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M55342H08W258AM-TR

Description
Fixed Resistor, Thin Film, 0.8W, 258ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size106KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

M55342H08W258AM-TR Overview

Fixed Resistor, Thin Film, 0.8W, 258ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP

M55342H08W258AM-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid2069994005
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.6
Other featuresPRECISION
structureChip
JESD-609 codee4
Manufacturer's serial numberM55342/08
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.64 mm
Package length5.13 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width2.38 mm
method of packingTR
Rated power dissipation(P)0.8 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance258 Ω
Resistor typeFIXED RESISTOR
seriesM55342/08-THIN FILM
size code2010
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage150 V
State of the Art, Inc.
Thin Film Chip Resistor
M55342/08 RM2010
PROTECTIVE
ENCAPSULANT
PRECISION
THIN FILM
RESISTOR
99.6% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
PRETINNED
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
100
W
- 1M
W
0.1%, 1%, 2%, 5%
800 mW
150 Volts
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
CHARACTERISTICS*
H
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 H 08 B 100D R - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
TERMINATION MATERIALS:
SIZE CODE: /08 = RM2010
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
B: Solderable wraparound
A: 0.1%
W
D: 1%
W
G: 2%
W
J: 5%
W
B: 0.1% K
W
E: 1% K
W
H: 2% K
W
K: 5% K
W
C: 0.1% M
W
F: 1% M
W
T: 2% M
W
L: 5% M
W
W: Gold wire bondable
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.191 - .218)
.094 (.093 - .103)
.025 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.64
0.51
0.48
4.17
(4.85 - 5.54)
(2.36 - 2.62)
(0.38 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
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