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D2TO020C250R0FRE3

Description
res 250 ohm 20w 1% d2pak
CategoryPassive components   
File Size151KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
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res 250 ohm 20w 1% d2pak

D2TO020C250R0FRE3 Parametric

Parameter NameAttribute value
Datasheets
D2TO20 Series
Standard Package500
CategoryResistors
FamilyChip Resistor - Surface Mou
PackagingTape & Reel (TR)
Resistance (Ohms)250
Tolerance±1%
Power (Watts)20W
CompositiThick Film
FeaturesAutomotive AEC-Q200 Qualified, Non-Inductive
Temperature Coefficie±150ppm/°C
Package / CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Supplier Device PackageTO-263 (D²Pak)
Size / Dimensi0.398" L x 0.346" W (10.10mm x 8.80mm)
Heigh0.189" (4.80mm)
Number of Terminations2
D2TO20
www.vishay.com
Vishay Sfernice
Surface Mount Power Resistor
Thick Film Technology
FEATURES
AEC-Q200 qualified
• 20 W at 25 °C case temperature
• Surface mounted resistor - TO-263 (D
2
PAK)
style package
• Wide resistance range from 0.01
to 550 k
• Non inductive
• Resistor isolated from metal tab
• Solder reflow secure at 270 °C/10 s
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
DESIGN SUPPORT TOOLS
click logo to get started
Models
Available
DIMENSIONS
in millimeters
1.25
10.5
4.5
8.7
7.8 min.
1.6
Footprint recommendation for
solderable contact area:
1.25
11.00
1.50
4.02
10.1
8.8
7.6
2.8
2.2
5.15
8.1
0.2
6.50
15.4
8.00
4.00
2.49
5
2.40
5.08
2
4.5
0.26
1.6
0.3
Tolerance: ± 0.3 mm
Notes
• For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
• Power dissipation is 3.1 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of
copper, 39 mm x 30 mm x 1.6 mm, with thermal vias
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
D2TO20
SIZE
TO-263
RESISTANCE
RANGE
0.01 to 550K
RATED POWER LIMITING ELEMENT
TOLERANCE
P
25 °C
VOLTAGE
U
L
±%
W
V
20
500
1, 2, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
150, 250, 700, 1100
CRITICAL
RESISTANCE
12.5K
MECHANICAL SPECIFICATIONS
Mechanical Protection
Resistive Element
Substrate
Connections
Weight
Molded
Thick film
Alumina
Tinned copper
2.2 g max.
TECHNICAL SPECIFICATIONS
Power Rating and
Thermal Resistance
of the Component
Temperature Coefficient
Standard
Dielectric Strength
IEC 60115-1
Insulation Resistance
Inductance
20 W at 25 °C (case
temperature)
R
TH (j - c)
: 6.5 °C/W
See Special Feature table
± 150 ppm/°C
2000 V
RMS
- 1 min - 10 mA max.
(between terminals and board)
10
6
M
0.1 μH
ENVIRONMENTAL SPECIFICATIONS
Temperature Range
Flammability
-55 °C to 155 °C
IEC 60695-11-5
2 applications 30 s
separated by 60 s
DIMENSIONS
Standard Package
TO-263 style
(D
2
PAK)
Revision: 29-Mar-16
Document Number: 51055
1
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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