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24LC04BT-I/MSG

Description
eeprom 512x8 - 2.5V lead free package
Categorystorage    storage   
File Size338KB,24 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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24LC04BT-I/MSG Overview

eeprom 512x8 - 2.5V lead free package

24LC04BT-I/MSG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeMSOP
package instructionTSSOP, TSSOP8,.19
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
I2C control byte1010XXMR
JESD-30 codeS-PDSO-G8
JESD-609 codee3
length3 mm
memory density4096 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
reverse pinoutNO
Maximum seat height1.1 mm
Serial bus typeI2C
Maximum standby current0.000005 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1
24AA04/24LC04B
4K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA04
24LC04B
Note 1:
Vcc
Range
1.8-5.5
2.5-5.5
Max Clock
Frequency
400 kHz
(1)
400 kHz
Temp
Ranges
I
I, E
Description
The Microchip Technology Inc. 24AA04/24LC04B
(24XX04*) is a 4 Kbit Electrically Erasable PROM. The
device is organized as two blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.8V, with standby
and active currents of only 1
µA
and 1 mA,
respectively. The 24XX04 also has a page write
capability for up to 16 bytes of data. The 24XX04 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP and MSOP packages and is also
available in the 5-lead SOT-23 package.
100 kHz for V
CC
<2.5V
Features
• Single supply with operation down to 1.8V
• Low-power CMOS technology
- 1 mA active current typical
- 1
µA
standby current typical (I-temp)
• Organized as 2 blocks of 256 bytes (2 x 256 x 8)
• 2-wire serial interface bus, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (24AA04) and 400 kHz (24LC04B)
compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 16 bytes
• 2 ms typical write cycle time for page write
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• 5-lead SOT-23 package
• Standard and Pb-free finishes available
• Available for extended temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Package Types
PDIP/SOIC/TSSOP/MSOP
A0
A1
A2
Vss
1
8
Vcc
WP
SCL
Vss
2
3
SDA SDA
SCL
SOT-23-5
1
5
WP
24XX04
24XX04
2
3
4
7
6
5
4
Vcc
Note:
Pins A0, A1 and A2 are not used by the
24XX04 (no internal connections).
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SDA
SCL
YDEC
V
CC
V
SS
Sense Amp.
R/W Control
2003 Microchip Technology Inc.
DS21708C-page 1

24LC04BT-I/MSG Related Products

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Description eeprom 512x8 - 2.5V lead free package eeprom 512x8 - 1.8V lead free package eeprom 512x8 - 1.8V eeprom 512x8 - 1.8V lead free package eeprom 512x8 - 2.5V lead free package eeprom 512x8 - 1.8V lead free package eeprom 512x8 - 1.8V lead free package eeprom 512x8 - 1.8V lead free package Electrically Erasable Programmable Read Only Memory 4K I2C SMARTCARD EE DIE IN WAFFLE PACK
organize 512X8 512X8 2Block x 256 x 8 512X8 512X8 512X8 512X8 512X8 256 x 8
Is it lead-free? Lead free Lead free - Lead free Lead free Lead free Lead free Lead free -
Is it Rohs certified? conform to conform to - conform to conform to conform to conform to conform to -
Parts packaging code MSOP MSOP - SOIC SOT-23 MSOP SOIC SOIC -
package instruction TSSOP, TSSOP8,.19 TSSOP, TSSOP8,.19 - TSSOP, TSSOP8,.25 LSSOP, TSOP5/6,.11,37 TSSOP, TSSOP8,.19 TSSOP, TSSOP8,.25 SOP, SOP8,.25 -
Contacts 8 8 - 8 5 8 8 8 -
Reach Compliance Code compli compli - compli compli compli compli compli -
ECCN code EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 -
Maximum clock frequency (fCLK) 0.4 MHz 0.1 MHz - 0.1 MHz 0.4 MHz 0.1 MHz 0.1 MHz 0.1 MHz -
Data retention time - minimum 200 200 - 200 200 200 200 200 -
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles -
I2C control byte 1010XXMR 1010XXMR - 1010XXMR 1010XXMR 1010XXMR 1010XXMR 1010XXMR -
JESD-30 code S-PDSO-G8 S-PDSO-G8 - R-PDSO-G8 R-PDSO-G5 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 -
JESD-609 code e3 e3 - e3 e3 e3 e3 e3 -
length 3 mm 3 mm - 4.4 mm 2.9 mm 3 mm 4.4 mm 4.9 mm -
memory density 4096 bi 4096 bi - 4096 bi 4096 bi 4096 bi 4096 bi 4096 bi -
Memory IC Type EEPROM EEPROM - EEPROM EEPROM EEPROM EEPROM EEPROM -
memory width 8 8 - 8 8 8 8 8 -
Humidity sensitivity level 1 1 - 1 1 1 1 1 -
Number of functions 1 1 - 1 1 1 1 1 -
Number of terminals 8 8 - 5 5 8 5 5 -
word count 512 words 512 words - 512 words 512 words 512 words 512 words 512 words -
character code 512 512 - 512 512 512 512 512 -
Operating mode SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
Maximum operating temperature 85 °C 85 °C + 85 C 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C - 40 C -40 °C -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TSSOP TSSOP - TSSOP LSSOP TSSOP TSSOP SOP -
Encapsulate equivalent code TSSOP8,.19 TSSOP8,.19 - TSSOP8,.25 TSOP5/6,.11,37 TSSOP8,.19 TSSOP8,.25 SOP8,.25 -
Package shape SQUARE SQUARE - RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE -
Parallel/Serial SERIAL SERIAL - SERIAL SERIAL SERIAL SERIAL SERIAL -
Peak Reflow Temperature (Celsius) 260 260 - 260 260 260 260 260 -
power supply 3/5 V 2/5 V - 2/5 V 3/5 V 2/5 V 2/5 V 2/5 V -
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
reverse pinout NO NO - NO NO NO NO NO -
Maximum seat height 1.1 mm 1.1 mm - 1.2 mm 1.45 mm 1.1 mm 1.2 mm 1.75 mm -
Serial bus type I2C I2C - I2C I2C I2C I2C I2C -
Maximum standby current 0.000005 A 0.000001 A - 0.000001 A 0.000005 A 0.000001 A 0.000001 A 0.000001 A -
Maximum slew rate 0.003 mA 0.003 mA - 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA -
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 2.5 V 1.7 V - 1.7 V 2.5 V 1.7 V 1.7 V 1.7 V -
surface mount YES YES - YES YES YES YES YES -
technology CMOS CMOS - CMOS CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) -
Terminal form GULL WING GULL WING - GULL WING GULL WING GULL WING GULL WING GULL WING -
Terminal pitch 0.65 mm 0.65 mm - 0.65 mm 0.95 mm 0.65 mm 0.65 mm 1.27 mm -
Terminal location DUAL DUAL - DUAL DUAL DUAL DUAL DUAL -
Maximum time at peak reflow temperature 40 40 - 40 40 40 40 40 -
width 3 mm 3 mm - 3 mm 1.55 mm 3 mm 3 mm 3.9 mm -
Maximum write cycle time (tWC) 5 ms 5 ms - 5 ms 5 ms 5 ms 5 ms 5 ms -
write protect HARDWARE HARDWARE - HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE -
Base Number Matches 1 1 - 1 1 1 1 1 -
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