The UT54ACS27 and the UT54ACTS27 are triple, three-input
NOR gates. The circuits perform the Boolean functions
Y = A+B+C or Y = A⋅B⋅C in positive logic.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
A
H
X
X
L
B
X
H
X
L
C
X
X
H
L
OUTPUT
Y
L
L
L
H
PINOUTS
14-Pin DIP
Top View
A1
B1
A2
B2
C2
Y2
V
SS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
C1
Y1
C3
B3
A3
Y3
14-Lead Flatpack
Top View
A1
B1
A2
B2
C2
Y2
V
SS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
C1
Y1
C3
B3
A3
Y3
LOGIC DIAGRAM
LOGIC SYMBOL
A1
B1
C1
A2
B2
C2
A3
B3
C3
(1)
(2)
(13)
(3)
(4)
(5)
(9)
(10)
(11)
(8)
Y3
(6)
Y2
≥1
(12)
A1
B1
C1
A2
B2
C2
A3
B3
C3
Y1
Y1
Y2
Y3
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and IEC
Publication 617-12.
1
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
2
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Power dissipation
2, 8, 9
Output current
10
(Sink)
I
OH
Output current
10
(Source)
I
DDQ
ΔI
DDQ
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
C
L
= 50pF
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
10
1.6
μA
mA
-8
mA
8
.7V
DD
V
DD
- 0.25
-200
200
1.8
.5V
DD
.7V
DD
-1
1
0.40
0.25
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
V
V
OH
V
I
OS
P
total
I
OL
mA
mW/
MHz
mA
3
Notes:
1.Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
4
AC ELECTRICAL CHARACTERISTICS
2
(V
DD
= 5.0V
±10%;
V
SS
= 0V
1
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
Incompatible runtime models. Module APS specifies that '__code_model' must be 'banked', but module AF has the value 'near' This problem occurs when compiling with Zstack. What is the cause of this pro...
I wrote a small program for the MSP430FR series microcontroller and wrote some data into FRAM. During the first simulation, the read data was consistent with the written data. Then I exited and simula...
I am going to do a project recently, which is mainly to drive the display function of the segment LCD screen. The current tentative plan is to use STM8L as the main control chip and HT1621 as the LCD ...
Is there any expert who can give me a low-cost temperature acquisition circuit with an accuracy of 0.1 degree? Thank you very much. Contact WeChat 17801070922...
The TIA Portal software's shift instructions shift the contents of an accumulator bit by bit to the left or right. The number of bits shifted is determined by N. A left shift of N bits multiplies t...[Details]
On August 24th, Tesla CEO Elon
Musk
revealed information about the upcoming FSD V14, claiming it will outperform human drivers. Tesla FSD lead Ashok stated last year that FSD version 12.5, ...[Details]
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
We are entering a new era where people are increasingly affordably equipped with more electronic gadgets. Electronics have become essential to our lives. For example, the average consumer now owns ...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
On August 25th, Apple's expansion in India encountered new troubles. According to Bloomberg, Foxconn Technology Group has recalled approximately 300 Chinese engineers from India, further hindering ...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
1. Ease of Use: The HMI module should be designed to be simple and clear, allowing users to easily operate and configure the energy storage device.
2. Ease of Maintenance: The HMI module should...[Details]
On August 22, according to CNBC's report today, the National Highway Traffic Safety Administration (NHTSA) is launching an investigation into Tesla, and the latter is questioned whether it has fail...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
The difference between a series inverter and a parallel inverter is that they use different oscillation circuits. A series inverter connects L, R, and C in series, while a parallel inverter connect...[Details]
Batteries, at the core of new energy vehicles, are crucial to vehicle performance and range. Existing automotive batteries are categorized into lead-acid and lithium batteries. Currently, new energ...[Details]
I recently read an article in the Wall Street Journal titled "We need the right to repair our gadgets" (reference original article: ). The author was very angry about the phenomenon of "planned obs...[Details]
In camera and display systems, the demand for high-performance and low-power data interfaces is driving continuous technological evolution. The evolution of MIPI D-PHY and MIPI C-PHY clearly ...[Details]