1.2 Description of this specification ........................................................................................................................... 1
1.3.1 Class K ........................................................................................................................................................... 1
1.3.2 Class H........................................................................................................................................................... 1
1.3.3 Class G .......................................................................................................................................................... 1
1.3.4 Class D........................................................................................................................................................... 2
1.3.5 Class E ........................................................................................................................................................... 2
1.3.6 Class L ........................................................................................................................................................... 2
1.3.7 Class F ........................................................................................................................................................... 2
2.1 General ............................................................................................................................................................... 2
2.2 Government documents ...................................................................................................................................... 2
2.2.1 Specification, standards, and handbooks ....................................................................................................... 2
2.2.2 Other Government documents, drawings, and publications ........................................................................... 2
2.4 Order of precedence ........................................................................................................................................... 3
3.7 Performance requirements for Class F non-hermetic devices............................................................................. 4
3.8 Performance requirements for Class L non-hermetic devices ............................................................................. 4
3.9 General ............................................................................................................................................................... 6
3.9.1 Implementation of this specification ............................................................................................................... 6
3.9.3 Design and construction ................................................................................................................................. 7
3.9.3.1 Lead finish ................................................................................................................................................. 7
3.9.5 Marking of devices ......................................................................................................................................... 8
3.9.5.1 Part or Identifying Number (PIN) ............................................................................................................... 8
3.9.5.1.1 Device type .......................................................................................................................................... 8
3.9.5.1.2 Device class designator ....................................................................................................................... 8
3.9.5.1.3 Case outline ......................................................................................................................................... 8
3.9.5.1.4 Lead finish ............................................................................................................................................ 9
3.9.5.2 Index point................................................................................................................................................. 9
3.9.5.3 Lot identification code (date code) ............................................................................................................ 9
3.9.5.5 Manufacturer’s designating symbol ........................................................................................................... 9
3.9.5.6 Country of manufacture ............................................................................................................................. 9
3.9.5.7.1 Class K and L serialization ................................................................................................................... 9
3.9.5.7.2 Class H, G, D and F ............................................................................................................................. 9
3.9.5.8 Special marking ......................................................................................................................................... 9
3.9.5.8.3 Certification mark ............................................................................................................................... 10
3.9.5.9 Marking option for controlled storage of Class H and G .......................................................................... 11
3.10.1 Certification of conformance....................................................................................................................... 11
ii
MIL-PRF-38534K
CONTENTS
PARAGRAPH
PAGE
3.11 Recycled, recovered, environmentally preferable, or biobased materials ....................................................... 12
4.1 General verification ........................................................................................................................................... 12
4.2 Quality Management (QM) Program ................................................................................................................. 12
4.3 Baseline process flows ...................................................................................................................................... 12
4.4 Quality management (QM) plan ........................................................................................................................ 13
4.4.1 Self-audit program ........................................................................................................................................ 13
4.4.2 Change control procedures .......................................................................................................................... 13
4.5 Verification for QML listing ................................................................................................................................ 13
4.5.1.3 Classes E, G, H, K, F, and L process flow audits .................................................................................... 13
4.5.1.4 Class D process flow audit ...................................................................................................................... 13
4.5.2.1 Class H and K QML listing ...................................................................................................................... 14
4.5.2.2 Class G, D, F and L QML listing .............................................................................................................. 14
4.5.2.3 Class E listing .......................................................................................................................................... 14
6.1 Intended use ..................................................................................................................................................... 14
6.4.4 Baseline index of documents ....................................................................................................................... 15
6.4.5 Baseline process flow................................................................................................................................... 15
6.4.6 Burn-in lot ..................................................................................................................................................... 15
6.4.8 Compound bond ........................................................................................................................................... 15
6.4.18 Element ...................................................................................................................................................... 16
6.4.19 Film microcircuit ......................................................................................................................................... 16
6.4.20 Final seal .................................................................................................................................................... 16
6.4.25 Inspection lot formation .............................................................................................................................. 17
iii
MIL-PRF-38534K
CONTENTS
PARAGRAPH
PAGE
6.4.26 Integral substrate/package ......................................................................................................................... 17
6.4.27 Known good die (KGD) .............................................................................................................................. 17
6.4.32 Non-continuous production ........................................................................................................................ 17
6.4.34 Package type ............................................................................................................................................. 17
6.4.35 Passive element ......................................................................................................................................... 17
6.4.38 Production lot ............................................................................................................................................. 17
6.4.39 Qualifying activity ....................................................................................................................................... 18
