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R5F52201BGFL#V0

Description
Microcontroller
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,107 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

R5F52201BGFL#V0 Overview

Microcontroller

R5F52201BGFL#V0 Parametric

Parameter NameAttribute value
Objectid7203384503
package instruction,
Reach Compliance Codecompliant
YTEOL1.48
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Datasheet
RX220 Group
Renesas MCUs
R01DS0130EJ0110
Rev.1.10
Dec 20, 2013
32-MHz 32-bit RX MCUs, 49 DMIPS, up to 256-KB flash memory,
12-bit A/D, ELC, MPC, IrDA, RTC, up to 7 comms channels;
incorporating functions for IEC60730 compliance
Features
32-bit RX CPU core
Max. operating frequency: 32 MHz
Capable of 49 DMIPS in operation at 32 MHz
Accumulator handles 64-bit results (for a single
instruction) from 32- × 32-bit operations
Multiplication and division unit handles 32- × 32-bit
operations (multiplication instructions take one CPU
clock cycle)
Fast interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions, ultra-compact code
On-chip debugging circuit
Low-power design and architecture
Operation from a single 1.62-V to 5.5-V supply
1.62-V operation available (at up to 8 MHz)
Three low-power modes
On-chip flash memory for code, no wait states
32-MHz operation, 31.25-ns read cycle
No wait states for reading at full CPU speed
Up to 256-Kbyte capacity
User code programmable via the SCI
Programmable at 1.62 V
For instructions and operands
On-chip data flash memory
8 Kbytes (Number of times of reprogramming: 100,000)
Erasing and programming impose no load on the CPU.
On-chip SRAM, no wait states
Up to 16-Kbyte size capacity
DMA
DMAC: Incorporates four channels
DTC: Four transfer modes
ELC
Module operation can be initiated by event signals
without going through interrupts.
Modules can operate while the CPU is sleeping.
Reset and supply management
Seven types of reset, including the power-on reset (POR)
Low voltage detection (LVD) with voltage settings
Clock functions
Frequency of external clock: Up to 20 MHz
Frequency of the oscillator for sub-clock generation:
32.768 kHz
On-chip low- and high-speed oscillators, dedicated on-
chip low-speed oscillator for the IWDT
Generation of a dedicated 32.768-kHz clock for the RTC
Clock frequency accuracy measurement circuit (CAC)
Real-time clock
Adjustment functions (30 seconds, leap year, and error)
Year and month display or 32-bit second display (binary
counter) is selectable
PLQP0100KB-A
PLQP0064KB-A
PLQP0048KB-A
PLQP0064GA-A
14 × 14 mm, 0.5-mm pitch
10 × 10 mm, 0.5-mm pitch
7 × 7 mm, 0.5-mm pitch
14 × 14 mm, 0.8-mm pitch
Independent watchdog timer
125-kHz on-chip oscillator produces a dedicated clock
signal to drive IWDT operation.
Useful functions for IEC60730 compliance
Self-diagnostic and disconnection-detection assistance
functions for the A/D converter, clock-frequency
accuracy-measurement circuit, independent watchdog
timer, functions to assist in RAM testing, etc.
Up to seven communications channels
SCI with many useful functions (up to five channels)
Asynchronous mode, clock synchronous mode, smart
card interface mode
IrDA Interface (one channel, in cooperation with the
SCI5)
I
2
C bus interface: Transfer at up to 400 kbps, capable of
SMBus operation (one channel)
RSPI (one channel)
Up to 14 extended-function timers
16-bit MTU: input capture, output capture,
complementary PWM output, phase counting mode
(six channels)
8-bit TMR (four channels)
16-bit compare-match timers (four channels)
12-bit A/D converter
Capable of conversion within 1.56
μs
Self-diagnostic function and analog input disconnection
detection assistance function
Analog comparator
General I/O ports
5-V tolerant, open drain, input pull-up, switching of
driving ability
MPC
Multiple locations are selectable for I/O pins of
peripheral functions
Operating temp. range
 40C
to +85C
 40C
to +105C
R01DS0130EJ0110 Rev.1.10
Dec 20, 2013
Page 1 of 105
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