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74ALVC244BQ-G

Description
Buffer and line driver 2.5/3.3voct buf/dvr N-inv 3-S
Categorysemiconductor    logic   
File Size90KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74ALVC244BQ-G Overview

Buffer and line driver 2.5/3.3voct buf/dvr N-inv 3-S

74ALVC244BQ-G Parametric

Parameter NameAttribute value
MakerNXP
Product CategoryBuffers and Line Drivers
RoHSyes
logic seriesALVC
logical typeCMOS
Number of channels per chipOctal
polarityNon-Inverting
Supply voltage (maximum)3.6 V
Supply voltage (minimum)1.65 V
Maximum operating temperature+ 85 C
Minimum operating temperature- 40 C
Installation styleSMD/SMT
Package/boxSOT-764
EncapsulationReel
High level output current- 24 mA
Input bias current (maximum value)20 uA
Low level output current24 mA
Output type3-State
propagation delay time2.3 ns (Typ) @ 2.7 V
INTEGRATED CIRCUITS
DATA SHEET
74ALVC244
Octal buffer/line driver; 3-state
Product specification
Supersedes data of 2003 Aug 11
2003 Sep 08

74ALVC244BQ-G Related Products

74ALVC244BQ-G 74ALVC244D-T 935273548115 74ALVC244BQ
Description Buffer and line driver 2.5/3.3voct buf/dvr N-inv 3-S Buffer and line driver 2.5/3.3voct buf/dvr N-inv 3-S ALVC/VCX/A SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 IC ALVC/VCX/A SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20, Bus Driver/Transceiver
Maker NXP NXP NXP NXP
Maximum operating temperature + 85 C 85 °C 85 °C 85 °C
Minimum operating temperature - 40 C -40 °C -40 °C -40 °C
package instruction - SOP, HVQCCN, HVQCCN, LCC20,.1X.18,20
Reach Compliance Code - unknow unknown compliant
series - ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A
JESD-30 code - R-PDSO-G20 R-PQCC-N20 R-PQCC-N20
JESD-609 code - e4 e4 e4
length - 12.8 mm 4.5 mm 4.5 mm
Logic integrated circuit type - BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits - 4 4 4
Number of functions - 2 2 2
Number of ports - 2 2 2
Number of terminals - 20 20 20
Output characteristics - 3-STATE 3-STATE 3-STATE
Output polarity - TRUE TRUE TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP HVQCCN HVQCCN
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
propagation delay (tpd) - 4.4 ns 4.4 ns 4.4 ns
Maximum seat height - 2.65 mm 1 mm 1 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) - 1.8 V 1.8 V 1.8 V
surface mount - YES YES YES
technology - CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form - GULL WING NO LEAD NO LEAD
Terminal pitch - 1.27 mm 0.5 mm 0.5 mm
Terminal location - DUAL QUAD QUAD
width - 7.5 mm 2.5 mm 2.5 mm
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