Product Brief
BGA700L16
Low Noise Amplifier for IEEE 802.11a/b/g/n
T h e B G A 7 0 0 L 1 6 is a Wireless LAN dual band Low Noise Amplifier.
The amplifier comprises a single stage amplifier for the 2.45 Ghz band and a two-
stage amplifier to meet the requirements of the 4.9 to 5.95 Ghz band. The complete
circuitry, including a temperature stabilization block, fits on one die and needs no
external matching elements.
One of the challenges of Wireless LAN application designers is to maximize network
coverage and data throughput. The receiver system noise figure determines
sensitivity, network coverage and data throughput.
Applications
■
802.11a/b/g/n
Features
■
■
■
■
Input/output 50
W
matched internally
SiGe:C process
Shut down mode
Temperature stabilization
Benefits
The BGA700L16 uses a combination of Silicon Germanium Carbon epitaxy
proprietary process and a low ohmic on chip ground contact from Infineon
Technologies to deliver the word best-in class noise figure for wireless LAN systems.
The BGA700L16 ships as bare die or in a low profile Tiny Small Leadless Package
code-named TSLP-16. The package dimensions are 2.3 x 2.3 x 0.39 mm
3
.
TSLP-16 Package
2.3 x 2.3 x 0.39 mm
3
■
■
■
■
■
extended coverage
Ultra-low noise figure
Small form factor
high level of integration
Low cost
www.infineon.com/smallsignaldiscretes
Small Signal Discretes
Product Brief
Application Circuit
LNA_ON_52
V
CC2
1 µF
15
Bandgap Reference and
Biasing Circuit
16
RF_IN_52
13
2
RF_OUT_52
RF_IN_24
9
7
0
6
1 µF
LNA_ON_24
Backside_GND
V
CC1
4
RF_OUT_24
Performance
Band [GHz]
2.4
5.6
Supply Voltage [V]
2.4 – 3.3
2.4 – 3.3
Supply Current [mA]
11
17
Gain [dB]
15
21
Noise Figure [dB]
0.9
1.3
Input P1dB [dB]
-10
-10
how to reach us:
http://www.infineon.com
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Legal Disclaimer
The information given in this Product Brief shall in no event be
regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples or hints
given herein, any typical values stated herein and/or any informa-
tion regarding the application of the device, Infineon Technologies
hereby disclaims any and all warranties and liabilities of any kind,
including without limitation warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and
conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain
dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-
support devices or systems with the express written approval
of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in
the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume
that the health of the user or other persons may be endangered.
Ordering No. B132-h8884-X-X-7600
Printed in Germany
PS 01071. nb
Published by Infineon Technologies AG
京公网安备 11010802033920号
EEWORLD
