Si8232-A-IS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> Drivers and interfaces> Si8232-A-IS

Si8232-A-IS: DescriptionIsolator interface integrated circuit 0.5A dual low side isodriver; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size510KB，52 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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Si8232-A-IS Overview

Isolator interface integrated circuit 0.5A dual low side isodriver

Si8232-A-IS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Silicon Laboratories Inc
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	unknow
ECCN code	EAR99
Built-in protection	UNDER VOLTAGE
Interface integrated circuit type	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code	R-PDSO-G16
length	10.3 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output current flow direction	SOURCE AND SINK
Nominal output peak current	0.5 A
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
Supply voltage 1-max	24 V
Mains voltage 1-minute	10 V
Supply voltage1-Nom	12 V
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Disconnect time	50 µs
connection time	50 µs
width	7.5 mm

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Si823x

0.5

AND

4 . 0 A

I S O

D R I V E R S

(2.5

AND

RMS

)

Features

Pin Assignments



Two completely isolated drivers



Independent HS and LS inputs or

in one package

PWM input versions



Up to 5 kV

RMS

input-to-output



Transient immunity >30 kV/µs

isolation



Overlap protection and



Up to 1500 V

peak driver-to-

programmable dead time

driver differential voltage



Wide operating range

HS/LS and dual driver versions



–40 to +125 °C

Up to 8 MHz switching frequency



RoHS-compliant packages

0.5 A peak output (Si8230/1/2)



SOIC-16 narrow body



SOIC-16 wide body

4.0 A peak output (Si8233/4/5/6)



LGA-14

60 ns propagation delay (max)

SOIC-16 (Wide)

VIA

VIB

VDDI

GNDI

DISABLE

VDDI

VDDA

VOA

GNDA

VDDB

VOB

GNDB

Si8230

Si8233

Applications



SOIC-16 (Narrow)

VIA

VDDA

VOA

GNDA

VDDB

VOB

GNDB

Power delivery systems



Motor control systems



Isolated dc-dc power supplies



Lighting control systems



Plasma displays



Solar and industrial inverters

VIB

VDDI

GNDI

DISABLE

Si8230

Si8233

Safety Approval



UL 1577 recognized





VDE certification conformity



IEC

VDDI

to 5000 Vrms for 1 minute

CSA component notice 5A

approval



IEC

60747-5-2 (VDE 0884 Part 2)



EN 60950-1 (reinforced insulation)

GNDI

VIA

VIB

VDDI

DISABLE

LGA-14 (5 x 5 mm)

60950-1, 61010-1, 60601-1

(reinforced insulation)

VDDA

VOA

GNDA

VDDB

VOB

GNDB

Description

The Si823x isolated driver family combines two independent, isolated

drivers into a single package. The Si8230/1/3/4 are high-side/low-side

drivers, and the Si8232/5/6 are dual drivers. Versions with peak output

currents of 0.5 A (Si8230/1/2) and 4.0 A (Si8233/4/5/6) are available. All

drivers operate with a maximum supply voltage of 24 V.

The Si823x drivers utilize Silicon Labs' proprietary silicon isolation

technology, which provides up to 5 kV

RMS

withstand voltage per UL1577

and fast 60 ns propagation times. Driver outputs can be grounded to the

same or separate grounds or connected to a positive or negative voltage.

The TTL level compatible inputs with >400 mV hysteresis are available in

individual control input (Si8230/2/3/5/6) or PWM input (Si8231/4)

configurations. High integration, low propagation delay, small installed

size, flexibility, and cost-effectiveness make the Si823x family ideal for a

wide range of isolated MOSFET/IGBT gate drive applications.

Si8230

Si8233

VDDI

Patents Pending

Rev. 1.0 8/10

Si823x

Si823x

ABLE

Section

ONTENTS

Page

1. Top-Level Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.1. Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

2.2. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3. Typical Operating Characteristics (0.5 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4. Typical Operating Characteristics (4.0 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5. Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.1. Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2. Device Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

5.3. Power Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.4. Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

5.5. Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.6. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.7. Programmable Dead Time and Overlap Protection . . . . . . . . . . . . . . . . . . . . . . . . . 26

6. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6.1. High-Side / Low-Side Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6.2. Dual Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.3. Dual Driver with Thermally Enhanced Package (Si8236) . . . . . . . . . . . . . . . . . . . . .29

7. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

9. Package Outline: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

10. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

11. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

12. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

13. Package Outline: 14 LD LGA (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

14. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

15. Package Outline: 14 LD LGA with Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .46

16. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

17. Top Marking: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

18. Top Marking: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

19. Top Marking: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Rev. 1.0

Si8232-A-IS Related Products

	Si8232-A-IS	Si8233-B-IS	Si8230-A-IS	Si8234-B-IS	Si8231-A-IS	Si8233-B-IM	Si8234-B-IM
Description	Isolator interface integrated circuit 0.5A dual low side isodriver	Isolator interface integrated circuit 4A HS/LS isodriver dual input	Isolator interface integrated circuit 0.5A HS/LS isodriver dual input	Isolator interface integrated circuit 4A HS/LS isodriver pwm input	Buffer/Inverter Based Peripheral Driver, 0.5A, PDSO16, ROHS COMPLIANT, SOIC-16	Isolator interface integrated circuit 4A HS/LD isodriver dual input	Isolator interface integrated circuit 4A HS/LD isodriver pwm input
Maker	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	-	Silicon Laboratories Inc	Silicon Laboratories Inc
Maximum operating temperature	125 °C	+ 125 C	+ 125 C	+ 125 C	-	+ 125 C	+ 125 C
Minimum operating temperature	-40 °C	- 40 C	- 40 C	- 40 C	-	- 40 C	- 40 C
Product Category	-	Isolator interface integrated circuit	Isolator interface integrated circuit	Isolator interface integrated circuit	-	Isolator interface integrated circuit	Isolator interface integrated circuit
RoHS	-	yes	yes	yes	-	yes	yes
Number of channels	-	2	2	2	-	2	2
propagation delay time	-	30 ns	30 ns	30 ns	-	30 ns	30 ns
Supply voltage (maximum)	-	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V
Supply voltage (minimum)	-	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V
Supply current	-	2 mA	2 mA	2 mA	-	2 mA	2 mA
Power dissipation	-	1.2 W	1.2 W	1.2 W	-	1.2 W	1.2 W
Package/box	-	SOIC-16 Wide	SOIC-16 Wide	SOIC-16 Wide	-	LGA-14	LGA-14
Encapsulation	-	Tube	Tube	Tube	-	Tube	Tube
Installation style	-	SMD/SMT	SMD/SMT	SMD/SMT	-	SMD/SMT	SMD/SMT

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