A3P1000L-FG256YI datasheet, PDF

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A3P1000L-FG256YI: DescriptionField Programmable Gate Array, 250MHz, 24576-Cell, CMOS, PBGA256,; CategoryProgrammable logic devices Programmable logic; File Size11MB，242 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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A3P1000L-FG256YI Overview

Field Programmable Gate Array, 250MHz, 24576-Cell, CMOS, PBGA256,

A3P1000L-FG256YI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	BGA, BGA256,16X16,40
Reach Compliance Code	unknown
maximum clock frequency	250 MHz
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
Humidity sensitivity level	3
Number of entries	177
Number of logical units	24576
Output times	177
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	1.2/1.5,1.2/3.3 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
Base Number Matches	1

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Revision 13

ProASIC3L Low Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Low Power

• Dramatic Reduction in Dynamic and Static Power Savings

• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power

• Low Power Consumption in Flash*Freeze Mode Allows for

Instantaneous Entry to / Exit from Low-Power Flash*Freeze

Mode

• Supports Single-Voltage System Operation

• Low-Impedance Switches

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and

LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II (A3PE3000L only)

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Wide Range Power Supply Voltage Support per JESD8-12,

Allowing I/Os to Operate from 1.14 V to 1.575 V

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold-Sparing I/Os Programmable Output

Slew Rate and Drive Strength

• Programmable Input Delay (A3PE3000L only)

• Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC

3L Family

(except PQ208)

High Capacity

• 250,000 to 3,000,000 System Gates

• Up to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System

Performance

• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit

PCI (1.2 V systems)

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, One with Integrated PLL (ProASIC3L) and All

with Integrated PLL (ProASIC3EL)

• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,

and External Feedback

• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V

systems) and 350 MHz (1.5 V systems))

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard

(AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

to Secure FPGA Contents

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous

Operation:

– 250 MHz: For 1.2 V systems

– 350 MHz: For 1.5 V systems

• ARM Cortex™-M1 Soft Processor Available with or without

Debug

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization

Advanced and Pro (Professional) I/Os

• 700 Mbps DDR, LVDS-Capable I/Os

• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—up to 8 Banks per Chip

ARM

Processor Support in ProASIC3L FPGAs

Table 1 • ProASIC3 Low-Power Product Family

ProASIC3L Devices

A3P250L

A3P600L

M1A3P600L

A3P1000L

M1A3P1000L

A3PE3000L

M1A3PE3000L

ARM Cortex-M1

Devices

System Gates

VersaTiles (D-flip-flops)

RAM Kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP

Integrated PLL in CCCs

VersaNet Globals

I/O Banks

Maximum User I/Os

Package Pins

VQFP

PQFP

FBGA

250,000

6,144

Yes

157

VQ100

PQ208

FG144, FG256

600,000

13,824

108

Yes

235

PQ208

FG144, FG256, FG484

1,000,000

24,576

144

Yes

300

PQ208

FG144, FG256, FG484

3,000,000

75,264

504

112

Yes

620

PQ208

FG324, FG484, FG896

Notes:

1. Refer to the

Cortex-M1

product brief for more information.

2. AES is not available for ARM Cortex-M1 ProASIC3L devices.

3. For the A3PE3000L, the PQ208 package has six CCCs and two PLLs.

January 2013

ProASIC3L Low Power Flash FPGAs

Table of Contents

ProASIC3L Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3L DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-121

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-127

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-132

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-134

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-148

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-149

Pin Descriptions and Packaging

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1

3-2

3-4

3-5

Package Pin Assignments

VQ100

PQ208

FG144

FG256

FG324

FG484

FG896

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-29

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-50

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

R ev i si o n 1 3

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