TaNFilm
®
Small Outline Surface
Mount Resistor Network
GUB Series
•
•
•
•
•
Thin film on ceramic technology
0.220” and 0.300” sizes available
RoHS compliant version available
DESC 87012 and 87013 available
Standard JEDEC packages for automatic placement equipment
Compliant leads to
compensate for
thermal expansion
and contractions.
IRC Advanced Film Division
Ultra precision tantalum
nitride resistance element
on high purity alumina.
Rugged, molded
construction.
IRC’s TaNFilm®, Small Outline Integrated Circuit resistor networks are ideally suited for surface mounting.
The 0.05 inch lead spacing provides higher lead density, increased component count, lower installed resistor
cost, and better reliability. They are ideally suited for the latest surface mount assembly techniques, and each
lead can be 100% visually inspected. The compliant leads relieve thermal expansion and contraction stressed
created by soldering and temperature excursions.
The tantalum nitride film system provides precision tolerance, exceptional TCR tracking, and low noise.
TaNFilm® provides stability, high reliability, and long life characteristics. Testing has demonstrated performance
exceeding MIL-PRF-83401 characteristics H.
Electrical Data
GM Type
Resistance Range (Ω)
GL Type
Absolute Tolerance
Ratio Tolerance To R1
TCR (ppm/°C)
TCR Tracking To R1 (ppm°C)
Operating Temperature Range
Noise
Substrate
Custom circuits and special testing available.
Schem A: 10 to 200K
Schem B: 10 to 1000K
Schem A: 10 to 150K
Schem B: 10 to 75K
Available to ±0.1%
Available to ±0.05%
±25, ±50, ±100
±5
-55°C to +125°C
Less than -25 dB
High purity alumina substrate
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
GUB Series Issue November 2008 Sheet 1 of 3
TaNFilm® Small Outline Surface
Mount Resistor Network
Power Dissipation Data (watts @ 70°C)
Schematic A
Per Resistor
GM Series 14-pin
GM Series 16-pin
GL Series 16-pin
Gl Series 20-pin
0.16W
0.16W
0.16W
0.16W
Per Package
1.0W
1.2W
1.2W
1.5W
IRC Advanced Film Division
Schematic B
Per Resistor
0.08W
0.08W
0.10W
0.10W
Per Package
1.0W
1.2W
1.2W
1.5W
Power Derating Curve
100
% Of Rated Power
60
0
25
70
125
Ambient Temperature (°C)
Ordering Data
Prefix
Model
GM7A
GM7ALF
GM7B
GM7BLF
GM8A
GM8ALF
GM8B
GM8BLF
GL8A
GL8ALF
GL8B
GL8BLF
GL0A
GL0ALF
GL0B
GL0BLF
- 14-pin 0.220” wide body, schematic A, 60/40 Sn/Pb leads
- 14-pin, 0.220” wide body, schematic A, RoHS compliant leads
- 14-pin 0.220” wide body, schematic B, 60/40 Sn/Pb leads
- 14-pin, 0.220” wide body, schematic B, RoHS compliant leads
- 16-pin 0.220” wide body, schematic A, 60/40 Sn/Pb leads
- 16-pin, 0.220” wide body, schematic A, RoHS compliant leads
- 16-pin 0.220” wide body, schematic B, 60/40 Sn/Pb leads
- 16-pin, 0.220” wide body, schematic B, RoHS compliant leads
- 16-pin 0.300” wide body, schematic A, 60/40 Sn/Pb leads
- 16-pin, 0.300” wide body, schematic A, RoHS compliant leads
- 16-pin 300” wide body, schematic B, 60/40 Sn/Pb leads
- 16-pin, 0.300” wide body, schematic B, RoHS compliant leads
- 20-pin 0.300” wide body, schematic A, 60/40 Sn/Pb leads
- 20-pin, 0.300” wide body, schematic A, RoHS compliant leads
- 20-pin 0.300” wide body, schematic B, 60/40 Sn/Pb leads
- 20-pin, 0.300” wide body, schematic B, RoHS compliant leads
GUB
-
GM8A
-
03
-
2001
-
B
-
A
TCR Code (ppm/°C)
Resistance code
01 = ±100; 02 = ±50; 03 = ±25
Standard MIL resistance code (e.g. 1002 = 10KΩ; 50R1=50.1Ω)
Absolute tolerance
J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ± 0.10%
Ratio tolerance to R1 (if specified)
F = ±1%; D = ±0.5%; C = ±0.25%; B = ± 0.1%; A = ±0.05%
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
GUB Series Issue November 2008 Sheet 3 of 3
Wireless Connectivity
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