaces with high
roughness and/or topography.
Gap Pad 2500S20 is offered with inherent
natural tack on both sides of the material
allowing for stick-in-place characteristics during
application assembly.The material is supplied
with protective liners on both sides.The top
side has reduced tack for ease of handling.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad 2500S20
250
200
160
125
100
80
60
40
20
0
Deflection (% strain)
Thermal Impedance (°C-in
2
/W) 0.040" (3)
20
0.68
30
0.61
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch
2
. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Typical Applications
• Between processors and heat sinks
• Between graphics chips and heat sinks
• DVD and CDROM electronics cooling
• Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number
GP2500S20
–
0.100
– 02
–
00
–
ACME 89302 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
GP2500S20 = Gap Pad 2500S20 Material
Section A
Section B
Section C
Resultant Thickness (mils)
Note: To build a part number, visit our website at www.bergquistcompany.com.
.33
.66
.99
1.31 1.64 2.05 2.63 3.28
Thermal Resistance (C-in
2
/W)
4.10
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company -
Asia Headquarters
Hong Kong
Phone: 852-2690-9296
Fax: 852-2690-2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_2500S20_0711
Section D
Microcontroller MCU
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