VLMB314.
Vishay Semiconductors
Standard SMD LED PLCC-2
FEATURES
• SMD LED with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
e3
equipment
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and wave
solder processes according to CECC 00802 and
J-STD-020C
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
I
Vmax
/I
Vmin
≤
1.6
• Lead (Pb)-free device
• Preconditioning: according to JEDEC level 2a
• ESD-withstand voltage:
up to 1 kV according to JESD22-A114-B
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
APPLICATIONS
• Automotive: backlighting in dashboards and
switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video
equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
19225
DESCRIPTION
This device has been designed to meet the increasing
demand for InGaN technology.
The package of the VLMB314.-series is the PLCC-2.
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled up with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
PARTS TABLE
PART
VLMB314P2R1-GS08
VLMB314P2R1-GS18
VLMB314Q2S1-GS08
VLMB314Q2S1-GS18
VLMB314P2S1-GS08
VLMB314P2S1-GS18
COLOR, LUMINOUS INTENSITY
Blue, I
V
= (56 to 140) mcd
Blue, I
V
= (56 to 140) mcd
Blue, I
V
= (90 to 224) mcd
Blue, I
V
= (90 to 224) mcd
Blue, I
V
= (56 to 224) mcd
Blue, I
V
= (56 to 224) mcd
TECHNOLOGY
InGaN on SiC
InGaN on SiC
InGaN on SiC
InGaN on SiC
InGaN on SiC
InGaN on SiC
Document Number 81342
Rev. 1.3, 11-Sep-07
www.vishay.com
1
VLMB314.
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
1)
VLMB314.
PARAMETER
Reverse voltage
2)
DC Forward current
Surge forward current
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Thermal resistance junction/
ambient
mounted on PC board
(pad size > 16 mm
2
)
T
amb
≤
80 °C
t
p
≤
10 µs
TEST CONDITION
SYMBOL
V
R
I
F
I
FSM
P
V
T
j
T
amb
T
stg
R
thJA
VALUE
5
20
0.2
84
110
- 40 to + 100
- 40 to + 100
350
UNIT
V
mA
A
mW
°C
°C
°C
K/W
Note:
1)
T
amb
= 25 °C, unless otherwise specified
2)
Driving LED in reverse direction is suitable for short term application
OPTICAL AND ELECTRICAL CHARACTERISTICS
1)
VLMB314., BLUE
PARAMETER
Luminous intensity
2)
Dominant wavelength
Peak wavelength
Angle of half intensity
Forward voltage
Reverse voltage
Temperature coefficient of V
F
Temperature coefficient of I
V
TEST CONDITION
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
R
= 10 µA
I
F
= 20 mA
I
F
= 20 mA
PART
VLMB314P2R1
VLMB314Q2S1
VLMB314P2S1
SYMBOL
I
V
I
V
I
V
λ
d
λ
p
ϕ
V
F
V
R
TC
V
TC
I
5
-4
- 0.4
MIN
56
90
56
462
464
± 60
3
4.2
TYP
MAX
140
224
224
476
UNIT
mcd
mcd
mcd
nm
nm
deg
V
V
mV/K
%/K
Note:
1)
T
amb
= 25 °C, unless otherwise specified
2)
In one Packing Unit I
Vmax
/I
Vmin
≤
1.6
LUMINOUS INTENSITY CLASSIFICATION
GROUP
STANDARD
P
Q
R
S
2
1
2
1
2
1
LIGHT INTENSITY (MCD)
OPTIONAL
MIN
56
71
90
112
140
180
MAX
71
90
112
140
180
224
COLOR CLASSIFICATION
BLUE
GROUP
3
4
5
DOM. WAVELENGTH (NM)
MIN.
462
466
470
MAX.
468
472
476
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above type numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel).
In order to ensure availability, single brightness groups will not be
orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped on
any one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
www.vishay.com
2
Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of ± 1 nm.
CROSSING TABLE
VISHAY
VLMB314P2R1
VLMB314P2S1
VLMB314Q2S1
OSRAM
LBT67C-P2R1
LBT67C-P2S1
LBT67C-Q2S1
Document Number 81342
Rev. 1.3, 11-Sep-07
VLMB314.
