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Y1630100R000Q0W

Description
res 100 ohm 1/4W .02% 1206
CategoryPassive components    The resistor   
File Size225KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

Y1630100R000Q0W Overview

res 100 ohm 1/4W .02% 1206

Y1630100R000Q0W Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerVishay
package instructionSMT, 1206
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresULTRA HIGH PRECISION, NON-INDUCTIVE
structureRectangul
JESD-609 codee0
Manufacturer's serial numberVFCP
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.64 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.57 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance100 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL FOIL
Temperature Coefficient.2 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeONE SURFACE
Tolerance0.02%
Operating Voltage79 V
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
UltraUltra High-Precision with ofFlip Chip Resistorng W TCR of gn
High-Pr sion Flip p stor TCR ±0.05
eci Z-Foil Chi Resi Z-Foil
ppm/°C, Space with ound
35%
Savi vs. rapar Desi
±0.05 ppm/°C, 35% Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
FEATURES
• Temperature coefficient of resistance (TCR):
± 0.05 ppm/°C nominal (0°C to + 60°C)
± 0.2 ppm/°C nominal (–55°C to +125°C, +25°C ref.)
(see Table 1 and Figure 2)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “∆R due to self heating” 5 ppm at
rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 Ω to 125 kΩ (for lower and higher
values, please contact us)
• Foil resistors are not restricted to standard values;
specific “as required” values can be supplied at no
extra cost or delivery (e.g., 1K2345 vs. 1K)
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of
steady state value)
• Short time overload: ≤0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 μV
rms
/ V of applied voltage
(<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 μH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC*
• Matched sets are available per request
• Prototype quantities available in just 5 working days or
sooner. For more information, please contact us.
in the most critical applications by eliminating the need for
corrective circuitry and reducing the large land patterns
needed for a wrap-around configuration. The device’s flip-
chip configuration saves up to 35% PCB space compared
with a surface-mount chip with wraparound terminations
while also providing better strain relief to eliminate
cracked substrates and board delamination.
In addition to its remarkably improved load-life stability,
the VFCP Series is noise-free and provides ESD
protection of 25 kV or more for increased reliability. The
device’s solid element alloy is matched to the substrate,
forming a single entity with balanced resistance versus
temperature characteristics for an unusually low and
predictable TCR over a wide temperature range from
–55°C to more than +125°C. The adhesive that holds the
foil to the flat substrate withstands high temperatures,
pulsing power, moisture incursions, shock and vibration,
and low-temperature exposure while still holding securely
to the foil element. Resistance patterns are photo-etched
into the element to permit the trimming of resistance
values to very tight tolerances as low as 0.01%.
The Flip Chips devices are qualified as anti-sulfurated
resistors for use in environments with high levels of
contamination. Such environments include alternative
energy applications, industrial control systems,
sensors, RTDs, electric instrumentation, weather and
communication base stations, and any electronic
appliance used in high concentrations of sulfur. The
combination of flip-chip terminations and Z-Foil
construction and materials results in the most stable
resistors available, requiring the lowest error allowance.
This means that more error allowance can be transferred
to active devices—resulting in lower costs—or applied
to the foil resistors themselves, allowing for looser initial
tolerances than would be required for other resistor
technologies.
INTRODUCTION
Based on VFR’s next-generation Bulk Metal
®
Z-Foil
technology, the VFCP Series (foil resistor flip-chip)
excels over all previous stability standards for precision
resistors with an order of magnitude improvement in
high-temperature stability, load-life stability, and moisture
resistance. These new benchmark levels of performance
provide design engineers with the tools to build circuits
not previously achievable while reducing costs and space
RELATED VIDEO
Refer to
Bulk Metal® Foil Resistor TCR Performance
(Product Demo).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document No.: 63106
Revision: 16-Sep-2013
For questions, contact
foil@vishaypg.com
www.vishayfoilresistors.com
1

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