6.4.40 Quality function deployment (QFD) ............................................................................................................ 18
6.4.43 Similar devices ........................................................................................................................................... 18
6.4.44 Standard evaluation circuit (SEC) .............................................................................................................. 18
6.4.45 Statistical process control (SPC) ................................................................................................................ 18
6.7 Subject term (key work) listing .......................................................................................................................... 19
6.8 List of acronyms ................................................................................................................................................ 20
6.9 Change from previous issue.............................................................................................................................. 20
A.1.3 Description of appendix A .............................................................................................................................. 21
A.2.1 General .......................................................................................................................................................... 21
A.2.2 Government documents................................................................................................................................. 21
A.2.2.1 Specifications, standards, and handbooks................................................................................................ 21
A.2.4 Order of precedence ...................................................................................................................................... 22
A.3 QUALITY SYSTEM REQUIREMENTS ............................................................................................................... 22
A.3.2 Quality system ............................................................................................................................................... 22
A.3.2.1 QM plan .................................................................................................................................................... 22
A.3.2.1.5 Baseline index of documents ............................................................................................................... 23
A.3.2.5 QM program (TRB option) ........................................................................................................................ 24
iv
MIL-PRF-38534K
CONTENTS
PARAGRAPH
PAGE
A.3.2.5.1 General ................................................................................................................................................ 24
A.3.2.5.4 Alternative method correlation, confirmation, and implementation procedures .................................... 25
A.3.2.5.4.1 Correlation, confirmation, and implementation ................................................................................ 25
A.3.2.5.4.2 Alternative methods ........................................................................................................................ 26
A.3.2.5.4.2.1 Standard evaluation circuits (SEC) ............................................................................................ 26
A.3.2.5.4.2.2 Periodic assessment of alternative methods .............................................................................. 26
A.3.2.5.5 TRB records ......................................................................................................................................... 26
A.3.3 Conversion of customer requirements ........................................................................................................... 26
A.3.4.1 Changes in design, materials, or processing ............................................................................................ 27
A.3.5 Change control .............................................................................................................................................. 27
A.3.5.1 Configuration control ................................................................................................................................. 27
A.3.6 Control and acceptance of incoming materials .............................................................................................. 28
A.3.6.1 Supplier control program........................................................................................................................... 28
A.3.6.2 Incoming, in-process, and outgoing inventory control ............................................................................... 28
A.3.7 Customer supplied material ........................................................................................................................... 28
A.3.8.1 Material and element traceability .............................................................................................................. 28
A.3.8.3 Production lot traceability .......................................................................................................................... 28
A.3.8.4 Country of manufacture ............................................................................................................................ 28
A.3.8.5 Production lot identification ....................................................................................................................... 28
A.3.9 Process control .............................................................................................................................................. 29
A.3.9.1 Process and material controls................................................................................................................... 29
A.3.10 Inspection and testing .................................................................................................................................. 29
A.3.12 Examples of assembly and verification travelers ......................................................................................... 29
A.3.13 Failure and defect analysis and data feedback ............................................................................................ 30
A.3.13.1 Procedure in case of test equipment failure or operator error ................................................................. 30
A.3.13.1.1 Procedure for sample tests ................................................................................................................ 30
A.3.13.1.2 Procedure for screening tests ............................................................................................................ 30
A.3.13.2 Failure and corrective action reports ....................................................................................................... 30
A.3.14 Failure analysis and corrective action program............................................................................................ 30
A.3.14.1 Reports and analyses of defective devices and failure ........................................................................... 30
A.3.15 Atmospheric control and handling................................................................................................................ 30
A.3.15.1 ESD handling control program ................................................................................................................ 30
A.3.15.2 Cleanliness and atmosphere control in work areas ................................................................................ 31
A.3.16 Control of quality records ............................................................................................................................. 31
A.3.16.1 Records to be maintained ....................................................................................................................... 31
A.3.16.2 Altered records ....................................................................................................................................... 31
As the title says, when creating a task in UCOS, it returns OS_NO_MORE_TCB. At this time, only 9 tasks have been created, but it says there are no free TCBs. What should I do? There are still many tas...
[font=宋体][size=4][color=#000000]Good news! [/color][color=#ff0000]Atmel[/color][color=#000000]Microprocessor Technology Seminar will be held in mid-to-late November ([/color][url=http://components-asi...
I want to use PIC16F877A programming to complete such a "thing"-----there are two or three (connected to the port) voltage input {Ua, Ua+Ub, Ub, Ub+Uc, Uc, Uc+Ua, Ua, Ua+Ub.......) cycles. The duratio...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
In recent years, the government has increasingly supported electric vehicles, and the number of electric vehicles has increased. Observant drivers will notice that there are many more green license...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
introduction
As “energy conservation and emission reduction” has become an indicator of the National Economic Development Outline of the 11th Five-Year Plan, people’s awareness of green enviro...[Details]
In the scorching summer, electric fans are a must-have for cooling down people's homes. However, I believe most people have encountered this situation: the fan is plugged in, the switch is pressed,...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
Preface
Low-voltage motors are widely used in nonferrous metallurgical plants. Their abnormal operation not only impacts normal production but can also threaten human life. Therefore, providin...[Details]
There are many motors that can use thyristor speed control, and they can be used in almost all industries. Various types of motors, such as fans, pumps, AC motors, DC motors, torque motors, single-...[Details]
There are more and more electric vehicles. Recently, I have heard some news about electric vehicles performing poorly in winter. I would like to briefly introduce whether heat pump technology is mo...[Details]