Vishay Semiconductors
TYPICAL CHARACTERISTICS
T
amb
= 25 °C, unless otherwise specified
25
I
F
- Forward Current (mA)
0
16806
100
90
80
70
60
50
40
30
20
10
0
2.0
19918
I
F
- Forward Current (mA)
20
15
10
5
0
10 20 30 40 50 60 70
80
90 100 110
T
amb
- Ambient Temperature (°C)
2.5
3.0
3.5
4.0
4.5
5.0
V
F
- Forward
Voltage
(V)
Figure 1. Forward Current vs. Ambient Temperature for InGaN
Figure 4. Forward Current vs. Forward Voltage
0°
10°
20°
30°
I
V
rel
- Relative Luminous Intensity
10
I
Vrel
- Relative Luminous Intensity
40°
1.0
0.9
0.8
0.7
50°
60°
70°
80°
0.6
0.4
0.2
0
0.2
0.4
0.6
1
0.1
0.01
1
16194
95 10319
10
I
F
- Forward Current (mA)
100
Figure 2. Relative Luminous Intensity
Figure 5. Specific Luminous Flux vs. Forward Current
1.2
476
blue
I
V
rel
- Relative Luminous Intensity
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
400
blue
Dominant
Wavelength
λ
(nm)
ı
474
472
470
468
420
440
460
480
500
520
540
560
16814
0
10
20
30
40
50
16069
λ
-
Wavelength
(nm)
I
F
- Forward Current (mA)
Figure 3. Relative Intensity vs. Wavelength
Figure 6. Dominant Wavelength vs. Forward Current
Document Number 81342
Rev. 1.3, 11-Sep-07
www.vishay.com
3
VLMB314.
Vishay Semiconductors
PACKAGE DIMENSIONS
in millimeters
3.5 ± 0.2
1.75 ± 0.10
technical drawings
according to DIN
specifications
0.9
Mounting Pad Layout
Pin identification
1.2
area covered
with
solder resist
2.6 (2.8)
+ 0.15
2.2
C
A
2.8
4
1.6 (1.9)
?
2.4
3
+ 0.15
Drawing-No.: 6.541-5025.01-4
Issue:
8;
22.11.05
95 11314-1
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component
insertion. The blister tape is a plastic strip with
impressed component cavities, covered by a top tape.
TAPING OF VLM.3..
3.5
3.1
4
2.2
2.0
5.75
5.25
3.6
3.4
1.85
1.65
4.0
3.6
8.3
7.7
Adhesive Tape
Blister Tape
1.6
1.4
4.1
3.9
2.05
1.95
4.1
3.9
0.25
94
8668
Figure 7. Tape dimensions in mm for PLCC-2
Component Cavity
94
8670
www.vishay.com
4
Document Number 81342
Rev. 1.3, 11-Sep-07
VLMB314.
Vishay Semiconductors
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
120°
TTW Soldering
300
250
Temperature (°C)
5s
235 °C...260 °C
first
wave
ca. 200 K/s
100 °C...130 °C
100
50
0
0
50
(acc. to CECC00802)
948626-1
Lead Temperature
second
wave
ca. 2 K/s
full line: typical
dotted line: process limits
10.0
9.0
200
150
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
2 K/s
forced cooling
100
Time (s)
150
ca. 5 K/s
200
250
180
178
14.4 max.
94
8665
Figure 11. Double Wave Soldering of Opto Devices (all Packages)
Figure 8. Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
120°
10.4
8.4
BAR CODE PRODUCT LABEL
EXAMPLE:
106
A
H
VISHAY
62.5
60.0
4.5
3.5
2.5
1.5
13.00
12.75
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
37
B
321
329
14.4 max.
18857
C
D
E
F
G
20147
Figure 9. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
250
Temperature (°C)
200
max. 30 s
150
max. 120 s
100
50
0
0
19885
255 °C
240 °C
217 °C
max. 260 °C
245 °C
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: P2 = code for luminous intensity group
3 = code for color group
D) Date code year/week
E) Day code (e.g. 2: Tuesday)
F) Batch no.
G) Total quantity
H) Company code
max. 100 s
max. ramp
up
3 °C/s
max. ramp down 6 °C/s
50
100
150
Time (s)
200
250
300
max. 2 cycles allowed
Figure 10. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
Document Number 81342
Rev. 1.3, 11-Sep-07
www.vishay.com
5
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