To prevent damage to the components conformal coating, the leads should be adequately supported during the
forming process
H4P
Body Length (L) maximum:
Body Diameter (D) maximum:
Lead Diameter (d) maximum:
Lead Length (l) nominal:
Recommended Mounting Pitch:
Weight (g/100 resistors)
10.0 mm
3.70 mm
0.60 mm
30.0 mm
12.7 mm
40
H4
10.0 mm
3.70 mm
0.60 mm
30.0 mm
12.7 mm
40
H8
7.20 mm
2.50 mm
0.60 mm
30.0 mm
10.2 mm
24
Characteristics -
Long Term Stability
Long Term Stability
BS CECC 40101 004
Ratings at 70°C
H4 - 0.25 W
H8 - 0.125 W
Long Term Stability
BS CECC 40101 030
Ratings at 125°C
H4 - 0.125 W
H8 - 0.1 W
Long Term Stability
Commercial
Ratings at 125°C
H4P - 1W
H4 - 0.5 W
H8 - 0.25 W
Damp Heat Steady State
93% RH at 40°C
1773230 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
Axial Leaded Precision Resistors
Type HOLCO Series
Derating Graph -
Approved and Commercial Ratings
How to Order
H8
Common Part
H4P
H4
H8
100R
Resistance Value
1.0 ohm
(1000 milli ohms) 1R0
10 ohm
(10 ohms) 10R
100 ohm
(100 ohms) 100R
1K 0hm
(1000 ohms) 1K0
10K ohm
(10000 ohms) 10K
100K ohm
(100000 ohms) 100K
1M ohm
(1000000 ohms) 1M0
B
Tolerance
A - 0.05%
Y
T.C.R. Code
A - 5ppm
B - 10ppm
B
Release
A - Part can only
be sold with
Commercial or
C of C release.
B - Part can be
sold to BS CECC
40101 004,
BS CECC 40101
030
D - Part can
be sold to
BS CECC 40101
804
B - 0.1%
Y - 15ppm
C - 0.25%
D - 25ppm
D - 0.5%
C - 50ppm
F - 1.0%
Z - 100ppm
TE Connectivity, TE connectivity (logo) and TE (logo) are trademarks.
Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
While TE has made every reasonable effort to ensure the accuracy of the information in this datasheet, TE does not guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein
at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantabili-
ty or fitness for a particular purpose. The dimensions in this datasheet are for reference purposes only and are subject to change without notice. Specifications are subject to change
without notice. Consult TE for the latest dimensions and design specifications.
The measuring range is 5 tons to 10 tons, and needs to be customized according to the customer's needs. I don't know which manufacturer can produce it....
[i=s]This post was last edited by paulhyde on 2014-9-15 09:28[/i]I need an expert to tell me how to use 595 to drive a 4-digit digital tube. I need a circuit diagram. How to connect it to a 430 microc...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
Tires are a very important component for cars. They are related to the driving experience of the vehicle. We are almost inseparable from cars in our daily lives. For tires, according to the role of...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
At the 2025 KeyBanc Investor Conference,
ON
Semiconductor CEO Hassane S. El-Khoury, framing global industrial transformation as the basis for
his strategic layout in two high-growth sect...[Details]