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CHPHT2010K2050FNPT

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.1 W, 1 %, 100 ppm, 205 ohm, SURFACE MOUNT, 2010, CHIP, HALOGEN FREE AND ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size89KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

CHPHT2010K2050FNPT Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.1 W, 1 %, 100 ppm, 205 ohm, SURFACE MOUNT, 2010, CHIP, HALOGEN FREE AND ROHS COMPLIANT

CHPHT2010K2050FNPT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1099582027
package instruction, 2010
Reach Compliance Codeunknown
Country Of OriginFrance
ECCN codeEAR99
YTEOL7.8
Other featuresHIGH PRECISION
JESD-609 codee2
Manufacturer's serial numberCHPHT
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTAPE, PAPER
Rated power dissipation(P)0.1 W
Rated temperature230 °C
resistance205 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Silver (Sn/Ag) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
CHPHT
www.vishay.com
Vishay Sfernice
High Temperature (245 °C) Thick Film Chip Resistor
FEATURES
• High temperature (245 °C)
• Large ohmic value range 0.1
to 100 M
• Operating temperature range
(- 55 °C to + 230 °C)
• SMD wraparound chip resistor
• Storage temperature range
(- 55 °C to + 245 °C)
For applications such as down hole applications or aircraft
breaking systems, the need for parts able to withstand very
severe conditions (temperature as high as 230 °C powered
or up to 245 °C un-powered) has leaded Vishay Sfernice to
push out the limit of the thick film technology. Designers
might read the application note “Power Dissipation
Considerations in High Precision Vishay Sfernice Thin Film
Chips Resistors and Arrays (P, PRA etc.) (High Temperature
Applications)” (www.vishay.com/doc?53047) in conjunction
with this data sheet to help them to properly design their
PCBs and get the best performances of the CHPHT.
Vishay Sfernice R&D engineers will be willing to support any
customer design considerations.
• Gold terminations for HMP process (< 1 μm thick) for
temperature up to 245 °C
• Tin/silver terminations for operating temperature up to
200 °C
• Compliant to RoHS Directive 2002/95/EC
• Halogen-free according to IEC 61249-2-21 definition
Note
*
Pb containing terminations are not RoHS compliant, exemptions
may apply
DIMENSIONS
in millimeters
D
C
B
E
A
CASE SIZE
0603
0805
1206
2010
A
± 0.152
1.60
1.85
3.00
5.03
B
± 0.127
0.90
1.25
1.73
2.64
C
± 0.127
0.38
0.38
0.38
0.50
D
± 0.127
0.31
0.31
0.40
0.50
E
± 0.127
0.40
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A)
G
min.
X
max.
Z
max.
CASE SIZE
0603
0805
1206
2010
Revision: 16-Nov-11
Z
max.
2.15
2.70
3.85
5.88
G
min.
0.39
0.44
1.59
3.62
X
max.
1.03
1.38
1.85
2.77
Document Number: 52032
1
For technical questions, contact:
sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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