A3P030-2QNG48 datasheet, PDF - EEWORLD Datasheet

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A3P030-2QNG48: Descriptionfpga - field programmable gate array 30k system gates; CategoryProgrammable logic devices Programmable logic; File Size7MB，218 Pages; ManufacturerActel; Websitehttp://www.actel.com/; Environmental Compliance

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A3P030-2QNG48 Overview

fpga - field programmable gate array 30k system gates

A3P030-2QNG48 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Actel
package instruction	8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-48
Reach Compliance Code	compliant
maximum clock frequency	350 MHz
JESD-30 code	S-XQCC-N48
JESD-609 code	e3
length	6 mm
Configurable number of logic blocks	768
Equivalent number of gates	30000
Number of entries	34
Number of logical units	768
Output times	34
Number of terminals	48
Maximum operating temperature	70 °C
Minimum operating temperature
organize	768 CLBS, 30000 GATES
Package body material	UNSPECIFIED
encapsulated code	HQCCN
Encapsulate equivalent code	LCC48,.24SQ,16
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	260
power supply	1.5,1.5/3.3 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	6 mm

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Revision 9

ProASIC3 Flash Family FPGAs

with Optional Soft ARM Support

Features and Benefits

High Capacity

• 15 k to 1 M System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Live at Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

†

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption (except ARM

-enabled ProASIC

devices) via JTAG (IEEE 1532–compliant)

†

• FlashLock

to Secure FPGA Contents

Clock Conditioning Circuit (CCC) and PLL

†

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X

†

and LVCMOS

2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os

‡

• Programmable Output Slew Rate

†

and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities

and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations)

†

• True Dual-Port SRAM (except ×18)

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

Embedded Memory

†

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

ARM Processor Support in ProASIC3 FPGAs

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• M1 ProASIC3 Devices—ARM

Cortex™-M1 Soft Processor

Available with or without Debug

Table 1 • ProASIC3 Product Family

ProASIC3 Devices

Cortex-M1 Devices

System Gates

Typical Equivalent Macrocells

VersaTiles (D-flip-flops)

RAM Kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP 2

Integrated PLL in CCCs

VersaNet Globals 3

I/O Banks

Maximum User I/Os

Package Pins

QFN

VQFP

TQFP

PQFP

FBGA

A3P015

15,000

128

384

–

QN68

A3P030

30,000

256

768

–

QN48, QN68,

QN132

VQ100

A3P060

60,000

512

1,536

Yes

QN132

CS121

VQ100

TQ144

FG144

A3P125

125,000

1,024

3,072

Yes

133

QN132

VQ100

TQ144

PQ208

FG144

A3P250

M1A3P250

250,000

2,048

6,144

Yes

157

QN132

VQ100

PQ208

FG144/256

FG144/256/

484

PQ208

FG144/256/

484

PQ208

FG144/256/

484

A3P400

M1A3P400

400,000

–

9,216

Yes

194

A3P600

M1A3P600

600,000

–

13,824

108

Yes

235

A3P1000

M1A3P1000

1,000,000

–

24,576

144

Yes

300

Notes:

1. Refer to the

Cortex-M1

product brief for more information.

2. AES is not available for Cortex-M1 ProASIC3 devices.

3. Six chip (main) and three quadrant global networks are available for A3P060 and above.

4. For higher densities and support of additional features, refer to the

ProASIC3E Flash Family FPGAs

datasheet.

5. The M1A3P250 device does not support this package.

† A3P015 and A3P030 devices do not support this feature.

October 2009

‡ Supported only by A3P015 and A3P030 devices.

ProASIC3 Flash Family FPGAs

Table of Contents

ProASIC3 Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3 DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-83

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-87

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-92

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-94

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-111

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-112

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-112

Package Pin Assignments

48-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

68-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

132-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6

121-Pin CSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15

100-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

144-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23

208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28

144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-39

256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-52

484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-65

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10

Revision 9

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