Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature ....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s)
................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= 2.8V to 14V, T
A
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V, T
A
= +25NC.)
(Note 1)
PARAMETER
Operating Voltage Range
Undervoltage Lockout (Rising)
Undervoltage Lockout Hysteresis
Minimum Flash Operating
Voltage
Supply Current
ABP Regulator Voltage
DBP Regulator Voltage
Boot Time
Flash Writing Time
Internal Timing Accuracy
EN Input Voltage
EN Input Current
Input Voltage Range
V
TH_EN_R
V
TH_EN_F
I
EN
SYMBOL
V
CC
V
UVLO
V
UVLO_HYS
V
flash
I
CC
V
ABP
V
DBP
t
BOOT
Minimum voltage on V
CC
to ensure flash
erase and write operations
No load on output pins
During flash writing cycle
C
ABP
= 1μF, no load, V
CC
= 5V
C
DBP
= 1μF, no load, V
CC
= 5V
V
CC
> V
UVLO
8-byte word
(Note 3)
EN voltage rising
EN voltage falling
1.365
-0.5
0
-8
1.41
1.39
1.415
+0.5
5.5
2.85
2.8
2.7
4.5
10
3
3
200
122
+8
7
14
3.15
3.1
350
(Note 2)
Minimum voltage on V
CC
to ensure the
device is flash configurable
100
CONDITIONS
Reset output asserted low
MIN
1.2
2.8
14
2.7
TYP
MAX
UNITS
V
V
mV
V
mA
V
V
μs
ms
%
V
μA
V
2
Maxim Integrated
MAX16070/MAX16071
12-Channel/8-Channel, Flash-Configurable System
Managers with Nonvolatile Fault Registers
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 2.8V to 14V, T
A
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V, T
A
= +25NC.)
(Note 1)
PARAMETER
ADC DC ACCURACY
Resolution
Gain Error
Offset Error
Integral Nonlinearity
Differential Nonlinearity
ADC Total Monitoring Cycle Time
ADC IN_ Ranges
CURRENT SENSE
CSP Input-Voltage Range
Input Bias Current
CSP Total Unadjusted Error
Overcurrent Differential
Threshold
V
SENSE
Fault Threshold
Hysteresis
Secondary Overcurrent Threshold
Timeout
V
CSP
I
CSP
I
CSM
CSP
ERR
V
CSP
= V
CSM
(Note 4)
Gain = 48
OVC
TH
V
CSP
-
V
CSM
Gain = 24
Gain = 12
Gain = 6
OVC
HYS
r73h[6:5] = ‘00’
OVC
DEL
r73h[6:5] = ‘01’
r73h[6:5] = ‘10’
r73h[6:5] = ‘11’
Gain = 6
V
SENSE
Ranges
Gain = 12
Gain = 24
Gain = 48
V
SENSE
= 150mV (gain = 6 only)
ADC Current Measurement
Accuracy
V
SENSE
= 50mV, gain = 12
V
SENSE
= 25mV, gain = 24
V
SENSE
= 10mV, gain = 48
Gain Accuracy
Common-Mode Rejection Ratio
Power-Supply Rejection Ratio
CMRR
SNS
PSRR
SNS
V
SENSE
= 20mV to 100mV, V
CSP
= 5V,
gain = 6
V
CSP
> 4V
-1.5
80
80
-2.5
-4
3
12
50
21.5
46
94
190
25
51
101
202
0.5
0
4
16
64
232
116
58
29
Q0.2
Q0.2
Q0.5
Q1
+1.5
%
dB
dB
+2.5
+4
%
mV
5
20
60
ms
3
14
3
14
25
5
2
30.5
56
108
210
%OVC
TH
mV
V
μA
%FSR
ADC
GAIN
ADC
OFF
ADC
INL
ADC
DNL
t
CYCLE
No MON_ fault detected
1 LSB = 5.43mV
1 LSB = 2.72mV
1 LSB = 1.36mV
40
5.56
2.78
1.39
V
T
A
= +25°C
T
A
= -40°C to +85°C
10
0.35
0.70
1
1
1
50
Bits
%
LSB
LSB
LSB
μs
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Maxim Integrated
3
MAX16070/MAX16071
12-Channel/8-Channel, Flash-Configurable System
Managers with Nonvolatile Fault Registers
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 2.8V to 14V, T
A
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V, T
A
= +25NC.)
(Note 1)
PARAMETER
OUTPUTS (RESET, GPIO_)
I
SINK
= 2mA
Output-Voltage Low
V
OL
I
SINK
= 10mA, GPIO_ only
V
CC
= 1.2V, I
SINK
= 100μA (RESET only)
Maximum Output Sink Current
Output-Voltage High (Push-Pull)
Output Leakage (Open Drain)
SMBus INTERFACE
Logic-Input Low Voltage
Logic-Input High Voltage
Input Leakage Current
Output Sink Current
Input Capacitance
SMBus Timeout
INPUTS (A0, GPIO_)
Input Logic-Low
Input Logic-High
WDI Pulse Width
MR
Pulse Width
MR
to RESET Delay
MR
Glitch Rejection
SMBus TIMING
Serial Clock Frequency
Bus Free Time Between STOP
and START Condition
START Condition Setup Time
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
Data Setup Time
f
SCL
t
BUF
t
SU:STA
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
SU:DAT
1.3
0.6
0.6
0.6
1.3
0.6
100
V
IL
V
IH
t
WDI
t
MR
2.0
100
1
0.5
100
400
0.8
V
V
ns
μs
μs
ns
kHz
μs
μs
μs
μs
μs
μs
ns
V
OL
C
IN
t
TIMEOUT
SCL time low for reset
25
V
IL
V
IH
Input voltage falling
Input voltage rising
IN = GND or VCC
I
SINK
= 3mA
5
35
2.0
-1
+1
0.4
0.8
V
V
μA
V
pF
ms
Total current into RESET, GPIO_,
V
CC
= 3.3V
I
SOURCE
= 100μA
2.4
1
0.4
0.7
0.3
30
mA
V
μA
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
4
Maxim Integrated
MAX16070/MAX16071
12-Channel/8-Channel, Flash-Configurable System
Managers with Nonvolatile Fault Registers
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 2.8V to 14V, T
A
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V, T
A
= +25NC.)
(Note 1)
PARAMETER
Output Fall Time
Data Hold Time
Pulse Width of Spike Suppressed
JTAG INTERFACE
TDI, TMS, TCK Logic-Low Input
Voltage
TDI, TMS, TCK Logic-High Input
Voltage
TDO Logic-Output Low Voltage
TDO Logic-Output High Voltage
TDI, TMS Pullup Resistors
I/O Capacitance
TCK Clock Period
TCK High/Low Time
TCK to TMS, TDI Setup Time
TCK to TMS, TDI Hold Time
TCK to TDO Delay
TCK to TDO High-Z Delay
V
IL
V
IH
V
OL
V
OH
R
PU
C
I/O
t
1
t
2
, t
3
t
4
t
5
t
6
t
7
50
15
10
500
500
500
Input voltage falling
Input voltage rising
I
SINK
= 3mA
I
SOURCE
= 200μA
Pullup to DBP
2.4
40
50
5
1000
60
2
0.4
0.8
V
V
V
V
kω
pF
ns
ns
ns
ns
ns
ns
SYMBOL
t
OF
t
HD:DAT
t
SP
CONDITIONS
C
BUS
= 10pF to 400pF
From 50% SCL falling to SDA change
0.3
30
MIN
TYP
MAX
250
0.9
UNITS
ns
μs
ns
Note 1:
Specifications are guaranteed for the stated global conditions, unless otherwise noted. 100% production tested at T
A
=
+25NC and T
A
= +85NC. Specifications at T
A
= -40NC are guaranteed by design.
Note 2:
For 3.3V V
CC
applications, connect V
CC
, DBP, and ABP together. For higher supply applications, connect V
CC
only to the
supply rail.
Note 3:
Applies to RESET, fault, autoretry, sequence delays, and watchdog timeout.
Note 4:
Total unadjusted error is a combination of gain, offset, and quantization error.
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Embedded System
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